微流控分析芯片制作中的低温键合技术

微流控分析芯片制作方法的研究是微流控分析的基础。制作性能良好的微流控分析芯片时,基片与盖片的键合技术十分重要。本文针对近年来发展迅速的低温键合技术,对各种方法进行了评价,并对其发展前景进行了展望。     

编码解码芯片HD3-6408-9及其应用

编码解码芯片HD3 64 0 8 9是一种高性能的CMOS器件。这种大规模芯片主要由编码器和解码器两部分组成。在数据传输应用中 ,采用两个独立的单片机系统 ,利用编码解码芯片 (HD3 64 0 8 9)组成数字信号的接收、发送及显示部分来完成数据传输功能     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

Amorphous diffusion bonding of steel pipe and its impact toughness

An iron-based amorphous foil (FeNiCrSiB) was used as an interlayer for the amorphous diffusion bonding of low carbon steel pipes under argon flux. The microstructure and mechanical properties of the joint were analyzed using an electron probe micro-analyzer (EPMA), tensile test, bending test and impact test. The results show that the joint microstructure resembles that of the base metal and no precipitates form at the joint. Melting point depressants (B, Si) diffuse far away from the joint and the base metal element is homogenous across the joint. The joint impact toughness is greater than the base metal toughness and the mechanical properties of the joint are similar around the pipe.     

基于Lab VIEW的小型汽油机磁电机点火提前角的测量

本文介绍了磁电机点火系统的点火提前角测量原理。对点火系统的点火信号和触发信号进行采集、调理，再用单片机进行处理，最后用LabVIEW进行点火提前角数据存储和显示。     

Structural properties of phosphorous-doped polycrystalline silicon

The structural properties and hydrogen bonding of undoped and phosphorous doped polycrystalline silicon produced by step-by-step laser dehydrogenation and crystallization technique were investigated using Raman spectroscopy and hydrogen effusion measurements. At low laser fluences, E_L, a two-layer system is created. This is accompanied by the change in hydrogen bonding. The intensity of the Si–H vibration mode at 2000 decreases faster than the one at 2100 cm⁻¹. This is even more pronounced in phosphorous-doped specimens. The laser crystallization results in an increase of the hydrogen binding energy by approximately 0.2–0.3 eV compared to the amorphous starting materials.     

API长圆螺纹套管抗粘结性能的试验研究

通过对国内外大量石油套管螺纹参数的测量和全尺寸的模拟试验，以及对测量和试验数据的理论分析，找出了影响国产套管发生粘扣的原因，并在实际生产中实施验证。采取相应的措施改善了套管的抗粘结性能，同时套管的密封和抗滑脱性能并未下降。     

Improved direct bonding method of Nd:YVO4 and YVO4 laser crystals

We succeeded in the fabrication of bonded laser crystals composed of a neodymium-doped YVO₄ laser crystal (Nd:YVO₄) and its host crystals YVO₄ by a newly developed dry etching technique using an argon ion beam. The optical distortion caused by the bonded interface of size 5 mm × 6 mm was estimated to be 0.05λ at 633 nm. From the comparison of laser performance pumped by a laser diode, the bonded crystals could increase the laser output power by nearly twice that of the non-bonded crystals with the same degree of polarization of 99.2%. To analyze the mechanism of the enhanced reduction of the thermal load in the bonded crystals, numerical simulations with a finite-element method were also performed.     

钢／铝合金液固相复合工艺的研究

通过正交试验研究了各工艺量数以钢／铝合金液固相复合性能的影响，最佳工艺条件为铝合金液体温度７９０℃，钢板表面处理为酸洗＋钢刷＋５％的氟钛酸钾助焊剂，复合压力为３９．２ＭＰａ，组织观察表面界面脆性化合物的形成是导致结合强度降低的一个重要因素。