Electrical characteristics of Ge-based metal-insulator-semiconductor devices with Ge3N4 dielectrics formed by plasma nitridation

We have fabricated pure germanium nitrides (Ge3N4) using high-density plasma nitridation and investigated electrical properties of Au/Ge3N4/Ge capacitors. We achieved equivalent oxide thickness (EOT) of 1.4 nm, and dielectric constant of Ge3N4 was estimated to be 9.7. The gate leakage current density of 4.3 A/cm2 in the accumulation condition at V(fb)-1 V, where V(fb) is the flatband voltage, was one order of magnitude lower than that of conventional poly-Si/SiO2/Si stacks. The interface state density (D(it)) of Ge3N4/Ge interfaces evaluated by a low-temperature conductance method exhibited a minimum value of 9.4 x 10(11) cm(-2)eV(-1) at E - E(v) = 0.27 eV. Furthermore, the insulating property and interface quality of Ge3N4/Ge system was found to be thermally stable up to 650 degrees C. These results indicate that Ge3N4 is a promising candidate for either a gate insulator or an interfacial layer under high-k dielectrics for Ge-MIS devices.