Interview mit Hans-Christian Boos zum Thema „Unternehmertum in der IT-Branche“

Ohne Zusammenfassung     

Modellierungs- und Simulationsverfahren für die optische Verbindungstechnik auf elektrischen Leiterplatten

Optical interconnection technology on the printed circuit board level is a key technology for future microelectronic equipment. The consideration of functional, technological, and economical requirements results in a hybrid solution, where electrical and optical interconnects are integrated into one substrate called electrical optical printed circuit board. The significant part of the entire design process for electrical optical printed circuit boards is marked by the design supporting modelling and simulation of optical interconnects. Based on an abstract model for an entire optical interconnect a simulation model for optical multimode-waveguides is presented, taking into account all significant waveguide properties. Apart from that, the modeling of active components (laser- and photo-diodes) is addressed.     

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Anisotropic mesh adaption by metric‐driven optimization

We describe a Gauss–Seidel algorithm for optimizing a three‐dimensional unstructured grid so as to conform to a given metric. The objective function for the optimization process is based on the maximum value of an elemental residual measuring the distance of any simplex in the grid to the local target metric. We analyse different possible choices for the objective function, and we highlight their relative merits and deficiencies. Alternative strategies for conducting the optimization are compared and contrasted in terms of resulting grid quality and computational costs. Numerical simulations are used for demonstrating the features of the proposed methodology, and for studying some of its characteristics. Copyright © 2004 John Wiley & Sons, Ltd.