基于DTW改进算法的孤立词识别系统的仿真与分析

传统的DTW算法在进行孤立词语音识别时着重于时间规整和语音测度的计算，而没有对数据的可靠性和有效性进行分析。本文提出了一种改进的端点检测算法，并采用一种改进的DTW算法，在计算机上进行了仿真。实验结果表明采用改进后的DTW算法有效的降低了识别时间和存储数据量，提高了系统性能。     

基于承包商预期收益不变的不平衡报价模型

在招标实践中,通常采用最低价中标原则,使得投标人不得不压低其投标价格。基于承包商预期收益不变的不平衡报价模型,是在“工程量清单报价”的条件下,考虑到施工中工程量的变化及施工顺序的影响,体现了资金的时间价值,在保持承包商预期收益不变的前提下,通过调整各分项工程的单价,来降低工程报价,以增加中标机会而建立的。所建立的模型简单,易于操作,并配以具体的工程实例,通过计算机求得其最优解,可供承包商投标报价时参考。     

炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

Effect of modified atmosphere packaging on the shelf-life of coated, whole and sliced mushrooms

Whole and sliced fresh mushrooms (Agaricus bisporus) were packaged with PVC wrap or two polyolefins (PD-941 and PD-961) films after coating with CaCl₂ and chitosan. Package gas composition, color, weight loss and maturity were measured during storage at 12 °C and 80%RH. For PD-961, the highest in-package concentration occurred during the first day of storage regardless of treatments, while wrap and PD-941 showed varying degrees in-package concentration with different processes and coatings. The whiteness of whole mushrooms varied significantly with the type of coating, but not with the type of films. The extent of darkening was greater in coated whole mushrooms than in sliced ones. Weight loss occurred in all packages and varied from 3 (g/100 g) to about 7 (g/100 g) after 6 days of storage. Due to a lower permeability, PD-961 packages had the lowest weight loss. The type of packaging films significantly affected the maturity index, where PD-961 most effectively lowered maturity index for both whole and sliced mushrooms, thus extending the shelf-life. The type of coating did not appear to affect maturity index except for the wrap package where chitosan coating markedly lowered the maturity index of sliced mushrooms.     

可拆装高架火炬的应用

结合工程实例,介绍了我国第一座可拆装高架火炬的基本原理及组成,并对可拆装高架火炬与普通高架火炬在安全、技术、安装、维修、占地面积、投资等方面进行了比较,还分析了高架火炬未来的发展趋势.     

胡桃夹子

富于节日喜庆气氛的芭蕾舞剧《胡桃夹子》录音、录像繁多。这个伦敦科文特花园歌剧院芭蕾舞团的2000年的现场录像与其它版本比较，     

Passive alignment method of polymer PLC devices by using a hot embossing technique

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.     

基于TMS320VC5410的最小系统设计

TMS320VC5410是TI公司生产的一款定点数字信号处理(DSP)芯片。基于DSP的最小系统是以其简洁的硬件结构来实现DSP的一般功能,广泛应用于工业生产、教学、科研、电子设计等领域。主要介绍了基于TMS320VC5410的最小系统硬件电路设计方案,阐述了重要电路部分的抗干扰设计和软件调试过程中应注意的若干问题。最后提出了简单易行的软件调试方法以及部分程序代码。