| Al2O3弥散铜/纯铜扩散焊工艺 |
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| 引用本文： | 陈健,崔庭. Al2O3弥散铜/纯铜扩散焊工艺[J]. 焊接技术, 2012, 41(1): 28-31,2 |
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| 作者姓名： | 陈健 崔庭 |
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| 作者单位： | 江苏科技大学先进焊接技术省级重点实验室,江苏镇江,212003 |
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| 基金项目： | 江苏省高校优势学科建设工程资助项目 |
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| 摘 要： | 采用真空扩散连接工艺,对Al2O3弥散强化铜/纯铜的连接进行了试验研究.用扫描电镜分析了Al2O3弥散强化铜/纯铜扩散界面组织结构,研究了工艺参数对界面结合状态和组织结构的影响.通过正交试验得出各因素对接头抗拉强度的影响大小依次为:扩散温度＞压力＞保温时间.正交试验结果表明:焊接温度为550℃,保温时间为3h,压力为25 MPa时,可获得组织均匀致密、界面连续的Al2弥散铜/纯铜扩散焊接头,且接头抗拉强度高达116.9 MPa.
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| 关 键 词： | Al2O3弥散铜 纯铜 真空扩散焊 正交试验 |
Diffusion welding technology of Al2O3 dispersion,strengthen copper/copper |
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| CHEN Jian,CUI Ting. Diffusion welding technology of Al2O3 dispersion,strengthen copper/copper[J]. Welding Technology, 2012, 41(1): 28-31,2 |
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| Authors: | CHEN Jian CUI Ting |
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| Affiliation: | (Provincial Laboratory of Advanced Welding Technology,Jiangsu University of Science and Technology,Zhenjiang 212003,Jiangsu pro.,China) |
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| Abstract: | Al2O3 dispersion,strengthen copper and copper were bonded together by vacuum diffusion welding technology.The microstructure feature of the joints interface were investigated by scanning electron microscope.The influence of diffusion welding parameters on interface combining state and microstructure of Al2O3 dispersion,strengthen copper/copper interface were studied.Through orthogonal experiment,the effect order of three factors was as follows:diffusion temperature>pressure>holding time.The experiment results showed that when diffusion temperature was 550 ℃,holding time was 3 h,pressure was 25 MPa,the joint of Al2O3 dispersion,strengthen copper/copper was compact structure and the interface was continuous.The tensile strength of joint was up to 116.9 MPa. |
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| Keywords: | Al2O3 dispersion strengthen copper copper vacuum diffusion welding orthogonal experiment |
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