The effect of processing parameters on the bond strength and electrical conductivity of multi-wall carbon nanotube/low-density polyethylene composite |
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Authors: | Felicia Stan Daniel Dobrea Catalin Fetecau Relu Belea |
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Affiliation: | Dunarea de Jos University of Galati, Faculty of Mechanical Engineering , 47 Domneasca, 800 008 , Galati , Romania |
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Abstract: | The objective of this paper is to study the influence of processing parameters, such as melt temperature and mold temperature, on the adhesion of low density polyethylene (LDPE) to 2.5?wt/% multi-wall carbon nanotube-filled polyethylene (LDPE/MWCNT). The adhesion was obtained using two-component injection-molding method and measured using tensile experiments. The electrical conductivity of the two-component injection-molded specimens was also measured through DC voltage and compared to the volume resistivity of the LDPE and LDPE/MWCNT composite. It was found that the bond strength increases with increasing melt and mold temperatures. However, increasing the melt and mold temperatures over a certain limit can decrease the bond strength. The range of the electrical conductivity of the LDPE-LDPE/MWCNT two-component injection-molded samples was in the range of dissipative materials. |
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Keywords: | adhesion multi-wall carbon nanotube polyethylene overmolding mechanical properties electrical conductivity |
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