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A multi-layer interconnection structure is a basic component of electronic devices, and printing of the multi-layer interconnection structure is the key process in printed electronics. In this work, electrohydrodynamic direct-writing (EDW) is utilized to print the conductor-insulator--conductor multi-layer ~nterconne~ction structure. Silver ink is chosen to print the conductor pattern, and a polyvinylpyrrolidone (PVP) solution is util~zed to f~bricate the insulator layer between the bottom and top conductor patterns. The influences of EDW process parameters on the line width of the printed conductor and insulator patterns are studied systematically. The obtained ~es~l~s show that the line width of the printed structure increases with the increase of the flow rate, but decreases with the increase of applied voltage and PVP content in the solution. The average resistivity values of the bottom and top silver conductor tracks are determined to be 1.34 × 10-7 Ω.m and 1.39×10-7 Ω.m, respectively. The printed PVP layer between the two conductor tracks is well insulated, which can meet the insulation requirement of the electronic devices. This study offers an alternative, fast, and cost-effective method of fabricating conductor-insulator-conductor multi-layer interconnections in the electronic industry.  相似文献   
2.
这里介绍的一个矩阵若当标准形的证明方法,对于比较熟悉高斯消元法而不太熟悉其他线性代数知识的学生来说,是一个极妙的简单证明.因为它的证明,从开始到结束,仅用了归  相似文献   
3.
This paper is a continuation of recent work by Guo-Xiang-Zheng [10].We deduce the sharp Morrey regularity theory for weak solutions to the fourth order nonhomogeneous Lamm-Riviere equation △2u=△(V▽u)+div(w▽u)+(▽ω+F)·▽u+f in B4,under the smallest regularity assumptions of V,w,ω,F,where f belongs to some Morrey spaces.This work was motivated by many geometrical problems such as the flow of biharmonic mappings.Our results deepens the Lp type regularity theory of [10...  相似文献   
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