从PZT体系看无铅压电陶瓷的可能应用

总结了主要以(Bi0.5Na0.5)TiO3和NaNbO3为基的无铅压电陶瓷的性能，以Pb(Ti，Zr)TiO3基二元系、三元系压电陶瓷的性能与应用为参考，分析了无铅压电陶瓷可能的器件应用。此外，还对拓宽无铅压电陶瓷应用需要改进的性能提出了建议。     

Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

狗经氡子体暴露后血、毛中~(210)Pb 和~(210)Po 含量的动态变化

本文叙述了实验狗经氡子体暴露后血、毛中~(210)Po、~(210)Pb 含量、~(210)po/~(210)Pb 比率及血中~(210)Po,~(210)Pb 排出的动态变化。     

Pb/Sn凸剪切性能研究

在实际使用条件下,Pb/Sn凸点会由于承受温度循环而产生剪切应力,剪切应力导致的主要失效方式是开裂.通过对倒装焊后Pb/Sn凸点剪切强度的测量及对剪切后断口的分析,发现破坏主要发生在凸点下金属(UBM)层内部或UBM与Al焊盘之间,平均剪切强度受凸点尺寸影响很小,范围在21～24MPa。     

进一步降低钼精矿中铜、铅含量的生产实践

分析了钼精矿Cu、Pb含量高的主要原因 ,通过实施一系列措施 ,达到了降低钼精矿中Cu、Pb含量的目的     

Shear strength and aging characteristics of 63Sn−37Pb solder bumps with various solder ball and pad sizes

The shear strength and aging characteristics of 63Sn–37Pb solder bumps were characterized with variation in solder ball and UBM pad sizes. The shear strength increased with shorter effective crack size,a _effs which was determined with the solder ball and pad sizes. The shear strength of the solder bumps on Au/Ni/Cu and Ni/Cu did not change significantly with reflow time. Substantial decrease in the shear strength occurred for the solder bumps formed on Au/Ni/Cu with aging treatment, and the shear strength after aging was also related to the bump shape which was determined with the solder ball and pad sizes.     

火焰原子吸收光谱法测定电缆绝缘护套中的铅

提出了用空气—乙炔原子吸收光谱法测定电缆绝缘护套中的铅含量。铅在0.00~11.00μg.ml-1(r=0.9991)范围内有良好的线性关系。本法的RSD≤3.17%,回收率在97.2%~103.2%之间。     

Electrodeposition of smooth and adherent film of polypyrrole on lead electrode

Electropolymerization of pyrrole on lead substrate electrode was studied. Due to electrochemical activity of Pb in acidic media, this process is only possible at basic pHs. For this purpose, electropolymerization process was performed in an aqueous solution of Na₂SO₄ with pH 12. Potentiodynamic cycling shows the Pb oxidation at the first cycles. In subsequent cycles, polypyrrole film grows on the oxidized lead substrate. Of course, as the passive film is highly porous, a composite of polypyrrole/PbSO₄ is formed in the first layers. However, subsequent cycling leads to the formation of pure polypyrrole film. According to this structure and strong connection of the polymer film to the substrate surface via this composite layer, the polypyrrole film deposited on the lead surface has enhanced mechanical stability. AFM measurements showed peculiar smoothness of both composite and lateral polypyrrole films. This synthesis approach is of particular interest for the preparation of highly stable polymer films and fabrication of supercapacitors with a polymer/PbSO₄ conductive structure.     

甲烷磺酸电镀Sn-Pb合金添加剂研究

介绍了国内外磺酸型Sn-Pb合金电镀添加剂近十年的研究历程现况并根据各组分的化学结构及其在电镀中所体现出的性质将添加剂分为Sn^2 离子稳定剂、光亮剂及分散剂三类。最后列出了新研制的甲烷磺酸Sn-Pb合金电镀添加剂的主要性能及具体工艺配方。     

确定土壤背景值的Hazen概率法——以铜陵矿区Pb为例

本文选取已知土壤背景含量的铜陵矿区,基于Hazen概率曲线,探讨了土壤污染重金属元素Pb背景含量与污染叠加含量的区分方法.得到Pb元素的背景含量为28.5μg/g,与该区深层土壤样中Pb元素含量的平均值(34μg/g)比较接近.还得到了Pb元素污染叠加含量与背景含量的界线点51μg/g.基于Hazen概率曲线区分铜陵矿区土壤Pb元素背景含量与污染叠加含量的方法是有效的,有必要将该方法推广到土壤中其它重金属污染元素、其它地区作进一步研究.