Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

光缆接续损耗的工程控制

本从影响光纤损耗的主要因素分析着手，提出了光缆接续损耗工程控制的简洁有效的方法。     

Numerical Study of Finite Element Method Based Solutions for Propagation of Wetting Fronts in Unsaturated Soil

The accurate prediction of the propagation of a wetting front in an unsaturated soil subjected to surficial infiltration is of practical importance to many geotechnical and geoenvironmental problems. The finite element method is the most common solution technique as the hydraulic soil properties are highly nonlinear. Two important issues are often found to create difficulties in such analyses. First, numerical oscillations are usually observed in the calculated pore pressures at the wetting front. Second, when a reasonable mesh size and time step are used, the elevation of the wetting front may be seriously overpredicted. This paper is focused on the second issue. The under-relaxation (UR) technique used in the iterative process within each time step is found to have a serious impact on rate of convergence with refinement in mesh size and time step. Two different techniques are typically used; the first evaluates the hydraulic conductivity using an average of heads calculated from the preceding time node and the most recent iteration of the current time node (UR1), and the second evaluates the hydraulic conductivity using the average of heads calculated from the two most recent iterations of the current time nodes (UR2). The study shows that UR1, which is adopted in programs such as SEEP/W, ensures that the solution converges rapidly to a stable solution within a time step, but may converge to the wrong wetting front at a given elapsed time unless a sufficiently refined mesh is used. UR2 converges much more slowly within a time step, but the error in the wetting front is smaller than that generated by UR1.     

Delay-dependent state estimation for delayed neural networks

In this letter, the delay-dependent state estimation problem for neural networks with time-varying delay is investigated. A delay-dependent criterion is established to estimate the neuron states through available output measurements such that the dynamics of the estimation error is globally exponentially stable. The proposed method is based on the free-weighting matrix approach and is applicable to the case that the derivative of a time-varying delay takes any value. An algorithm is presented to compute the state estimator. Finally, a numerical example is given to demonstrate the effectiveness of this approach and the improvement over existing ones.     

从菜西瓜中提取果胶的最佳工艺研究

为确定从菜西瓜中提取果胶的最佳工艺条件,以山西省临汾市菜西瓜为材料,采用酸法进行了提取果胶的试验研究。正交试验结果表明:在萃取时间为45min的前提下,从瓜瓤中提取果胶的最佳工艺条件是加水量为原料重量的4倍,85℃下,添加原料重量0.3％的多聚磷酸钠,果胶得率可达2.03％;从外果皮中提取果胶,加水量为原料重量的4倍,75℃下,添加原料重量0.7％的多聚磷酸钠,果胶得率可达2.98％。     

马兰矿南五采区煤仓施工技术

介绍了马兰矿南五采区煤仓施工方法,认为利用反井钻机施工煤仓,工艺简单、安全高效,同时就煤仓施工中存在的问题提出了建议.     

入侵检测及网络层安全的研究

随着计算机网络的迅速发展，网络安全问题正变得日益重要。文章介绍了计算机网络系统IP层安全概况和入侵者对IP层常采用的入侵手段，以及为防止这种入侵所采取的措施。     

略论中国传统合院住宅形式的固化与沿用

合院式住宅是中国人沿用了二千多年的典型形制，除了其能满足采光、通风的要求和建造相对简化外，中国传统社会早期的中霤祭祀和以五行为基本元素的统括万物的宇宙模式对于中国式合院住宅的固化与沿用，也起了不可忽视的作用。     

尼龙66高强力轻型帘布的开发与应用

神马尼龙66高强力轻型帘布在保持帘布高强力、尺寸稳定性、耐热性、耐疲劳、耐冲击的良好特性的前提下，采用SNT高强度工业丝生产技术，充分挖掘工业丝的强力优势，把富余的强力通过进一步降低纤维密度转化为帘布面积优势的扩大，从而提高轮胎生产的帘布出胎率，使轮胎生产厂享受尼龙66帘布品质的同时，实现降低成本的目的。