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功率型LED瞬态温度场及热应力分布的研究
引用本文:朱旭平,余桂英,丁纾姝,胡书红.功率型LED瞬态温度场及热应力分布的研究[J].光电工程,2011,38(2):132-137.
作者姓名:朱旭平  余桂英  丁纾姝  胡书红
作者单位:中国计量学院,计量测试工程学院,杭州,310018
基金项目:浙江省自然科学基金,浙江省科技计划项目,浙江省研究生教育创新示范基地支持项目
摘    要:针对功率型LED器件的热特性,以热应力理论为依据,采用有限元软件ANSYS进行热应力计算,得到了Lumileds的1 W LED瞬态温度场和应力场分布云图,基板顶面平行于X轴路径上的热应力,应变及剪应力的分布曲线.模拟结果表明最大应力集中在键合层边角处;轴向最大位移在透镜与热沉接触边缘;最大剪应力集中在键合层的边角区域...

关 键 词:功率型LED  温度场  热应力  ANSYS

Transient Temperature Field and Thermal Stress of High Power LED
ZHU Xu-ping,YU Gui-ying,DING Shu-shu,HU Shu-hong.Transient Temperature Field and Thermal Stress of High Power LED[J].Opto-Electronic Engineering,2011,38(2):132-137.
Authors:ZHU Xu-ping  YU Gui-ying  DING Shu-shu  HU Shu-hong
Affiliation:ZHU Xu-ping,YU Gui-ying,DING Shu-shu,HU Shu-hong(College of Metrology and Measurement Engineering,China Jiliang University,Hangzhou 310018,China)
Abstract:Thermal characterization of high-power Lighting Emitting Diode(LED) device was reported,utilizing finite element software ANSYS with thermal stress analysis based on the thermal stress theory,and the transient temperature and stress field were obtained.The thermal stress,displacement and shear stress distribution on the path which was parallel with X axis at the top of LED substrate were calculated.The simulation results indicated that the maximum von mises stress was at the corner of the thermal sink and d...
Keywords:ANSYS
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