Spatiotemporal and Thermal Analysis of VCSEL for Short-range Gigabit Optical Links

High-speed Optoelectronic Modules using Vertical Cavity Surface Emitting Lasers (VCSEL) coupled to Multi Mode Fibers (MMF) are a performing and low-cost solution for 10 Gigabit Ethernet (10 GbE) in short-distance optical links. A complete model of the spatiotemporal behavior of multimode VCSELs, through static and dynamic response, noise, thermal effects, and its coupling to MMF has been investigated. Relative Intensity Noise shows modal dependence and can be affected by spatial filtering due to coupling and fiber propagation. Simulations permit to evaluate critical parameters, such as modulation formats, launching conditions, and operating temperature for global bandwidth and eye diagram optimization up to 10 Gb/s. Simulation results are compared to measurements on prototype optoelectronic modules.     

Real-Time Reconfigurable Interconnections for Parallel Optical Processing

In this letter we describe the advantages of a dynamic optical interconnection system for parallel information processing applications. The system is based on a liquid crystal television which acts as a binary phase-only spatial light modulator. We describe example algorithms where reconfigurable interconnects would be useful and present results of several interconnection topologies which have been implemented.Presented at the International Commission for Optics Topical Meeting, Kyoto, 1994.     

Novel interconnection scheme for thin‐film silicon solar modules with conductive intermediate reflector

Intermediate reflector layers are commonly used for light man‐agement purposes in multi‐junction silicon based devices containing a‐Si:H top‐ and µc‐Si:H bottom‐sub‐cells. A low resistance of such layers can have a severe impact on the solar module performance due to shunting of the bottom sub‐cell by the P2 scribe. A common solution for this problem is the use of an additional scribe line. However, not only the additional processing step is disadvantageous but also the dead area losses are increased as well by the additional scribe. This work introduces a novel solar cell stripe interconnection scheme that requires only three scribing processes with similar dead area losses as they would be apparent in the standard interconnection scheme. An implementation to mini modules shows no negative impact on the electrical properties and simultaneously reducing the required number of scribing steps. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

The guaranteed cost control for uncertain nonlinear large-scale stochastic systems via state and static output feedback

The guaranteed cost control (GCC) problem involved in decentralized robust control of a class of uncertain nonlinear large-scale stochastic systems with high-order interconnections is considered. After determining the appropriate conditions for the stochastic GCC controller, a class of decentralized local state feedback controllers is derived using the linear matrix inequality (LMI). The extension of the result of the study to the static output feedback control problem is discussed by considering the Karush-Kuhn-Tucker (KKT) conditions. The efficiency of the proposed design method is demonstrated on the basis of simulation results.     

Copper metallization for ULSL and beyond

The investigation of copper for use as an interconnection metal in the ultra large-scale integration (ULSI) era of silicon integrated circuits has accelerated in the past several years. The obvious advantages for using copper to replace currently used Al are related to its lower resistivity (1.7 μΩ-cm vs. 2.7 μω-cm for Al) and its higher electromigration resistance (several orders of magnitude higher compared with Al). The goal of this review is to examine the properties of copper and its applicability as the interconnection metal. A comparison of electromigration behavior of various possible interconnection metal in standard “bulk” state is made. This is followed by a review of the calculations made comparing (a) the RC (resistance × capacitance) time constants of various material systems and (b) the joule heating of the interconnection materials. A comparative study of various metal systems for the application as the interconnect metal is then made. These discussions will clearly establish the superiority of copper over other metals despite certain limitations of copper. We then review the properties, both physical and chemical, and materials science of copper. The concept of using alloys of copper with a minimal sacrifice on resistivity to gain reliability is also discussed. This is followed by the review of the deposition, pattern definition and etching. passivation, need of the diffusion barrier (DB) and adhesion promoter (AP), planarization and dual damascene process using chemical mechanical planarization, and reliability. This review shows that copper will satisfy the needs of the future integrated circuits and provide high performance and reliability as long as we provide an appropriate barrier to diffusion in the underlying devices and the dielectric.     

