| 片式元器件与SMT技术新进展 |
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| 引用本文： | 向勇,谢道华,张昊. 片式元器件与SMT技术新进展[J]. 电子工艺技术, 2001, 22(3): 93-95 |
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| 作者姓名： | 向勇 谢道华 张昊 |
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| 作者单位： | 天津大学电子信息工程学院, |
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| 摘 要： | 综述了片元器件与SMT技术的最新发展动态，重点讨论了现代信息产业全面促进电容类，电阻类，电感类片式元器件在体积微型化，结构复化等若干方面的新进展。
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| 关 键 词： | 片式元器件 SMT 电子元器件 |
| 文章编号： | 1001-3474(2001)03-0093-03 |
| 修稿时间： | 2001-03-01 |
The Advance in Chip Components and SMT |
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| XIANG Yong,XIE Dao-hua,ZHANG Hao. The Advance in Chip Components and SMT[J]. Electronics Process Technology, 2001, 22(3): 93-95 |
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| Authors: | XIANG Yong XIE Dao-hua ZHANG Hao |
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| Abstract: | The new advance in chip components and surface mounted technology (SMT) are summarized all over the world.The development is discussed that chip components size is on the decrease,including chip capacitors,resistors,inductors,due to modern IT and electronics industry demand.And it is focused that new chip trimmer components. |
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| Keywords: | Chip components SMT Miniaturization Arrays |
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