Characterization of electroplated bismuth-tin alloys for electrically conducting materials |
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Authors: | S K Kang S Buchwalter C Tsang |
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Affiliation: | (1) IBM T. J. Watson Research Center, P.O. Box 218, 10598 Yorktown Heights, NY;(2) MIT, Materials Science and Engineering Cambridge, 02139, MA |
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Abstract: | Electrically conducting adhesive materials are promising alternatives for lead (Pb)-containing solders in microelectronic
applications. However, most common silver-filled epoxy materials have various limitations to meet the requirements of the
solder joints yet. To overcome these limitations, several new formulations have been developed recently. Among them, a new
high conductivity Pb-free, conducting adhesive developed for low temperature applications has been previously reported. This
conducting adhesive contains a conducting copper filler powder coated with a low melting point metal or alloy, such as Sn
or BiSn alloys. The low melting point layer serves as a joining material among the filler particles as well as to the substrate.
In this paper, characterization of electroplated BiSn alloys on a Cu substrate is reported for their microstructure, electrical
properties, oxidation behavior, and others. The experimental results have provided a better understanding of the joining mechanism
of the newly developed Pb-free conductive adhesive materials. |
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Keywords: | Electrically conducting adhesives Pb-free solders silverfilled epoxy BiSn plating differential scanning calorimetry surface oxidation microstructural changes electrical resistivity |
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