儿童用品TBT通报数据可视化预警研究

探索采用数据可视化技术分析儿童用品TBT通报数据,以可视化图形图像呈现通报热点并揭示趋势信息,提出对策与建议,助力为儿童用品产业升级、TBT预警数据分析和信息传播工作提供新思路,提高中小企业的国外市场准入机会。     

制备条件对硅基介孔分子筛孔结构的影响

采用溶剂热法制备了硅基介孔分子筛材料,较系统地考察了晶化温度、晶化时间及焙烧温度等因素对其结构的影响,并利用N2吸附手段进行了表征.结果表明,晶化温度和晶化时间能明显影响硅基介孔材料的结构,而过高的焙烧温度易导致介孔结构的塌陷.     

炼油厂全流程优化建模方法研究

为了克服使用线性规划和单处理单元非线性规划进行生产优化的内在缺点，在建立原油单元、催化裂化、催化重整和汽油调合等4个重要处理单元详细模型的基础上，将单处理单元非线性过程模型集成到一个全流程优化非线性模型中。优化的目标函数是使炼油厂全厂利润最大。决策变量是那些显著影响全厂效益的变量，约束条件是单个处理单元约束条件的集合。对某炼油厂进行实例研究，结果表明该全流程模型能有效处理全厂优化问题，所得利润在线性规划的基础上提高4．5％。     

Applications and Technologies of All-Solid State Blue Laser

1 Introduction Along with the matureness of laser diode (LD) manufacturing technology, the performance of LD has been improved greatly since 1980s, so various kinds of laser devices based on LD have been developed rapidly, especially the all-solid state lasers. After early experiments and researches, the all-solid state lasers have been commercialized successfully.     

Effect of modified atmosphere packaging on the shelf-life of coated, whole and sliced mushrooms

Whole and sliced fresh mushrooms (Agaricus bisporus) were packaged with PVC wrap or two polyolefins (PD-941 and PD-961) films after coating with CaCl₂ and chitosan. Package gas composition, color, weight loss and maturity were measured during storage at 12 °C and 80%RH. For PD-961, the highest in-package concentration occurred during the first day of storage regardless of treatments, while wrap and PD-941 showed varying degrees in-package concentration with different processes and coatings. The whiteness of whole mushrooms varied significantly with the type of coating, but not with the type of films. The extent of darkening was greater in coated whole mushrooms than in sliced ones. Weight loss occurred in all packages and varied from 3 (g/100 g) to about 7 (g/100 g) after 6 days of storage. Due to a lower permeability, PD-961 packages had the lowest weight loss. The type of packaging films significantly affected the maturity index, where PD-961 most effectively lowered maturity index for both whole and sliced mushrooms, thus extending the shelf-life. The type of coating did not appear to affect maturity index except for the wrap package where chitosan coating markedly lowered the maturity index of sliced mushrooms.     

可拆装高架火炬的应用

结合工程实例,介绍了我国第一座可拆装高架火炬的基本原理及组成,并对可拆装高架火炬与普通高架火炬在安全、技术、安装、维修、占地面积、投资等方面进行了比较,还分析了高架火炬未来的发展趋势.     

胡桃夹子

富于节日喜庆气氛的芭蕾舞剧《胡桃夹子》录音、录像繁多。这个伦敦科文特花园歌剧院芭蕾舞团的2000年的现场录像与其它版本比较，     

Passive alignment method of polymer PLC devices by using a hot embossing technique

A novel fabrication process using a hot embossing technique has been developed for micromechanical passive alignment of polymer planar lightwave circuit (PLC) devices. With only one step of embossing, single-mode waveguide straight channels and micropedestals for passive aligning are simultaneously defined on a polymer thin film with an accuracy of /spl plusmn/0.5 /spl mu/m. This process reduces the steps for fabricating alignment structures. A fabricated polymer PLC chip and fibers are combined on a v-grooved silicon optical bench (SiOB) in a flip-chip manner. The process provides a coupling loss as low as 0.67 dB per coupling face and a cost-effective packaging solution for various polymer PLC devices.     

High-performance MIM capacitor using ALD high-k HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectrics

For the first time, we successfully fabricated and demonstrated high performance metal-insulator-metal (MIM) capacitors with HfO/sub 2/-Al/sub 2/O/sub 3/ laminate dielectric using atomic layer deposition (ALD) technique. Our data indicates that the laminate MIM capacitor can provide high capacitance density of 12.8 fF//spl mu/m/sup 2/ from 10 kHz up to 20 GHz, very low leakage current of 3.2 /spl times/ 10/sup -8/ A/cm/sup 2/ at 3.3 V, small linear voltage coefficient of capacitance of 240 ppm/V together with quadratic one of 1830 ppm/V/sup 2/, temperature coefficient of capacitance of 182 ppm//spl deg/C, and high breakdown field of /spl sim/6 MV/cm as well as promising reliability. As a result, the HfO/sub 2/-Al/sub 2/O/sub 3/ laminate is a very promising candidate for next generation MIM capacitor for radio frequency and mixed signal integrated circuit applications.