氰酸酯环氧双马来酰亚胺基胶粘剂的苯并噁嗪改性研究

以苯并噁嗪(BZ)作为氰酸酯(CE)-环氧树脂(EP)-双马来酰亚胺(BMI)基胶粘剂的改性剂,探讨了BZ含量对改性胶粘剂的力学性能、介电性能、耐热性、耐水性和可操作性等影响。结果表明:当w(BZ)=2%时,改性胶粘剂的综合性能较好,其常温剪切强度(24.98 MPa)和高温(200℃)剪切强度(21.24 MPa)分别比未改性胶粘剂提高了16.9%和32.7%、介电系数低于3.0、吸水25 h后的吸水率仍低于1.2%且耐热性能未受到影响;170℃时凝胶时间为71 min,说明改性胶粘剂的可操作性较强,并且满足使用期的要求;改性胶粘剂在电子电器行业中具有良好的应用前景。

Study on CE-EP-BMI base adhesive modified by benzoxazine

With benzoxazine(BZ) as modifier of CE-EP-BMI(cyanate ester-epoxy resin-bismaleimide) base adhesive,the influences of BZ contents were discussed on mechanics properties,dielectric properties,heat resistance,water resistance and maneuverability of modified adhesive.The result showed that the modified adhesive had better combination property because the shear strength(24.98 MPa) at room temperature and shear strength(21.24 MPa) at high temperature(200 ℃) of modified adhesive were 16.9% and 32.7% more than those of unmodified adhesive,dielectric coefficient was less than 3.0,water absorption after 25 h in boiling water was still less than 1.2%,and heat resistance was not affected when mass fraction of BZ was 2%.The modified adhesive had better maneuverability and could meet requirements of applicable period because its gelation time at 170 ℃ was 71 min.The modified adhesive had good application prospect in electrical and electronic equipment industry.