Measurement and Identification of the Parameters of SPICE-Models of a Bipolar Transistor

A method of measuring and identifying the static parameters of a bipolar transistor is considered. The characteristic of the transistor, from which the parameters of the model are determined, is chosen depending on what group the calculated parameters belong to. The characteristics are measured in such a way that the equations of the model describing them can be reduced to the simplest form.     

STI process steps for sub-quarter micron CMOS

This paper presents Shallow Trench Isolation (STI) process steps for sub-1/4 μ CMOS technologies. Dummy active areas, vertical trench sidewalls, excellent gap filling, counter mask etch step and CMP end point detection, have been used for a 0.18 μm CMOS technology. Electrical results obtained with a 5.5 nm gate oxide thickness show good isolation down to 0.3 μm spacing. Good transistor performances have been demonstrated.     

CMOS电路中抗Latch-up的保护环结构研究

闩锁是CMOS集成电路中的一种寄生效应,这种PNPN结构一旦被触发,从电源到地会产生大电流,导致整个芯片的失效。针对芯片在实际测试中发现的闩锁问题,介绍了闩锁的测试方法,并且利用软件Tsuprem4和Medici模拟整个失效过程,在对2类保护环(多子环/少子环)作用的分析,以及各种保护结构的模拟基础之上,通过对比触发电压和电流,得到一种最优的抗Latch up版图设计方法,通过进一步的流片、测试,解决了芯片中的闩锁失效问题,验证了这种结构的有效性。     

L波段窄脉宽500W固态功放组件的设计

介绍了作者研制的应用于固态雷达发射机上的L波段500W固态功放组件的工作原理、用途及其主要技术指标。描述了功放组件的设计过程和测试结果。该功放组件在窄脉宽条件下实现了快速上升沿,性能优良,工作稳定可靠。     

Thermal stability of interfaces between metals and InP-based materials

The thermal stability of interfaces between metals (Ni, Pt, Ti, Mo) and III-V compound semiconductors has been investigated by the application of Rutherford backscattering spectrometry. Metal diffusion and interfacial lattice disorder of the semiconductors were analyzed for various metal/semiconductor samples annealed at temperatures up to 500°C. The interfaces of Ni/GaAs and Ti/GaAs were found to be more stable than those of Ni/In-based semiconductors and Ti/ In-based semiconductors, respectively. Faster diffusion of Pt atoms was ob-served in In-and As-containing materials than in P-containing materials. Mo/ semiconductor interfaces were the most stable.     

功率管焊接质量射线检测

介绍采用射线方法检测功率管芯片与基座之间的焊接质量。试验证明，选用合适的透照参数可使X射线照相和X射线实时成像对焊接部位的检测均得到较高的对比灵敏度，但X射线照相法成本低廉，一次可透照多个工件，效率高，为该功率管焊接质量的理想检测方法。     

Shorts in self-checking circuits

It has been noted by several authors that the classical stuck-at logical fault model might not be an appropriate representation of certain real failures occurring in integrated circuits. Shorts are an important class of such faults. This article gives a detailed analysis of the effects of shorts in self-checking circuits and proposes techniques for dealing with them. More precisely, we show that, unlike other faults such as stuck-at, stuck-on, and stuck-open—which produce only single errors in the place they occur—shorts can produce double errors on the two shorted lines. In particular, feedback shorts can produce double errors on the two shorted lines. The double error is unidirectional for some feedback shorts and non-unidirectional for some others. Furthermore, in some technologies (e.g., CMOS), non-feedback shorts can also produce double non-unidirectional errors. We also show that unlike stuck-at, stuck-on, and stuck-open faults, redundant shorts can destroy the SFS property. Then we propose several techniques for coping with these problems and we illustrate the results by circuit implementation examples.The present study is given for NMOS and CMOS circuits but we show that it is valid for any other technology.     

TFT有源矩阵α－Si∶H薄膜PECVD淀积工艺研究

分析了α－Ｓｉ∶Ｈ薄膜的质量和厚度对α－Ｓｉ∶ＨＴＦＴ关键性指标的影响，深入、详细地讨论了其ＰＥＣＶＤ淀积工艺，并在实验的基础上确定了最佳淀积工艺参数，从而获得了高性能的７５ｍｍ３７２×２７６像素α－Ｓｉ∶ＨＴＦＴ有源矩阵     

IGBT串联均压方法综述

绝缘栅双极性晶体管IGBT(insulated gate bipolar transistor)在高电压场合应用时需串联使用满足电压需求。由于器件内部的性能差异和外围电路参数不一致等,引起IGBT模块之间电压不均衡问题,威胁其运行安全。综述了国内外IGBT串联均压方法的发展及其研究现状。根据均压方法机理的不同,将IGBT串联均压方法分为被动均压方法和主动均压方法两种,进一步将主动均压方法归纳为无源控制方法和有源控制方法两类。根据各类方法的基本电路拓扑分析了均压原理,梳理了不同方法在电路拓扑、参数选择和控制策略等方面的优化和最新进展。通过均压效果、附加损耗和可靠性等多方面对不同均压方法进行对比,被动均压方法拓扑简单不需外加控制电路更适合在低频应用场合,在高频应用场合中,准有源栅极控制法以单驱动与无源器件相结合的方式,具有良好的发展前景。最后对IGBT串联均压方法进行了展望。     

弧焊逆变电源的发展趋势分析

本文针对弧焊逆变电源中的几个关键问题，如功率开关器件的性能特点，增大输出变压器的功率，逆变电源的智能控制等，评述了当前的技术水平及今后的发展趋势。