石墨粉化学镀铜工艺的研究

在石墨粉表面化学镀铜,以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能.由于石墨粉具有微小疏水、表面惰性的性质,对其镀铜很困难.以CuSO4为主盐,锌粉为还原剂,分别研究了4种添加剂:A(烷基苯磺酸盐)、B(烷基磺酸盐)、C(十二烷基脂肪酸盐)和D(十二烷基脂肪酸盐 醋酸钠)对石墨粉镀铜的影响.结果表明,D型添加剂最有利于石墨粉化学镀铜;扫描电镜观察镀铜石墨层发现,镀层和石墨结合良好.

Electroless Copper Plating Technology for Graphite Powder

Electroless copper plating was Used for graphite powder to solve the interface problem in metal7 graphite composite material manufacture and improve its comprehensive properties. But it was difficult to acquire graphite powder coated with copper because graphite powder was minuteness, hydrophobic and surface inert material. The effects of four kinds of additives such as A (alkyl benzene sulphonate),B (alkyl sulphonate), C (dodecyl fatty salt) and D (dodecyl fatty salt + sodium acetate ) on the copper plating on graphite powder were investigated respectively when bluestone was used as a main salt and zinc as reducing agent. The results show that additive D is the best one for copper plating, and the adhesion of copper plating and graphite powder is better observed by SEM.