PECVD分层结构对提高氢化非晶硅TFT迁移率的影响

为了进一步提高氢化非晶硅薄膜晶体管 (a-Si:H TFT) 的场效应电子迁移率, 研究了批量生产条件下对欧姆接触层和栅极绝缘层进行多层 制备, 不同的工艺参数对a-Si:H TFT场效应电子迁移率的影响. 研究表明随着对欧姆接触层 (n⁺层) 分层数的增加, 以及低速生长的栅极绝缘层 (GL层) 和高速生长的栅极绝缘层 (GH 层) 厚度比值提高, a-Si:H TFT的场效应迁移率得到提升. 当n⁺层分层数达到 3层, GL层和GH层厚度比值为4:11 时, 器件的场效应电子迁移率达到0.66 cm²/V·s, 比传统工艺提高了约一倍, 显著改善了a-Si:H TFT 的电学特性, 并在量产线上得到了验证. 关键词： 非晶硅薄膜晶体管 电子迁移率 欧姆接触层 栅极绝缘层     

Influence of Substrate on the Transportation Properties of Co/Alq3 Granular Films on a Si Wafer

A series of Co0.48 （Alq3）0.52 granular films were deposited on silicon substrates using the co-evaporating technique. A crossover of magnetoresistance （MR） from negative to positive was observed in the samples, due to conducting channel switching. The transport properties of samples are greatly influenced by hydrofluoric acid pretreatment, as a result, positive MR decreases drastically and the temperature dependence of resistance changes a lot near room temperature. The result indicates that the native oxide layer plays an important role in the transport mechanism. Moreover, different resistivities of Si substrates influence the current distribution of conducting channels, leading to different transport behaviors accordingly.