Thermal analysis of LED lighting system with different fin heat sinks |
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| Authors: | Hou Fengze Yang Daoguo Zhang Guoqi |
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| Affiliation: | 1. School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China
2. School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China;Philips Lighting, Eindhoven, the Netherlands |
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| Abstract: | This paper designs a 3×3 light emitting diode (LED) array with a total power of 9 W, presents a thermal analysis of plate fin, in-line and staggered pin fin heat sinks for a high power LED lighting system, and develops a 3D one-fourth finite element (FE) model to predict the system temperature distribution. Three kinds of heat sinks are compared under the same conditions. It is found that LED chip junction temperature is 48.978℃ when the fins of heat sink are aligned alternately. |
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| Keywords: | LED thermal design LED array heat sink |
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