Effects of solidification structure on fatigue crack initiation and fatigue strength in Al−Si−Mg cast alloys

Rotating-bending uniaxial fatigue tests and micro-fatigue crack initiation tests were carried out using a permanent mold cast (PMC) and semi-solid die cast (SDC) with Al−7%Si−0.35%Mg composition in order to examine the relationship between solidification structures and fatigue behaviors. The crack length was measured using a replication method. Fatigue strength was improved in SDC, which was almost consistent with the predicted fatigue strength using the size of Si particle cluster. Resistance to fatigue crack initiation and fatigue strength were improved in SDC owing to the finer Si cluster and to higher ultimate tensile strength. Fatigue crack in PMC was preferentially initiated at pores. For SDC, the fatigue crack was initiated at the Si particle/matrix interface, and then sucessively grew along eutectic cell boundaries.     

Phase equilibria in the system Al-Rh

Methods of differential thermal analysis, x-ray diffraction, microstructural analysis and electron probe microanalysis are used to study alloys of the Al-Rh system over the whole concentration range. It is established that the phase of equiatomic composition AlRh melts congruently at 2060°C and it has an extended range of homogeneity (45.1–54.2 at.% Rh). The solubility of aluminum in rhodium reaches 9 at.%, decreasing to 6 at.% at 850°C. Coordinates are determined for the eutectic point l ⇆ AlRh + 〈Rh〉 as 70 at.% Rh and 1715°C. The existence of intermediate phases, their crystal structure, and also the method of forming phases in the field of composition rich in aluminum given in publications are confirmed. __________ Translated from Poroshkovaya Metallurgiya, Nos. 5–6(449), pp. 48–56, May–June, 2006.     

过共晶Al－Si合金共生区激光表面处理

用２ｋＷ连续ＣＯ２激光对过共晶Ａｌ－１８Ｓｉ合金以不同能量密度和扫描速度进行快速熔凝处理。用扫描电镜、电子微区分析仪分析了微观结构。从计算机对Ａｌ－Ｓｉ合金ｆ－ｎｆ系统的非平衡理论计算所得的共生区及实验结果的分析可见，当能量密度和扫描速度决定的凝固条件处于共生区中部时，过共晶Ａｌ－Ｓｉ合金激光表面处理可以得到共晶间距低于２００ｎｍ的完全共晶结构。     

纤维共晶生长界面前沿三维扩散场解析

修正Ｊａｃｋｓｏｎ和Ｈｕｎｔ关于在垂直生长方向截面上溶质扩散各向同性假设，求解三维Ｌａｐｏｌａｃｅ方程，获得纤维共晶生长界面前沿三维稳态扩散场，并证明Ｊａｃｋｓｏｎ和Ｈｕｎｔ的二维模型是实际生长的二维简化和一阶近似，并用丁二腈（ＳＣＮ）一梓脑（ＣＡＭ）纤维共晶系统计算生长界面前沿溶质分布。     

过共晶铝硅合金细化初晶硅的研究

研究了ZL8604过共晶铝硅合金初晶硅细化剂和加入方式与加入量以及影响细化效果的冶铸工艺因素,实验结果达到了技术指标要求。     

原始组织及加热方式对Al-5.8wt%Cu合金熔化行为的影响

利用DSC分析手段，研究了具有3种不同凝固组织的Al-5.8wt%合金在7种不同加热方式下的熔化开始温度和熔化热，发现凝固组织中存在的非平衡共晶在加热过程中大部分扩散溶解，溶入基体，剩余部分参与共晶熔化，其熔化开始温度与组织状态无关，随加热速度的增大略有升高，溶解部分的体积分散与组织状态和加热方式有关，随加热时间和非平衡相表面积的增大而增大。     

Microstructure and creep of eutectic indium/tin on copper and nickel substrates

The behavior during creep in shear of eutectic indium-tin joints on copper and nickel substrates was examined in order to determine the effect of creep deformation on the microstructure of the alloy. Primary creep was absent in all the samples tested. The stress exponent at 20° C was much higher for samples on nickel than for those on copper, indicating a different creep deformation mechanism. Also, the microstructure within the indium-tin joints differed significantly with a change of substrate. Samples with a nickel substrate showed a colony microstructure that was not observed in those with a copper substrate. Thus, eutectic morphology is important in determining deformation mechanism during creep. The microstructure within the joints in tested and untested regions of the samples was effectively the same. This is quite distinct from the behavior of eutectic lead-tin observed in previous work. Lead-tin formed a recrystallized band of material along a region of concentrated shear deformation. While the deformation pattern in the indium-tin samples appeared to be the same as for lead-tin, the microstructural changes did not occur. This implies that the behavior observed in lead-tin is not universal to eutectic alloys.     

Research and Applications of Semi-solid Processing

Since it was pioneered by Flemings and otherresearchers [11, the semi-solid metal processingtechnique has been widely stUdied in the world.Especially in the past decade, SSM as a newproduct forming technique has been rapidly developed and put into commercial applications[2, 31. In recent years, with the development ofthe ado-industry of China, a lot of researchwork on SSM has been done, including the preparation of slumes, reheating and thixoforming[Al6]; moreover, great achievements have …     

低熔点Cu-P基中间合金及其变质效果

利用差示扫描量热仪(DSC)、扫描电子显微镜(SEM)和金相显微镜等手段对Cu-P基中间合金进行了研究。结果表明，在二元共晶Cu-P中间合金中加入一定量的Sn可制成低熔点的Cu-16Sn-8P中间合金；在此基础上研制出一种熔点为630℃左右的低熔点的多元Cu-P基中间合金。与Cu-P中间合金相比，该低熔点多元Cu-P基中间合金对过共晶AI-24Si合金具有更好的变质效果。同时，该中间合金对ZL109合金也具有良好的变质效果。     

快速凝固铝硅合金粉末加热过程中硅颗粒的粗化行为

利用差示扫描量热仪(DSC)、电子显微镜等设备对Al-12.8%Si合金粉末的原始状态及热处理后的状态进行了分析。发现其显微组织有两个连续的变化过程:在156℃时,固溶在基体Al中的过饱和Si开始析出,并在340℃发生粗化,随着加热温度的升高,粗化现象仍然存在。另外,对Si颗粒的粗化机理进行了研究,发现其粗化符合经典的LSW理论。