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1.
The influence of network density on the strain hardening behaviour of amorphous polymers is studied. The network density of polystyrene is altered by blending with poly(2,6-dimethyl-1,4-phenylene-oxide) and by cross-linking during polymerisation. The network density is derived from the rubber-plateau modulus determined by dynamic mechanical thermal analysis. Subsequently uniaxial compression tests are performed to obtain the intrinsic deformation behaviour and, in particular, the strain hardening modulus. At room temperature, the strain hardening modulus proves to be proportional to the network density, irrespective of the nature of the network, i.e. physical entanglements or chemical cross-links. With increasing temperature, the strain hardening modulus is observed to decrease. This decrease appears to be related to the influence of thermal mobility of the chains, determined by the distance to the glass-transition temperature (TTg).  相似文献   
2.
This paper proposes an original method for obtaining analytical approximations of the invariant probability density function of multi-dimensional Hamiltonian dissipative dynamic systems under Gaussian white noise excitations, with linear non-conservative parts and nonlinear conservative parts. The method is based on an exact result and a heuristic argument. Its pertinence is attested by numerical tests.  相似文献   
3.
吐哈油田部分区块地层压力系数小于0.9,常规水基压井液对储层伤害大,若使用油基压井液成本高,环境污染严重。通过实验优选出了一种低密度水基微泡沫压井液。该压井液具有密度低、泡沫强度高、稳定性好、携砂能力强等优点。现场应用表明,低密度微泡沫压井液稳定时间大于48 h,密度在0.70~0.99 g/cm3之间可调,抗油污染能力强,抗油大于8%,抗温在100℃以上,岩心污染后渗透率恢复值大于80%;并且施工方便,成本低,具有储层保护能力,使用微泡沫压井液的井表皮系数在0.20~2.34之间。  相似文献   
4.
吐丝圈径对大规格高碳盘条组织性能的影响   总被引:1,自引:0,他引:1  
计算与分析了斯太尔摩冷线上盘条的吐丝圈径、搭接密度及"佳灵"装置横向布风曲线之间的关系,研究了吐丝圈径的大小对大规格82B盘条组织和性能的影响,确定了大规格82B盘条最小吐丝圈径应为980mm.  相似文献   
5.
A method for contactless measurement of the shielding critical current density and its dependence on the external magnetic field is described and analyzed. The obtained values are compared with those measured resistively on two different samples. It is shown that the shielding critical current densityJ cs and the intergranular transport current densityJ cr are identical if the measurement conditions are similar. A degradation ofJ cs measured in the external field with AC ripple has been observed.  相似文献   
6.
应用统计控制图法,选用平均值——标准差、平均值——极差控制图法,控制24^#坝粘土填筑干密度值及施工偶然异常波动,早期提出警报,以保证土坝的施工质量。  相似文献   
7.
Novel polyurethane insulating coatings were prepared from the reaction of glycerin‐terminated polyurethane prepolymers (GPUPs) and a blocked isocyanate curing agent (BIC). The GPUPs were prepared from the reaction of one equivalent of polycaprolactone polyol (CAPA 210) with an excess amount of 4,4′‐methylene bis(phenyl isocyanate) (MDI) and subsequent reaction of the NCO‐terminated polyurethane with glycerin. The BIC was prepared from the reaction of trimethylol propane (TMP), toluene diisocyanate (TDI) and N‐methylaniline (NMA). The polyols and curing agent were characterized by conventional methods while the curing condition was optimized via gel content measurements. The curing kinetics of the polyurethane coating were investigated and the kinetic parameters derived. The crosslink densities of the samples were determined via the equilibrium swelling method, using the Flory–Rehner equation. The relationships between the crosslink density and the electrical, physical, mechanical and dynamic mechanical properties of the coatings were also studied. Copyright © 2005 Society of Chemical Industry  相似文献   
8.
Lignin was graft copolymerized with methyl methacrylate using manganic pyrophosphate as initiator. This modified lignin was then blended (up to 50 wt%) with low density polyethylene (LDPE) using a small quantity of poly[ethylene‐co‐(glycidyl methacrylate)] (PEGMA) compatibilizer. The mechanical properties of the blend were substantially improved by using modified lignin in contrast to untreated lignin. Differential scanning calorimetry studies showed loss of crystallinity of the LDPE phase owing to the interaction between the blend components. Thermogravimetric analysis showed higher thermal stability of modified lignin in the domain of blend processing. This suggested that there is scope for useful utilization of lignin, which could also lead to the development of eco‐friendly products. Copyright © 2005 Society of Chemical Industry  相似文献   
9.
Industrial pelletizing of sawdust was carried out as a designed experiment in the factors: sawdust moisture content, fractions of fresh pine, stored pine and spruce. The process parameters and response variables were energy consumption, pellet flow rate, pellet bulk density, durability and moisture content. The final data consisted of twelve industrial scale runs. Because of the many response variables, data evaluation was by principal component analysis of a 12 × 9 data matrix. The two principal component model showed a clustering of samples, with a good reproducibility of the center points. It also showed a positive correlation of energy consumption, bulk density and durability all negatively correlated to flow rate and moisture content. The stored pine was more related to high durability and bulk density. The role of the spruce fraction was unclear. The design matrix, augmented with the process parameters was a 12 × 6 matrix. Partial least squares regression showed excellent results for pellet moisture content and bulk density. The model for durability was promising. A 12 × 21 data matrix of fatty- and resin acid concentrations measured by GC–MS showed the differences between fresh and stored pine very clearly. The influence of the spruce fraction was less clear. However, the influence of the fatty- and resin acids on the pelletizing process could not be confirmed, indicating that other differences between fresh and stored pine sawdust have to be investigated. This work shows that it is possible to design the pelletizing process for moderate energy consumption and high pellet quality.  相似文献   
10.
3-D MCM封装技术及其应用   总被引:1,自引:0,他引:1  
介绍了超大规模集成电路(VLSI)用的3-D MCM封装技术的最新发展,重点介绍了3-D MCM封装垂直互连工艺,分析了3-D MCM封装技术的硅效率、复杂程度、热处理、互连密度、系统功率与速度等问题,并对3-D MCM封装的应用作了简要说明。  相似文献   
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