Effects of the cryogenic cooling on the fatigue strength of the AISI 304 stainless steel ground components

For environmental considerations, the substitution of the conventionally used oil-based grinding fluids has nowadays become strongly recommended. Although several alternatives have been proposed, cryogenic cooling by liquid nitrogen is the non-polluting coolant that has been given relatively more attention because of its very low temperature. In this investigation, in order to contribute to developing this promising cooling mode, its beneficial effects on the ground surface integrity of the AISI 304 stainless steel and their consequences on the fatigue lifetime are explored. Results of this investigation show that grinding under cryogenic cooling mode generates surfaces with lower roughness, less defects, higher work hardening and less tensile residual stresses than those obtained on surfaces ground under oil-based grinding fluid. These surface enhancements result into substantial improvements in the fatigue behaviour of components ground under this cooling mode. An increasing rate of almost 15% of the endurance limit at 2 × 10⁶ cycles could be realized. SEM analyses of the fatigue fracture surfaces have shown that the fatigue cracks observed on the specimens ground under cryogenic cooling are shorter (i.e., 30-50 μm) than those generated under oil-based cooling mode (i.e., 150-200 μm). The realized improvements in the surface integrity and in the fatigue behaviour are thought to be related to the reduction of the grinding zone temperature observed under cryogenic cooling, as no significant differences between the grinding force components for both cooling modes have been observed.     

The optimal diamond wheels for grinding diamond tools

Grinding is the most suitable process for manufacturing good quality diamond tools. In this paper, diamond wheels have been studied. From the grinding of polycrystalline diamond (PCD) insets, the effects of certain factors such as the bonding material, the grit size and structure of a diamond wheel have been investigated. It is concluded that vitrified bond diamond wheels are the most suitable for grinding PCDs and the recommended grit size is mesh number 1000, which can get a good surface quality within an appropriate time. The wheel structure is another important factor. Rougher wheels (mesh #800, #1000) with the softer grade scale P yield a higher material removal rate (MRR) than scale Q. However, a finer wheel (mesh #1200) needs a tougher structure to promote its grinding ability and to have a higher MRR.     

一种微粉碎新设备——离心碎磨一体机

介绍一种离心碎磨一体机的工作原理、构造和特点 ,分析了碎磨机理及应用前景     

Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining

Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining was carried out to investigate microfracture, residual damage, and surface roughness associated with material removal and surface generation. Brittle versus plastic deformation was studied using Vickers indention and nano-indentation. To characterize the abrasive machining response, the 6H-SiC (0001) substrates were ground using diamond wheels with grit sizes of 25, 15 and 7 μm, and then polished with diamond suspensions of 3 and 0.05 μm. It is found that in indentation, there was a scale effect for brittle versus plastic deformation in 6H-SiC substrates. Also, in grinding, the scales of fracture and surface roughness of the substrates decreased with a decrease in diamond grit size. However, in polishing, a reduction in grit size of diamond suspensions gave no significant improvement in surface roughness. Furthermore, the results showed that fracture-free 6H-SiC (0001) surfaces were generated in polishing with the existence of the residual crystal defects, which were associated with the origin of defects in single crystal growth.     

Modelling of the mist formation in a segmented grinding wheel system

It has been found that using a segmented grinding wheel with a fluid chamber can significantly minimise the quantity of coolant while improving the ground surface integrity. The present investigation aims to explore the fluid flow mechanism in such a wheel system. To this end, the Weber theory for Newtonian jet instability was applied to quantitatively determine the contribution of coolant flow rate to mist and ligament modes. A semi-analytical model was then developed to predict the mist flow rate by taking into account both the grinding parameters and fluid properties. It was shown that the model prediction was in good agreement with experimental measurements. Because of the comprehensive integration of variables in the formulation, the model provides a good fundamental understanding of the mist formation and offers a practical guideline for the selection and use coolant in minimising the mist flow rate.     

Laser Dressing of Metal Bonded Diamond Wheel

In this study, a laser beam is used as a non-contact thermal dressing tool for a bronze bonded diamond wheel. The pulsed-Nd:YAG laser beam is irradiated on the wheel surface and the bond material partially removed by laser irradiation only. In order to efficiently remove the bond material, it is necessary to direct an air jet on the spot irradiated by the laser so as to blow away the molten binder before it solidifies again. Less damage of diamond particles such as micro-cracks or graphitization occurs. In grinding with a laser-dressed wheel, the grinding forces are almost the same as those for a conventionally dressed wheel. Consequently, effective laser dressing can be expected with the associated dressing conditions.     

基于Rough集的磨削参数决策系统

本文介绍了5层模糊神经网络的优缺点，提出了基于Rough集构造模糊神经网络的方法，并应用于多传感器的磨削参数决策系统，达到控制磨削加工质量的目的。     

Stress due to a moving band source of heat and mechanical load on the work surface during grinding

The grinding operation is considered to be equivalent to a moving band source of heat and mechanical load on the surface of a semi-infinite solid, producing very high temperature on the surface of the workpiece. The resulting temperature may result in high stress in the workpiece. It is thus desirable to be able to predict the stress levels expected during the grinding process.     

Process Requirements for Cost-Effective Precision Grinding

Costs in precision cylindrical grinding are compared for different abrasives, machines and grinding conditions. The analysis is for repeated batch production. Account is taken of machine cost and abrasive cost. Cost comparisons were based on extensive trials to assess re-dress life against workpiece quality requirements. Experiments show that different workpiece materials require different strategies to reduce costs. Easy-to-grind AISI 52100 and difficult-to-grind Inconel 718 materials were ground at conventional speeds and at high speeds. It is shown that wheel speed affects production rate through acceptable values of re-dress life, removal rate and dwell time. Advantages were gained using vitrified CBN at conventional speed and at high speed. For both materials, vitrified CBN wheels used at high speed, gave better quality at lower cost than conventional abrasives. Wheel costs became negligible and labour costs greatly reduced. Re-dress life trials, usually neglected, are shown to be essential to reduce costs and maintain quality [1].     

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Silicon is the primary semiconductor material used to fabricate microchips. A series of processes are required to manufacture high-quality silicon wafers. Surface grinding is one of the processes used to flatten wire-sawn wafers. A major issue in grinding of wire-sawn wafers is reduction and elimination of wire-sawing induced waviness. Results of finite element analysis have shown that soft-pad grinding is very effective in reducing the waviness. This paper presents an experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Wire-sawn wafers from a same silicon ingot were used for the study to ensure that these wafers have similar waviness. These wafers were ground using two different soft pads. As a comparison, some wafers were also ground on a rigid chuck. Effectiveness of soft-pad grinding in removing waviness has been clearly demonstrated.