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1.
A logic language is suitable for specification if it is equipped with features for data abstraction and modularization. In this paper, an effective mechanism to incorporate function and type into logic programming is presented as the means to embed data abstraction mechanism into logic programming. This incorporation is essentially based on Horn clause logic with equality and a polymorphic type system that is an extension of Mycroft and O’Keefe’s system. This paper also presents an implementation based on Warren Abstract Machine (WAM) and shows the performance, along with a comparison with WAM.  相似文献   
2.
The change in the thickness and chemical states of the interfacial layer and the related electrical properties in Ta2O5 films with different annealing temperatures were investigated. The high-resolution transmission electron microscopy and X-ray photoelectron spectroscopy analyses revealed that the 700 °C-annealed Ta2O5 film remained to be amorphous and had the thinnest interfacial layer which was caused by Ta-silicate decomposition to Ta2O5 and SiO2. In addition, the electrical properties were improved after annealing treatments. Our results suggest that an annealing treatment at 700 °C results in the highest capacitance and the lowest leakage current in Ta2O5 films due to the thinnest interfacial layer and non-crystallization.  相似文献   
3.
Neural Computing and Applications - In recent years, the design of social software UI has become a design research focus in the field of design. Color affects many factors in UI design. However,...  相似文献   
4.
Constant elongation rate tests (CERTs) were carried out to investigate the effects of environmental factors of dissolved oxygen and temperature on the stress corrosion cracking (SCC) susceptibility of 3.5NiCrMoV turbine steels. Tests were conducted in pure water of various dissolved oxygen concentrations at temperatures of 50 °C-200 °C in the range of strain rates from 5 × 10−8/s to 1 ×  10−6/s. Dissolved oxygen significantly affected the SCC susceptibility of turbine steels in water. The SCC susceptibility of the turbine steels increases as the dissolved oxygen concentration in water increases. The elongation of the turbine steels tested in aerated water at 150 °C at a strain rate of 1 × 10−7/s decreased to half of that of the steels tested in deaerated water in the same test condition. And the SCC susceptibility of the steels increased with decreasing strain rate, and with increasing temperature. The increase of the SCC susceptibility of the turbine steels in the higher dissolved oxygen environment is considered to be due to the higher content of dissolved oxygen enhancing the reduction reactions of oxygen on the metal surfaces (cathode) and accelerating the dissolution rate at the crack tips (anode) by galvanic attack of an aeration cell.  相似文献   
5.
A pilot-scale sludge treatment plant was built to investigate the feasibility of ozonation processes for waste activated sludge treatment. Ozonation of wastewater sludge resulted in mass reduction by mineralization as well as by supernatant and filtrate recycle. Another advantage of sludge ozonation is a significant improvement of settleability and dewaterability. Experimental results showed that mass reduction of 70% and volume reduction of 85% compared with the control sludge was achieved through the sludge ozonation at a dose of 0.5?gO3/gDS. It is also interesting to note that the filterability deteriorates up to ozone dose of 0.2?gO3/gDS and then improves considerably at a higher ozone dose. The filterability could be improved by chemical conditioning even at a low ozone dose. The economic feasibility by cost analysis reveals that ozonation processes can be more economical than other alternative processes for sludge treatment and disposal at small-sized wastewater treatment plants.  相似文献   
6.
We have developed an InAlAs/InGaAs metamorphic high electron mobility transistor device fabrication process where the gate length can be tuned within the range of 0.13 μm–0.16 μm to suit the intended application. The core processes are a two-step electron-beam lithography process using a three-layer resist and gate recess etching process using citric acid. An electron-beam lithography process was developed to fabricate a T-shaped gate electrode with a fine gate foot and a relatively large gate head. This was realized through the use of three-layered resist and two-step electron beam exposure and development. Citric acid-based gate recess etching is a wet etching, so it is very important to secure etching uniformity and process reproducibility. The device layout was designed by considering the electrochemical reaction involved in recess etching, and a reproducible gate recess etching process was developed by finding optimized etching conditions. Using the developed gate electrode process technology, we were able to successfully manufacture various monolithic microwave integrated circuits, including low noise amplifiers that can be used in the 28 GHz to 94 GHz frequency range.  相似文献   
7.
This study presents design optimization of a viscous micropump with two rotating cylinders. The desired performance of the pump is to maximize the pumping efficiency while satisfying the constraints on flow rate and geometry. As a preliminary step, the effects of geometric configurations on the pumping performance are investigated by carrying out parametric studies using an unstructured grid Navier–Stokes method. Next, an optimization problem is formulated to determine the design variable values which maximize the pumping efficiency subject to the constraints. Then, a computational procedure, combining the analysis method with a sequential metamodel-based optimization method, is established to solve the optimization problem formulated. Finally, this procedure is applied to the optimization of ten design cases with varying flow rates specified. The optimization results demonstrate the effectiveness of the design optimization method presented in this study by showing that the efficiencies of the optimally designed micropumps are enhanced without any constraint violations.  相似文献   
8.
In this work, Ti/Ni bilayer contacts were fabricated on both p +- and n +-4H-SiC formed by ion implantation, and the effects of the Ti interlayer on the contact resistance and interfacial microstructure were studied. Adoption of a thin (10 nm) Ti interlayer resulted in specific contact resistance of 4.8 μΩ cm2 and 1.3 mΩ cm2 on n +- and p +-4H-SiC, respectively, comparable to the values for contacts using only Ni. Moreover, contacts using Ti/Ni provide a flat and uniform interface between Ni2Si and SiC, whereas discontinuous, agglomerated Ni2Si islands are formed without the use of a Ti interlayer. In addition, the Ti interlayer was demonstrated to effectively dissociate the thin oxide film on SiC, which is advantageous for low-resistance, reliable ohmic contact formation. In summary, use of a Ti/Ni bilayer is a promising solution for one-step formation of ohmic contacts on both p +- and n +-4H-SiC, being especially suitable for SiC n-channel metal-oxide-semiconductor field-effect transistor (nMOSFET) fabrication.  相似文献   
9.
10.
We investigated the effects of ion exchange resins on the efficiency of crystallization with an increased surface area for the purification of vancomycin. As surface area-increasing materials, diverse types of ion exchange resin were used to increase the surface area per working volume (S/V). When the S/V was increased, in cation exchange resin Amberlite 200, Amberlite IR 120 (Na), and Amberlite IRC 50 and in anion exchange resin Amberlite IRA 400 (Cl) and Amberlite IRA 910 (Cl), vancomycin crystals were successfully generated. The yield of vancomycin increased (>97%), and the time necessary for crystallization was reduced dramatically (reduced from 24 hr to 12 hr). On the other hand, the purity of the vancomycin was approximately 95% and was not affected by increasing S/V. Use of an ion exchange resin also resulted in the production of smaller vancomycin crystals than in the absence of ion exchange resin.  相似文献   
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