CMP系统技术与市场

概述了CMP系统技术的发展历史、发展趋势以及在IC生产中的重要性,介绍了国外CMP设备主要制造厂家的设备型号和性能及CMP设备市场分布和需求,阐述了CMP系统技术的基础研究、关键技术和国内研究概况。     

Chemical mechanical polishing of polymer films

Strategies to reduce capacitance effects associated with shrinking integrated circuit (IC) design rules include incorporating low resistivity metals and insulators with low dielectric values, or “low-κ” materials. Using such materials in current IC fabrication schemes necessitates the development of reliable chemical mechanical polishing (CMP) processes and process consumables tailored for them. Here we present results of CMP experiments performed on FLARE™ 2.0 using a specialized zirconium oxide (ZrO₂) polishing slurry. FLARE™ 2.0 is a poly(arylene) ether from AlliedSignal, Inc. with a nominal dielectric constant of 2.8. In addition, we provide insight into possible removal mechanisms during the CMP of organic polymers by examining the performance of numerous abrasive slurries. Although specific to a limited number of polymers, the authors suggest that the information presented in this paper is relevant to the CMP performance of many polymer dielectric materials.     

CA系统的设计

目前网上身份识别主要采用通过认证中心（CA）对申请证书的用户发放电子证书的方式。本文介绍了依据现有国际标准,能够生成、管理、发放X509（V3.0）证书的认证中心（CA）系统的设计。     

C-AMTE: A location mechanism for flexible cache management in chip multiprocessors

This paper describes Constrained Associative-Mapping-of-Tracking-Entries (C-AMTE), a scalable mechanism to facilitate flexible and efficient distributed cache management in large-scale chip multiprocessors (CMPs). C-AMTE enables fast locating of cache blocks in CMP cache schemes that employ one-to-one or one-to-many associative mappings. C-AMTE stores in per-core data structures tracking entries to avoid on-chip interconnect traffic outburst or long distance directory lookups. Simulation results using a full system simulator demonstrate that C-AMTE achieves improvement in cache access latency by up to 34.4%, close to that of a perfect location strategy.     

一种面向多核系统的并行计算任务分配方法

随着多核处理器的普及,目前的大规模并行处理系统普遍采用多核处理器,这对于资源管理和调度提出了更高的要求.提出了基于共享Cache资源划分的方法,建立了面向多核处理器支持Cache资源分配的进程调度模型,设计并实现了并行任务到多核处理器的映射算法,更好地解决了大规模资源管理系统中面向多核处理器的任务分配问题,降低了使用共享Cache的多个进程运行时的相互干扰,提升了应用程序性能.     

Filtering directory lookups in CMPs

Coherence protocols consume an important fraction of power to determine which coherence action to perform. Specifically, on CMPs with shared cache and directory-based coherence protocol implemented as a duplicate of local caches tags, we have observed that a big fraction of directory lookups cause a miss, because the block looked up is not allocated in any local cache. To reduce the number of directory lookups and therefore the power consumption, we propose to add a filter before the directory access.We introduce two filter implementations. In the first one, filtering information is explicitly kept in the shared cache for every block. In the second one, filtering information is decoupled from the shared cache organization, so the filter size does not depend on the shared cache size.We evaluate our filters in a CMP with 8 in-order processors with 4 threads each and a memory hierarchy with write-through local caches and a shared cache. We show that, for SPLASH2 benchmarks, the proposed filters reduce the number of directory lookups performed by 60% while power consumption is reduced by ∼28%. For Specweb2005, the number of directory lookups performed is reduced by 68% (44%), while directory power consumption is reduced by 19% (9%) using the first (second) filter implementation.     

磨料对计算机硬盘NiP基板CMP质量的影响

磁盘表面质量直接影响了硬盘的磁存储密度,表面须达到优异的表面光滑度、没有表面缺陷.本文通过对镍磷基板的化学性质分析,讨论了其CMP机理,分析了浆料中的磨料在硬盘基板CMP中的重要性,指出浆料中的磨料不仅起到了机械研磨的作用,同时也充当了微型搅拌器的作用;通过实验分析了碱性浆料下磨料的浓度和粒径对镍磷基板CMP去除速率与表面粗糙度的影响;选用小粒径、低硬度的二氧化硅水溶胶磨料实现了较高的去除速率和较低的表面粗糙度.     

片上多核处理器共享末级缓存动静结合地址映射机制

片上多核处理器(CMP)通常采用私有或者共享的末级高速缓存(cache)结构,而共享末级cache一般使用静态地址映射机制。该机制将各处理器临时私有访问的数据映射于分布在其他处理器的末级cache中,使得各处理器对临时私有数据的访问延时增加。针对该问题,提出了一种动静结合的共享末级cache地址映射方法。该方法可将原来静态映射于其他处理器末级cache中的临时私有数据动态映射于访问者处理器的本地末级cache中,减少了大量静态映射所造成的长延时非本地末级cache访问,从而有效降低了整个共享末级cache的访问延时,在提高性能的同时降低了功耗和带宽使用。实验结果表明,动静结合的地址映射方式应用于采用环连接互连结构和侦听顺序环协议的CMP结构时,可获得的平均性能提升为9%,最大性能提升为38%。     

红外光学终点检测的研究

终点检测是化学机械平坦化的关键技术,它决定着理想的平坦运行的停止点,在以纳米级别的控制上,终点检测尤为重要。目前主要的两种终点检测方法:电机电流存在着误判断,而可见光干涉存在着光蚀效应等。低能量的红外检测根据不同介质及同种介质不同厚度的红外吸收和反射系数不同的原理精确地选择平坦化终点完全克服以上检测手段的不足。阐述了其原理,设计了其硬件原理图,定性分析了红外测量曲线,并指出今后终点检测的方向。     

O／R mapping技术比较研究

针对当前出现的越来越多的O/R Mapping技术,对其中影响最大的几种实现技术进行了深入的研究,并通过实验数据对它们进行了详细的分析和比较。