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1.
A BiCMOS logic circuit applicable to sub-2-V digital circuits has been developed. A transiently saturated full-swing BiCMOS (TS-FS-BiCMOS) logic circuit operates twice as fast as CMOS at 1.5-V supply. A newly developed transient-saturation technique, with which bipolar transistors saturate only during switching periods, is the key to sub-2-V operation because a high-speed full-swing operation is achieved to remove the voltage loss due to the base-emitter turn-on voltage. Both small load dependence and small fan-in dependence of gate delay time are attained with this technique. A two-input gate fabricated with 0.3-μm BiCMOS technology verifies the performance advantage of TS-FS-BiCMOS over other BiCMOS circuits and CMOS at sub 2-V supply  相似文献   
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3.
Stationary projectors mainly used in system applications have recently gained a wider application range, including general presentations in halls and large conference rooms and being used, for example, in digital signage and for monitoring purposes. Consequently, they are required to meet new market demands for durability, reliability, and flexibility in installation in addition to their conventional basic performance such as especially high brightness. To achieve especially high brightness, a new optical system with two lamps is proposed; the profile of the cover glass that prevents the glass from scattering is made aspherical, the profile of the beam‐combining mirror is improved with its position optimized, and the size of the incident plane of the integrator rod is made larger (1.1 times). These measures resulted in an optical system of an even higher efficiency with 7000 lm, which is the highest in its class (according to a June 2010 investigation). Also, the arrangement of two parallel lamps completely eliminated the effect of heat passing from one lamp to the other, which helped secure durability, reliability, and flexibility in installation. Furthermore, the combined use of the unique non‐telecentric optical system, adopted from the conventional single‐lamp model, helps maintain the class‐highest contrast ratio.1,2  相似文献   
4.
Estimation procedure for the Weibull parameters used in the local approach   总被引:3,自引:0,他引:3  
The local approach was recently proposed by Beremin and Mudry for evaluating the statistical behaviour of toughness results of materials. This approach introduces a stress parameter w , termed the Weibull stress, as a measure of the fracture resistance of materials instead of the conventional toughness parameters such as K c, c and J cl (critical stress intensity factor, CTOD and J-integral, respectively). The Weibull stress w obeys the Weibull distribution with the two parameters m and u (the shape and the scale parameter, respectively). The first parameter m is normally estimated to be 22 irrespective of the kind of material. In this paper a procedure for the determination of the Weibull parameters m and u is developed. This procedure consists of the determination of the plastic zone ahead of the crack tip, from which cleavage fracture originates, and of the maximum likelihood estimation of the parameters m and u based on the stress distribution in the plastic zone. Calculations using this procedure confirm that the distribution of the Weibull stress w is a material property independent of specimen thickness, and in particular that the shape parameter m depends on the material, e.g. m12 for a German reactor pressure vessel steel (20 Mn Mo Ni 5 5). Using these parameters for the distribution of the Weibull stress the size effect in fracture toughness values is predicted and an improved agreement between theory and experiments is obtained compared to the Weakest Link model.  相似文献   
5.
The crystal structure of urea-polyethylene complex in the hexagonal form, obtained by one of our preparation methods, is analysed by X-ray power diffractometry. In this analysis, the fixed molecular parameters of urea are used, and three models with respect to rotational disorder of the guest polyethylene molecule are assumed. It is shown that the host lattice structure constructed by urea molecules is essentially the same as that of urea-n-paraffin complex. Effects of the disorder structure of the guest on X-ray scattering of the complex are presented. However, there is a difficulty in identifying the disorder structure by X-ray analysis. With the aid of a potential energy calculation between the hexagonal urea tunnel and the guest molecule, a rotational disorder model is preferred.  相似文献   
6.
A new technique combining a thermal-image furnace and a twin roller is described for quenching the melt to form glass. The technique was applied to the simple system Li2O-SiO2, since its fundamental parameters in the estimation of critical cooling rate are available. Glass flakes were obtained in the composition Li4SiO4, for which a very large critical cooling rate (∼109 K·s−1) was needed for glass formation.  相似文献   
7.
Nitrous oxide (N2O) emission from fertilized maize fields was measured using a closed chamber at four experimental sites in Thailand. The average measured N2O flux from unfertilized plots through crop season was 4.16 ± 1.52, 5.05 ± 1.65, 5.25 ± 1.68 and 6.74 ± 2.95 g N2O-N m-2 h-1, at Nakhon Sawan, Phra Phutthabat, Khon Kaen and Chiang Mai, respectively. Increased N2O emissions by the application of nitrogen fertilizer were 0.22–0.44, 0.19–0.38%, 0.12–0.24 and 0.08–0.15% of the applied N, respectively. Compared to other data, N2O emission rate to applied nitrogen was not significantly different between the data of Thailand and the Temperate Zone.  相似文献   
8.
The gel-size dependence of microphase separation in weakly-charged gels of N-isopropylacrylamide (NIPA) and 1-vinylimidazole (VI) copolymers has been investigated using swelling measurement, small-angle neutron scattering (SANS), and dynamic and static light scattering (DLS/SLS). It is known that weakly-charged polymer gels undergo microphase separation in a poor solvent as a result of competing interactions involving hydrophobic attraction versus electrostatic repulsion. The microphase separation is characterized by a scattering maximum in SANS intensity functions of which Bragg spacing, Λ, is around 20-30 nm. However, when gel size was reduced to the order of Λ, no microphase separation was observed. Instead, a typical scattering of isolated spherical particles was clearly observed. On the basis of the experimental evidence, we conclude that microphase separation has its own wavelength independent of gel size, and nanometer-order gels, i.e., nanogels, do not undergo microphase separation.  相似文献   
9.
A polyimide-based process for the fabrication of vertical structures with high aspect ratio has been developed. O2 reactive ion etching (O2 RIE) has been employed in the polyimide processing. Achieved etching characteristics of the O2 RIE system are: 4.0 m/min etching rate, 15 aspect ratio, 75 m etching depth. Polyimide has excellent chemical and thermal properties which makes it a good building material for micromachines. Polyimide could be also used as molds for electroplating. Electroplated copper structures were formed in the polyimide molds and metal gears were fabricated by these fabrication technologies. New possibilities for micromachining were opened by the use of O2 RIE and electroplating.This work was supported by Japanese ministry of Education Science and Culture under a grant-in-Aid No. 03102001.  相似文献   
10.
Thick silica films were prepared by the electrophoretic sol–gel deposition technique in the presence of poly(acrylic acid) (PAA) using monodispersed silica particles; the particles were prepared by the sol–gel method, pre-heat treated and then re-dispersed in the mixture of H2O and ethanol. The weight of deposited silica films was maximized when 0.2 mass % of PAA against the whole amount of sol was added. The particles constructing the thick silica films were packed densely when the amount of added PAA was less than 0.2 mass%. The weight of the film increased with decrease in the content of H2O in the sol when a fixed amount of PAA was added. After the heat treatment of deposited films at 800 °C, crack-free silica films of about 30 m thickness were prepared. © 1998 Chapman & Hall  相似文献   
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