| 硅-硅键合晶片在减薄过程中产生的应力及影响 |
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| 引用本文： | 杨国渝,冯建,吴建. 硅-硅键合晶片在减薄过程中产生的应力及影响[J]. 微电子学, 2002, 32(5): 395-396 |
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| 作者姓名： | 杨国渝 冯建 吴建 |
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| 作者单位： | 1. 中国电子科技集团公司,第二十四研究所;模拟集成电路国家重点实验室,重庆,400060
2. 模拟集成电路国家重点实验室,重庆,400060 |
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| 摘 要： | 硅-硅键合晶片在机械减薄过程中产生的应力使硅片产生弯曲变形,这种变形在其后的加工过程中会使图形发生扭曲或位移,导致硅片加工中途报废.经过应力消除处理后可以顺利完成加工.
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| 关 键 词： | 硅-硅键合 介质隔离 辐射加固 |
| 文章编号： | 1004-3365(2002)05-0395-02 |
| 修稿时间： | 2001-09-21 |
An Investigation into the Thinning Induced Stress in Wafer-to-Wafer Bonding and Its Effect |
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| YANG Guo yu ,,FENG Jian ,WU Jian. An Investigation into the Thinning Induced Stress in Wafer-to-Wafer Bonding and Its Effect[J]. Microelectronics, 2002, 32(5): 395-396 |
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| Authors: | YANG Guo yu FENG Jian WU Jian |
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| Affiliation: | YANG Guo yu 1,2,FENG Jian 2,WU Jian 2 |
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| Abstract: | Stress induced during mechanical thinning of wafer to wafer bonding would make the wafer bend and distort,which would cause patterns to be twisted or displaced.The thinning induced stress and its effcet are investigated in the paper. |
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| Keywords: | Wafer to wafer bonding Dielectric isolation Radiation hardening |
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