DSP--数字化时代的基因芯片

DSP是当今发展最为迅速的和最有发展前景的技术之一。与普通CPU和MCU相比 ,DSP在数字信号处理方面有着无可比拟的优势 ,特别适合网络、通信、控制等需要进行大量数字信号处理的应用场合。今天DSP已经成为通信、计算机、网络、工业控制以及家用电器等电子产品中不可或缺的基础器件 ,DSP在通信、计算机、网络、工业控制以及消费类电子产品等领域有着非常广泛的应用 ,本文阐述了DSP的特点、应用和市场以及DSP技术的发展前景。     

Tribotronics—Towards active tribology

A constant trend towards more compact mechanical systems with higher power densities and increased thermo-mechanical loads emphasises the importance of the development of new design approaches and novel tribological systems. Ignoring this may cause a significant slow down in technological and industrial development. Tribotronics or active tribology based on adaptive performance is thought of as being critical in the implementation of smart machine concepts. Recognition of the importance of tribotronics, or active control of system loss outputs, such as those through friction and wear will have significant beneficial economic consequences as a result of the associated accelerated rate of technological progress. These smart tribotronic systems can be embedded in a great variety of machines and mechanisms. If this integration is made at the design stage, products that are more flexible, efficient and reliable can be produced. The concept of tribotronics is presented and discussed in this paper. Some illustrative examples that show the feasibility of an “active” approach are given. In addition, various possibilities already reported in literature are discussed.     

构建S3C4510B嵌入式系统的开发应用平台

利用三星公司生产的S3CA510B这款32位ARM7TDMI单片机构建一个应用系统，利用开发软件ARM SDT v2．51，在开发应用系统上实现存储器地址重映射、中断控制、串行通信、液晶、键盘接口。在此基础上，在S3CA510B上嵌入操作系统μC／OS-Ⅱ，用于液晶、键盘接口和多任务管理，为32住单片机的进一步开发应用构造了一个平台。     

溅射——气体——聚集共沉积法制备金属／金属（介质）复合团簇镶嵌薄膜

提出了溅射－气体－聚集共沉积制备金属／金属（介质）复合团簇镶嵌薄膜的新方法，并利用该方法成功地在方华膜衬底上制备了系列Ｆｅ／Ａｇ及ＣａＦ２复合团簇镶嵌薄膜样品。透射电镜分析结果表明，样品中Ｆｅ（Ｃｕ）团簇都较好地镶嵌于Ａｇ（ＣａＦ２）基质中，其结构为两种材料的多晶共存形态。进一步分析发现，与块材相比，Ｆｅ／Ａｇ样品中Ｆｅ团簇晶格常数呈现出不同程度的收缩，而Ｃｕ／ＣａＦ２样品中Ｃｕ团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。     

Effect of the polymer matrices on the dielectric behavior of a percolative high-k polymer composite for embedded capacitor applications

High dielectric constant (high-k) polymer composites are of great interest for embedded capacitor applications. Previously, we demonstrated that epoxy—aluminum composites are promising for embedded capacitor applications, because they have a high dielectric constant and a low dielectric loss due to the core—shell structure of the self-passivated aluminum particles. In this work, to further understand the dielectric behavior of aluminum composites, lower-loss polymers such as silicone, polyimide, polynorbornene, and benzocyclobutene were explored as matrices for the aluminum composites. It is found that the polymer matrices can significantly change the dielectric properties of the aluminum composites. A polymer matrix with a lower dielectric constant generally results in a lower dielectric constant of its aluminum composites. In this regard, polymer—aluminum composites have a similar dielectric characteristic as polymer—ceramic composites. Thermomechanical properties of aluminum composites were characterized by a thermomechanical analyzer.     

数据采集与处理系统芯片-ADuC845及应用

随着嵌入式系统的发展，模拟信号处理单元与MCU正逐步融为一体，数据采集与处理系统芯片-ADuC845是这一融合的具体体现和产物。现对ADI公司的ADuC845芯片及其特性、应用作详细介绍。     

ROI-based Watermarking Scheme for JPEG 2000

A new region of interest (ROI)-based watermarking method for JPEG 2000 is presented. The watermark is embedded into the host image based on the characteristics of the ROI to protect rights to the images. This scheme integrates the watermarking process with JPEG 2000 compression procedures. Experimental results have demonstrated that the proposed watermark technique successfully survives JPEG 2000 compression, progressive transmission, and principal attacks.     

浅谈计算机专业嵌入式系统方向教学方法

根据计算机专业的实际情况和嵌入式系统方向的特点,提出嵌入式系统教学的几点想法,探讨应用型高校嵌入式系统方向教学方法。通过课堂教学务实基础知识,通过课程设计、毕业设计等教学实践环节培养动手能力和创新能力,从而取得良好效果。     

Ontological reasoning in the design space exploration of advanced cyber–physical systems

Cyber–physical systems are becoming increasingly complex. In these advanced systems, the different engineering domains involved in the design process become more and more intertwined. Therefore, a traditional (sequential) design process becomes inefficient in finding good design options. Instead, an integrated approach is needed where parameters in multiple different engineering domains can be chosen, evaluated, and optimized to achieve a good overall solution. However, in such an approach, the combined design space becomes vast. As such, methods are needed to mitigate this problem.In this paper, we show a method for systematically capturing and updating domain knowledge in the context of a co-design process involving different engineering domains, i.e. control and embedded. We rely on ontologies to reason about the relationships between parameters in the different domains. This allows us to derive a stepwise design space exploration workflow where this domain knowledge is used to quickly reduce the design space to a subset of likely good candidates. We illustrate our approach by applying it to the design space exploration process for an advanced electric motor control system and its deployment on embedded hardware.     

嵌入式调试中的数据获取和错误定位

嵌入式软件系统因其软件相关性和硬件相关性而比常规软件的调试复杂很多,特别是在数据获取和故障定位方面最为突出。从嵌入式软件开发与常规软件开发的异同着手,以该行业实践积累为基础,列出并讨论了一些行之有效的数据获取及错误定位方法,希望能为该领域开发人员提供一点帮助。