Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures

Focused ion beam (FIB) and nano-probing were applied for failure analysis of three-dimensional stacked circuits with copper through-silicon-vias between the stacked chips. The failure analysis was done after high temperature storage and thermal cycling tests. Passive voltage contrast in FIB allowed to pinpoint the open sites. FIB cross-sections showed the presence of opens at the bottom of the copper vias. The failure cause was suspected to be an interlayer particle, which was confirmed by optical profilometry. Nano-probing was used on another sample to pinpoint the failure location through the measurement of the local resistance within the daisy chains. The failure was traced out to be related with surface contamination.     

An Implicit Multistage Integration Method Including Projection for the Numerical Simulation of Constrained Multibody Systems

To be efficient, the simulation of multibody system dynamics requires fast and robust numerical algorithms for the time integration of the motion equations usually described by Differential Algebraic Equations (DAEs). Firstly, multistep schemes especially built up for second-order differential equations are developed. Some of them exhibit superior accuracy and stability properties than standard schemes for first-order equations. However, if unconditional stability is required, one must be satisfied with second-order accurate methods, like one-step schemes from the Newmark family.Multistage methods for which high accuracy is not contradictory with stringent stability requirements are then addressed. More precisely, a two-stage, third-order accurate Implicit Runge–Kutta (IRK) method which possesses the desirable properties of unconditional stability combined with high-frequency dissipation is proposed.Projection methods which correct the integrated estimates of positions, velocities and accelerations are suggested to keep the constraint equations satisfied during the numerical integration. The resulting time integration algorithm can be easily implemented in existing incremental/iterative codes. Numerical results indicate that this approach compares favourably with classical methods.     

Temperature-insensitive polarimetric vibration sensor based on HiBi microstructured optical fiber

A new type of highly birefringent microstructured optical fiber has been tested for vibration measurements using a polarimetric technique. This technique takes advantage of the stress-induced phase shift between the two orthogonally polarized fiber eigenmodes. Comparison of three different fiber types shows that standard single-mode fibers do not provide stable measurements and that conventional polarization-maintaining fibers lead to a significant cross-sensitivity to temperature. However, for highly birefringent microstructured fibers specifically designed to provide a temperature-independent birefringence, our experiments show repeatable vibration measurements over a frequency range extending from 50?Hz to 1?kHz that are unaffected by temperature variations (up to 120?°C).     

The construction of cubature formulae for a family of integrals: A bifurcation problem

Cubature formulae of degree 11 with minimal numbers of knots for the integral $$\int\limits_{ - 1}^1 { \int\limits_{ - 1}^1 {(1 - x^2 )^\alpha } } (1 - y^2 )^\alpha f(x,y) dxdy \alpha > - 1$$ which are invariant under rotation over an angle π/2 are determined by a system of 18 nonlinear equations in 18 unknowns. We start with a known solution for this system for α=0. By varying α smoothly, the knots and weights of the cubature formula vary smoothly except in the singular solutions such as turning points and bifurcation points where new solutions branches arise. We use for this purpose the program AUTO. We obtain surprisingly many branches of cubature formulae.     

Implications of an adjustable bed height during standard nursing tasks on spinal motion, perceived exertion and muscular activity

Manual handling is a source of occupational stress, particularly for nursing personnel. High levels of biomechanical strain are associated with lifting and transferring patients, especially when the tasks are performed in flexed and twisted positions that induce an increased risk of functional and musculoskeletal problems. The use of adjustable beds in nursing practice has been suggested as a means of influencing working postures and reducing the muscular demands on nurses. The purpose of this study was to investigate the effects on spinal motion, muscular activity and perceived exertion when nurses had the opportunity to adjust bed height. The measures recorded during the conduct of standardized patient handling tasks were the changes in posture (inclination) and in shape (sagittal bending, side bending, axial rotation). Muscular activity was measured using surface electromyography. Perceived exertion was rated using the 15-graded Borg scale. The range of motion was not influenced by the adjustment of bed height, but rather a shift of the time duration histogram was noticed in the direction of the erect, safer position. The time spent in the safe zone of spinal motion near the erect position was significantly increased and was significantly decreased in the potential health-hazardous zones of spinal motion in the extreme positions. No differences in muscular activity or in perceived exertion were found between the two bed height conditions for any of the muscle groups. It was concluded that the quality of spinal motion is enhanced when the opportunity of adjusting the bed height is offered.     

A Novel Mechanism of Embrittlement Affecting the Impact Reliability of Tin-Based Lead-Free Solder Joints

This work addresses a new mode of brittle failure that occurs in the bulk of tin-based lead-free solder joints, unlike the typical brittle failures that occur in the interfacial intermetallics. Brittle failures in the joint bulk result from the low-temperature ductile-to-brittle transition in the fracture behavior of β-tin. The bulk embrittlement of these joints is discussed by referring to the results of impact tests performed on both solder joints and bulk solder specimens. The mechanism of bulk embrittlement is largely explained based on the results of a fractography study performed on the bulk joint failures using scanning electron microscopy.