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顺序层压法制备聚合物基复合材料及其介电性能的研究
引用本文:姚军龙,高琳,万军.顺序层压法制备聚合物基复合材料及其介电性能的研究[J].胶体与聚合物,2010,28(4):164-166,170.
作者姓名:姚军龙  高琳  万军
作者单位:[1]武汉工程大学材料科学与工程学院,武汉430073 [2]江汉大学化学与环境工程学院,武汉430056 [3]武汉市第二十九中学,武汉430030
基金项目:武汉工程大学科学研究基金
摘    要:将马来酸酐-乙酸乙烯酯共聚物与压电陶瓷粉末在溶液中进行混合并制备出单层聚合物基薄膜;将单层聚合物基薄膜进行有序层叠热压制备系列多层聚合物基复合膜或片材。采用介电频谱仪对复合材料介电性能进行研究,结果表明,复合材料介电常数最初随复合层数的增加而降低,在复合层数达到8层时,介电常数增加并达到最大值,介电损耗降至最低值。表面微观形貌分析表明复合材料随层压次数增加而分布更均匀,各相之间连接更紧密。顺序层压法可以改善复合材料内部连接和致密性,提高复合材料的介电常数并降低介电损耗。

关 键 词:多层热压  介电常数  复合材料  界面连接

Preparation and Dielectric Properties of PZT/VAMA Composites Achieved by Bottom-up Hot-pressing Technology
YAO Junlong,GAO Lin,WAN Jun.Preparation and Dielectric Properties of PZT/VAMA Composites Achieved by Bottom-up Hot-pressing Technology[J].Chinese Journal of Colloid and Polymer,2010,28(4):164-166,170.
Authors:YAO Junlong  GAO Lin  WAN Jun
Affiliation:1 School of Materials Science and Technology Wuhan Institute of Technology 430073;2 School of Chemistry and Environmental Engineering Jianghan University 430056;3 Wuhan No.29 middle school Wuhan 430030)
Abstract:A copolymer(VAMA) containing maleic anhydride has been synthesized by using maleic anhydride,vinyl acetate as monomers,and the corresponding lead zirconate titanate(PZT)/VAMA composite membrane was prepared by sufficiently blending in acetone solution.2,4,8 layers composite membranes were prepared by using bottom-up hot-pressing technology.The dielectric constant of composite membranes decreased with increasing of layer number at first,and is higher than that of monolayer membrane with further increasing of layer number.The dielectric loss of composite membranes was reverse with variation of dielectric constant,and the dielectric loss of 8-layer membrane was lower than that of monolayer.The interior structure of 8-layer composite membrane is more compact than that of monolayer due to sufficient interface adhesion in SEM.The multi-layer hot-pressing technology improved interface adhesion and dielectric properties of PZT/VAMA composites
Keywords:Multi-Layer Hot-Expressing  Dielectric Constant  Composite  Interface Adhesion
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