Nanopatterned Contacts to GaN |
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Authors: | Ho Gyoung Kim Parijat Deb Tim Sands |
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Affiliation: | (1) Department of Physics, Purdue University, West Lafayette, IN 47907, USA;(2) School of Materials Engineering, Purdue University, West Lafayette, IN 47907, USA;(3) School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN 47907, USA;(4) Birck Nanotechnology Center, Purdue University, West Lafayette, IN 47907, USA |
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Abstract: | The effect of nanoscale patterning using a self-organized porous anodic alumina (PAA) mask on the electrical properties of
ohmic and Schottky contacts to n-GaN was investigated with the aim of evaluating this approach as a method for reducing the
specific contact resistance of ohmic contacts to GaN. The electrical characteristics of contacts to these nanopatterned GaN
samples were compared with contacts to planar, chemically prepared (“as-grown”) GaN samples and reactive ion etched (RIE)
GaN films without any patterning. The specific contact resistivities to unintentionally doped n-GaN using a Ti/Al bilayer
metallization were determined to be 7.4 × 10−3 Ω cm2 for the RIE sample and 7.0 × 10−4 Ω cm2 for the PAA patterned sample. Schottky metal contacts with Pt and Ni were prepared on the three samples to validate the effects
of RIE and nanopatterning on electrical behavior. The effective barrier height was decreased and the reverse current was increased
significantly in the PAA patterned sample. The radius of curvature of the nanoscale corrugation in the patterned interface
was smaller than the depletion width. The reduction of the depletion width at sharp corners enhanced the local tunneling current,
reducing the specific contact resistivity and decreasing the effective barrier height. These results suggest that nanopatterning
with PAA on GaN can significantly lower the contact resistance. |
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Keywords: | Porous anodic alumina (PAA) contact resistance Schottky barrier height tunneling current |
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