Low-cycle fatigue properties of eutectic solders at high temperatures

This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8T_m). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys.     

Effect of Bi and Sr concentrations on the formation of the 2223 phase in Bi-Pb-Sb-Sr-Ca-Cu-O materials, obtained under different conditions of thermal treatment

The superconducting properties and the phase and chemical composition of Bi _x Pb_0.3Sb_0.1Sr _y Ca₂Cu₃O_z (x=1.5, 1.6, and 1.7;y=1.9, 2.0, and 2.1) materials synthesized by one-step and multistep thermal treatments have been investigated. The multistep annealing between 825–875°C promotes the 2223 phase. The change of Bi concentration has little effect on the 2223 phase formation, regardless of the kind of thermal treatment used, but increasing the Sr concentration (y> 2) strongly inhibits this phase. It has also been established that the loss of Pb after synthesis depends on the initial Bi concentration. The loss of Pb decreases when the initial Bi content is lower.     

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

Low-cycle fatigue (LCF) tests on as-cast Sn-3.5Ag, Sn-3Ag-0.5Cu, Sn-3Ag-0.5Cu-1Bi, and Sn-3Ag-0.5Cu-3Bi solders was carried out using a noncontact strain-controlled system at 20°C with a constant frequency of 0.1 Hz. The addition of Cu does not significantly affect the fatigue life of eutectic Sn-Ag solder. However, the fatigue life was significantly reduced with the addition of Bi. The LCF behavior of all solders followed the Coffin-Manson relationship. The fatigue life of the present solders is dominated by the fracture ductility and can be described by the ductility-modified Coffin-Manson’s relationship. Steps at the boundaries of dendrite phases were the initiation sites for microcracks for Sn-3.5Ag, Sn-3Ag-0.5Cu, and Sn-3Ag-0.5Cu-1Bi solders, while for Sn-3Ag-0.5Cu-3Bi solder, cracks initiated along both the dendrite boundaries and subgrain boundaries in the dendrite phases. The linking of these cracks and the propagation of cracks inside the specimen occurred both transgranularly through eutectic phases and intergranularly along dendrite boundaries or subgrain boundaries.     

Bi2223超导带材的机械性能的改善

通过在超导芯部引入Ag合金的方法制备了新结构单芯和多芯带材，并研究了此种带材机械性能，以及其相对于普通Bi-2223超导带材变化。这种新结构提高了Bi-2223超导带材抗拉伸应变的能力。在拉伸应力的作用下，单芯样品的屈服强度和σ0.2不可逆应变极限εirr和普通样品相比均有较大幅度的提高，其中的最大不可逆应变极限εirr约为0．32％，最大屈服强度σ0.2约为85MPa。多芯样品的最大不可逆应变极限εirr约为1．1％，最大屈服强度σ0.2约为160MPa。实验证明添加合金丝提高了纯银包套多芯带材的不可逆应变极限εirr，并减弱了临界电流的退化速度。但对合金包套的带材影响不大，这时合金包套对于带材的力学性能起主要作用。     

共沉淀法制备三元系铋基焦绿石型陶瓷粉体

采用改进的Mergen A．方案，用氧化锌、三氧化二铋、三氧化二锑为原料，氨水、草酸铵和碳酸铵分别为沉淀剂，盐酸为溶剂，用共沉淀法成功制备了亚微米级颗粒、高活性的铋基Bi1.5ZnSb1.5O7（BZS）焦绿石型介电陶瓷粉体。探讨了用不同的沉淀剂、在不同的烧结温度所得产物的形态。结果表明氨水做沉淀剂在570℃就可生成纯的焦绿石结构。与Mergen A方法相比成本大大降低，可以使瓷片组织的均匀性提高，电性能得到改善，电压梯度下降。     

Bi:YIG纳米薄膜的磁光特性

用射频磁控溅射和快速退火方法制备了纳米量级的Bi:YIG薄膜,研究了薄膜的磁光特性.当晶粒尺寸从150 nm降到80 nm时,透射率和Faraday角的值分别从75%和3.6°变成了80%和4.0°.结果表明:高的透射率和大Faraday角可以在晶粒尺寸为纳米量级的薄膜中共存.     

层状化合物Bi_2W_2O_9的制备及其酸交换性质研究

采用高温固相法合成了层状Bi2W2O9,随后通过酸化处理得到H2W2O7·nH2O。采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、红外光谱(IR)对产物进行了表征。结果表明,采用高温固相法可获得层状结构的Bi2W2O9,层间距1.2 nm。经酸交换后的H2W2O7.nH2O仍保持层状结构,但层间距略变小。     

Pb-Free solders: Part II. Application of ADAMIS database in modeling of Sn−Ag−Cu alloys with Bi additions

The ADAMIS database was used for calculation of the surface tension of the quaternary Sn−Ag−Cu−Bi liquid alloys by Butler's model. The resultant data were compared with those from the maximum bubble pressure measurements from Part I. The same thermodynamic database was next applied for the calculation of various phase equilibria. It was established that the Bi addition to the ternary Sn−Ag−Cu alloys (Sn-2.6Ag-0.46Cu and Sn-3.13Ag-0.74Cu in at.%; Sn-2.56Ag-0.26 Cu and Sn-2.86Ag-O.40Cu in mass%) causes lowering of the melting temperature and the surface tension to make the tested alloys closer to, traditional Sn−Pb solders. The simulation of the solidification by Scheil's model showed that the alloys with the higher Bi concentration are characterized by the lifting-off failure due to the segregation of Bi at the solder/substrate boundary. Thus, in modeling of new Pb-free solders, a compromise among various properties should be taken into consideration.     

纳米晶Bi2Se3-Sb2Se3薄膜的SILAR法制备及表征

采用连续离子层吸附反应(SILAR)法,分别用含有Se2-,Bi3+和Sb3+的离子溶液作为独立的阴、阳离子前驱溶液,以载玻片为衬底,在室温下沉积出致密且具有镜面金属光泽的Bi2Se3-Sb2Se3薄膜材料.为了改善薄膜样品的结晶状态,对其进行了退火处理.用AFM观察了薄膜样品的表面形貌,用XRD分析了退火前后薄膜样品的结晶状态.结果表明薄膜样品经200℃较低温度下退火处理4 h以后,薄膜的结晶状态由无定形态转化为多晶态,其平均晶粒尺寸为30 nm～40 nm.     

Bi对共晶过共晶Al-Si合金耐磨性能的影响

共晶、过共晶Al—Si合金中加入元素Bi形成Al—Si—Bi多元合金，具有偏晶转变的结晶特点，由于Bi的不溶性及自润滑性，并以高弥散游离态分布于基体中使过共晶Al—Si合金的耐磨性大幅度提高。