Ti(C,N)-Al2O3陶瓷基复合材料与40Cr钢辅助脉冲电流液相扩散连接

采用辅助脉冲电流液相扩散连接方法,对Ti(C,N)-Al₂O₃陶瓷基复合材料与40Cr钢进行了焊接试验,重点研究了在一定加热温度和保温时间条件下脉冲电流对界面元素分布、相结构、反应层厚度以及接头强度的影响规律.结果表明,辅助脉冲电流液相扩散连接可以实现Ti(C,N)-Al₂O₃陶瓷基复合材料的冶金结合,保温时间对焊接接头强度影响不明显,四点弯曲强度数据普遍处于146~180 MPa之间;在脉冲电流作用下,焊缝熔体中原子扩散行为、扩散路径以及扩散速率将发生显著变化,利用该特性,有助于改变界面金属间化合物的生长特性,控制焊缝中低熔点共晶组织含量,进而达到改善和提高焊接接头强度的效果.

Pulse current auxiliary liquid diffusion bonding between Ti (C,N)-Al203 CMC and 40Cr steel

Diffusion bonding behavior between Ti(C,N)-Al₂0₃ ceramic matrix composites (CMC) and 40Cr steel was investigated using pulse current auxiliary liquid diffusion bonding process. The effect of aided pulse current and holding time during diffusion bonding on the element distribution, phase structure and thickness of the reactive layer at the interface was characterized. The results show that aided pulse current during diffusion bonding promoted the metallurgical bonding between CMC and 40Cr steel. The corresponding joint strength was about 146~180 MPa and was not obviously affected by the holding time during bonding. The diffusion path and rate of atoms at the interface were apparently changed by the loading of pulse current during diffusion bonding. Consequently, the growth of interfacial inter-metallic compounds and the content of low melting point eutectic phases could be controlled to improve the joint strength.