Multi-order diffractive optical elements for achromatic interconnections at 1.30 μm and 1.55 μm

We propose a class of diffractive components allowing free-space optical systems to operate at the two telecommunication wavelengths simultaneously. These are fifth order diffractive components working at the sixth order at 1.30 μm and at the fifth order at 1.55 μm. Simulation results showing the link efficiency between two single-mode fibres as a function of the wavelength are presented. The width of the two transmission windows depends on the architecture of the whole system, which must be designed in accordance with technological realizability.     

Dissipativity theory for discontinuous dynamical systems: Basic input, state, and output properties, and finite-time stability of feedback interconnections

In this paper, we develop dissipativity theory for discontinuous dynamical systems. Specifically, using set-valued supply rate maps and set-valued connective supply rate maps consisting of locally Lebesgue integrable supply rates and connective supply rates, respectively, and set-valued storage maps consisting of piecewise continuous storage functions, dissipativity properties for discontinuous dynamical systems are presented. Furthermore, extended Kalman–Yakubovich–Popov set-valued conditions, in terms of the discontinuous system dynamics, characterizing dissipativity via generalized Clarke gradients and locally Lipschitz continuous storage functions are derived. Finally, these results are used to develop feedback interconnection stability results for discontinuous dynamical systems by appropriately combining the set-valued storage maps for the forward and feedback systems.     

多状态,多阈值神经网络模型的光电混合实现

提出了一种采用高分辨率液晶电视（ＬＣＴＶ）实现Ｈｏｐｆｉｅｌｄ神经网络多值算法的光电系统，文章给出了平面多状态，多阈值的全互连Ｈｏｐｆｉｅｄ神经网络模型，并采用该系统对颜色进行了联想和记忆的实验，初步的实验结果可以证实，此种高分辨率液晶电视神经网络系统是可行的。     

Optimization, design and fabrication of a non-cryogenic quantum infrared detector

A study of the optimization of the detectivity of a mid infrared double heterostructure photovoltaic detector is proposed. Simple approximate analytic expressions for the dark current are compared with full numerical calculations, and give physical insight on the mechanisms dominating the dark current. The analysis is performed step by step, from a simple p–n junction to the full double heterostructure. The influence of temperature, barrier band gap energy in a double heterostructure, doping density in the active region, on diffusion and generation–recombination mechanisms is analyzed. It is shown how the performances of a double heterostructure photovoltaic detector can be improved by a controlled doping the active region. Nevertheless, its development is still limited by the difficulties occurring during device processing. For example, the use of dry etching for the processing of InAs_0.91Sb_0.09 p–i–n photovoltaic detectors induces a strong leakage current along the mesa edge. In this letter, we show an improvement of the R₀A characteristic by several orders of magnitude at low temperature by using an Ion Beam Etching (IBE) followed by a wet chemical etching. This optimized and reliable device processing allows us to demonstrate that the detector performance is actually limited by the diffusion current of holes. Finally, we discuss the ability of an n-type barrier made of InAs/AlSb super-lattice to avoid hole diffusion and to improve the R₀A characteristic of these detectors. To cite this article: B. Vinter et al., C. R. Physique 4 (2003).     

Polymer waveguide with integrated reflector mirrors for an inter-chip link system

A polymer waveguide with integrated reflector mirrors is presented for an inter-chip link system. The cost-effective and repeatable technology for the integration of a polymer multimode waveguide and out-of-plane 45° reflector mirrors was developed for optical coupling between the light-sources and the light-detectors. This method enabled us to fabricate the waveguides and 45° reflector mirrors using a one-shot embossing process for inexpensive mass production. The optical inter-chip link system consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a vertical-cavity surface-emitting laser (VCSEL)/photo-detector (PD) array, and an optical waveguide composed of integrated reflector mirrors. The presented data transfer measurements of the optical inter-chip link system are shown to be successful at a data rate of 5 Gb/s.