二氨基二苯砜固化环氧树脂的促进剂研究 |
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引用本文: | 唐卿珂,;梁国正,;易强,;肖升高,;黄琴琴. 二氨基二苯砜固化环氧树脂的促进剂研究[J]. 印制电路信息, 2014, 0(8): 18-20 |
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作者姓名: | 唐卿珂, 梁国正, 易强, 肖升高, 黄琴琴 |
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作者单位: | [1]苏州大学材料与化学化工学部,江苏苏州215123; [2]苏州生益科技有限公司,江苏苏州215024 |
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摘 要: | 二氨基二苯砜作为一种高耐热低吸湿的环氧树脂固化剂常用于覆铜板领域。研究了不同促进剂对二氨基二苯砜固化环氧树脂反应的影响,表明:2-乙基-4-甲基咪唑和三氟化硼单乙胺络合物,都对二氨基二苯砜固化环氧树脂有一定的促进作用,BF3·MEA可以降低体系的反应温度,提高固化速率;而2-乙基-4-甲基咪唑可以形成更完善的交联结构,具有更高的耐热性。
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关 键 词: | 覆铜板 固化促进剂 二氨基二苯砜 环氧树脂 |
Research on the curing accelerators of epoxy resin/DDS system |
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Affiliation: | TANG Qing-ke,LIANG Guo-zheng,YI Qiang,XIAO Sheng-gao,HUANG Qin-qin |
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Abstract: | Diaminodiphenylsulfone(DDS) is a kind of epoxy curing agent with good heat-resistance and low water absorption. The infiuence of the different curing accelerators on the reaction of epoxy/DDS system is investigated. The result show that both 2E4MZ and BF3.MEA can accelerate the reaction of the epoxy/DDS system. BF3.MEA decrease the reaction temperature and improve the curing rate, and 2E4MZ can form a better cross-linked structure and have a better heat resistance. |
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Keywords: | CCL Curing Accelerators DDS Epoxy |
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