新型实用布线算法──L─M算法

本文提出新型布线算法，集李氏迷宫法与线搜索法的长处为一体，以饱和带法进行动态排序，以线搜索法确定借孔位置，然后用李氏法进行单层布线，获得最佳路径，从而达到线型好，布通率高的效果。     

优化印制电路板地线设计

印制电路板地线是印制电路板设计的一个基本问题，本文详细分析了印制电路板地线对电路的干扰，介绍了减小地线对电路干扰的方法，阐述了印制电路板地线的设计规则，将其应用到实际的印制电路板设计中，可大大提高印制电路板的抗干扰能力，实现电磁兼容。     

Trade-off analysis on cost and manufacturing technology of an electronic product: Case study

A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.     

面向表面组装工艺技术的PCB焊盘设计

尽管电子设计类软件已相当先进和方便，而且更新速度也很快，但是仍然无法满足各个层次的设计人员的需求，特别是适合各种元素封装形式的焊盘设计库并不能让设计和制造者满意，为了在此方面对PCB设计有所帮助，从印制电路板焊盘的设计方法入手，针对表面组装工艺技术特点，分析了PCB焊盘对PCA可靠性的影响因素，并根据相关的质量要求提出了较为简便的设计方案。     

高层印制线路板正面临的对位挑战

封装工业正在推动着印制线路板技术水平朝着半导体要求的方向发展。高密度印制线路板正广泛用于网络路由器、自动测试设备和服务器领域。高密度要求(>150 IO/cm~2)正成为客户的普通需求。为满足现有的高密度封装要求,由于线宽、线距和通孔孔径正接近传统制作极限,普遍的方法就是不断增加印制线路板的层数。这些特征正驱动着印制线路板在基材、图像转移、蚀刻、电镀、阻焊、测试流程和对位系统的变化。此文主要讲述了印制线路板特性的变化趋势和利用对位模式和雷利分布去预测满足高级对位要求的能力以及印制线路板各流程中有关对准度的控制要点。     

印制板蚀刻、微蚀刻废液的再生和铜回收的技术及设备

传统的印制板蚀刻废液处理方法存在着工艺落后、操作不便、二次污染、效益不高等问题,本工艺采用特殊的萃取电解、吸附电解技术,使蚀刻废液得以再生循环利用,铜得以100%回收,低含铜废水铜得到98%回收,整个系统不产生二次污染,获得的铜为高纯度铜板,在实现污染控制的同时,废液废水得到了资源化利用。     

印制线路板微孔镀铜研究现状

印制线路板微孔金属化的关键在于在高厚径比的微孔中形成无空洞、无接缝、均匀的铜沉积层.综述了目前微孔填充技术的发展现状,对电镀过程中采用的电流密度、搅拌因素和电流波形等进行了探讨,重点讨论了添加剂对填孔效果的影响及其作用机理.     

Experimental Study on the Expansion Uniformity of Armature

A measurement system has been developed based on high-precision printed probes in printed circuit board (PCB) and steep rising-time probe adapters,which can be applied to study the expansion uniformity of armature in a helical magnetic flux compression generator (HFCG).The influences of wall thickness and initiation position on the expansion uniformity of armature in HFCG were experimentally investigated.The results show that the armature with thinner wall thickness will easily rupture due to the high pressure of detonation products inside,the armature with larger wall thickness will easily crack due to the tensile stress on the outer surface of the wall,the influence of the end effect on the expansion uniformity can be ignored if the distance between the first group of probe and the initiation point is more than 3 times the armature diameter.     

印刷电路板瑕疵在线实时检测方法的研究

针对现行PCB瑕疵检测方法的缺点,提出了一种以数学形态学理论为基础,并有效结合参考比较法,对PCB瑕疵图像进行识别.经过实验验证,该方法具有运算量小、计算速度快的特点;而且对瑕疵的检测范围也极大,具有较高的实用价值.     

Boundary scan test,test methodology,and fault modeling

The test technique called boundary scan test (BST) offers new opportunities in testing but confronts users with new problems too. The implementation of BST in a chip has become an IEEE standard and users on board level are the next group to begin thinking about using the new possibilities. This article addresses some of the questions about changes in board-level testing and fault diagnosis. The fault model itself is also affected by using BST. Trivial items are extended with more sophisticated details in order to complete the fault model. Finally, BST appears to be a test technique that offers a high degree of detectability on board level, but for diagnosis, some additional effort has to be made.