| 电子封装Cu键合丝的研究及应用 |
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| 引用本文： | 丁雨田,曹军,许广济,寇生中,胡勇.电子封装Cu键合丝的研究及应用[J].铸造技术,2006,27(9):971-974. |
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| 作者姓名： | 丁雨田 曹军 许广济 寇生中 胡勇 |
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| 作者单位： | 兰州理工大学甘肃省有色金属新材料省部共建国家重点实验室,甘肃,兰州,730005 |
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| 摘 要： | 论述了传统Au、Al-1%Si键合丝在电子封装中的局限性,分析了Cu键合丝优良的材料性能,Cu键合丝替代Au丝和Al-1%Si丝可缩小焊接间距,提高芯片频率和可靠性。并在此基础上阐述了单晶铜作为键合丝的优势,通过键合性能的对比显示了单晶铜键合丝在电子封装中的良好特性。
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| 关 键 词： | 电子封装 键合性能 Cu键合丝 单晶铜 |
| 文章编号： | 1000-8365(2006)09-0971-04 |
| 收稿时间： | 05 8 2006 12:00AM |
| 修稿时间： | 06 24 2006 12:00AM |
Research and Application of Copper Bonding Wire in Electronic Packaging |
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| DING Yu-tian,CAO Jun,XU Guang-ji,KOU Sheng-zhong,HU Yong.Research and Application of Copper Bonding Wire in Electronic Packaging[J].Foundry Technology,2006,27(9):971-974. |
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| Authors: | DING Yu-tian CAO Jun XU Guang-ji KOU Sheng-zhong HU Yong |
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| Affiliation: | State Key Laboratory of Gansu Advanced Nonferrous Materials, Lanzhou University of Technology, Lanzhou 730050, China |
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| Abstract: | The limitation of the conventional Au and Al-1%Si bonding wire in electronic packaging,and the excellent properties of copper bonding wire were reviewed.Cu bonding wire instead of gold bonding wire and aluminum bonding wire can shorten the bonding space,and improve the CMOS chip frequency and reliability. Moreover,the advantages of single crystal copper as bonding wire were discussed.The comparison result of bonding properties shows that copper bonding wire has excellent properties in electronic packaging. |
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| Keywords: | Electronic packaging Bonding property Copper bonding wire Single crystal copper |
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