管道风险管理方法研究

按照管道风险管理的流程分别对管道风险评价、风险控制和决策支持、效能测试和响应进行了论述。针对目前国内管道行业的情况，提出了进行管道风险评价的有效方法及维护措施。着重介绍了国外管道风险可接受标准的情况，作为国内制定管道风险评价标准的参考。     

Uplink Scheduling in CDMA Packet-Data Systems

Uplink scheduling in wireless systems is gaining importance due to arising uplink intensive data services (ftp, image uploads etc.), which could be hampered by the currently in-built asymmetry in favor of the downlink. In this work, we propose and study algorithms for efficient uplink packet-data scheduling in a CDMA cell. The algorithms attempt to maximize system throughput under transmit power limitations on the mobiles assuming instantaneous knowledge of user queues and channels. However no channel statistics or traffic characterization is necessary. Apart from increasing throughput, the algorithms also improve fairness of service among users, hence reducing chances of buffer overflows for poorly located users. The major observation arising from our analysis is that it is advantageous on the uplink to schedule “strong” users one-at-a-time, and “weak” users in larger groups. This contrasts with the downlink where one-at-a-time transmission for all users has shown to be the preferred mode in much previous work. Based on the optimal schedules, we propose less complex and more practical approximate methods, both of which offer significant performance improvement compared to one-at-a-time transmission, and the widely acclaimed Proportional Fair (PF) algorithm, in simulations. When queue content cannot be fed back, we propose a simple modification of PF, Uplink PF (UPF), that offers similar improvement. Hereafter, we refer to users with low recieved power at the base even when transmitting at peak transmit power as “weak” users, and the strongly recieved users at the base as “strong” users. Krishnan Kumaran is currently a member of the Complex Systems Modeling section in the Corporate Strategic Research of ExxonMobil Corp., Clinton, NJ. Formerly, he was a Member of Technical Staff in the Mathematics of Networks and Systems Research Department at Bell Labs in Murray Hill, NJ, where his research interests were in modeling, analysis and simulation of design, resource management and scheduling issues in telecommunication networks. Lijun Qian is an assistant professor in the Department of Electrical Engineering at Prairie View A&M University. He received his B.S. from Tsinghua University in Beijing, M.S. from Technion-Israel Institute of Technology, and Ph.D. from WINLAB, Rutgers University, all in electrical engineering. Before joining PVAMU, he was a researcher at Networks and Systems Research Department of Bell Labs in Murray Hill, NJ. His major research interests are in wireless communications and networking technologies, especially in radio resource management, protocol design, TCP/RLP optimization and MPLS traffic engineering.     

Exposed Die-Top Encapsulation Molding for an Improved High- Performance Flip Chip BGA Package

The recent advancement in high- performance semiconductor packages has been driven by the need for higher pin count and superior heat dissipation. A one-piece cavity lid flip chip ball grid array (BGA) package with high pin count and targeted reliability has emerged as a popular choice. The flip chip technology can accommodate an I/O count of more than five hundreds500, and the die junction temperature can be reduced to a minimum level by a metal heat spreader attachment. None the less, greater expectations on these high-performance packages arose such as better substrate real estate utilization for multiple chips, ease in handling for thinner core substrates, and improved board- level solder joint reliability. A new design of the flip chip BGA package has been looked into for meeting such requirements. By encapsulating the flip chip with molding compound leaving the die top exposed, a planar top surface can be formed. A, and a flat lid can then be mounted on the planar mold/die top surface. In this manner the direct interaction of the metal lid with the substrate can be removed. The new package is thus less rigid under thermal loading and solder joint reliability enhancement is expected. This paper discusses the process development of the new package and its advantages for improved solder joint fatigue life, and being a multichip package and thin core substrate options. Finite-element simulations have been employed for the study of its structural integrity, thermal, and electrical performances. Detailed package and board-level reliability test results will also be reported     

Gamma-irradiation-induced Ag/SiO2 composite films and their optical absorption properties

Small Ag particles or clusters dispersed mesoporous SiO₂ composite films were prepared by a new method: First the matrix SiO₂ films were prepared by sol-gel process combined with the dip-coating technique, then they were soaked in AgNO₃ solutions followed by irradiation of γ-ray at room temperature and in ambient pressure. The structures of these films were examined by X-ray diffraction (XRD), high-resolution transmission electron microscope (HRTEM), and optical absorption spectroscopy. It has been shown that the Ag particles grown within the porous SiO₂ films are very small, and they are isolated and dispersed from each other with very narrow size distributions. With increasing the soaking concentration and an additional annealing, an opposite peakshift effect of the surface plasmon resonance (SPR) was observed in the optical absorption measurements.     

结构化编程实现Sniffer

随着各高校校园网络规模的不断扩大和各种应用的急剧增加,各种新的网络问题也在不断出现。Sniffer是网络管理员进行网络管理的有效工具,可以有效地对网络进行实时监控,及时发现网络中存在的各种问题。本文首先介绍了Sniffer的工作原理,其次给出了实现Sniffer功能的编程流程图,并用C语言给出了编程所需的关键代码。     

通用绘图软件NuSlides中的面向对象的用户界面设计

本文描述在Ｕｎｉｘ环境下开发的通用绘图软件ＮｕＳｌｉｄｅ中的图形用户界面的设计思想和实际方法。其特点是基子面向对象的技术，提供多窗口、菜单驱动、选择面板、键盘输入等多种才法。该图形用户界面具有灵活性、可扩充性和易使用性。     

Influence of interfacial microcracks on the elastic properties of composites

A model is established to quantify the influence of interfacial microcracks on the elastic properties of a particulate composite using a combination of theoretical and finite element analysis. A unique way to construct physical models which could accommodate both crack size and crack density is proposed. Based on energy principles, the influence of a dilute concentration of interfacial microcracks is first studied. The case of a finite concentration of microcracks is solved subsequently by combining the dilute concentration solutions and the differential scheme. Both cases agreed well with existing composite theories for the limiting condition of complete decohesion. The final model predicts the effective elastic properties as functions of both crack size and microcrack density.     

A mechanism for transgranular stress-corrosion cracking

A model is proposed to explain transgranular-stress corrosion cracking (T-SCC) in face-centered cubic (fcc) materials. Crack propagation is shown to be anisotropic, in that growth near {110} < 001> is discontinuous due to crack arrest by dislocation blunting whereas growth away from this growth orientation is continuous. For the former case, renucleation of arrested cracks involves active dissolution of shear bands at the crack tip, which changes the stress state at Lomer-Cottrell locks, causing them to fail by cleavage. Once the crack is nucleated, its instantaneous macroscopic crack-growth velocity is considered to be comprised of multiple nucleation of microcracks with intervening arrests. This microcracking results from the interaction of the stress fields from neighboring cracks which are forming simultaneously, the crack-opening constraint due to ligaments which act as “bridges” behind the crack front, and the localized dissolution at the microcrack tip which affectsK _IC and leads to the “cobblestone” appearance. Experimental evidence and theoretical considerations are presented to support the model. The system studied was Cu-25 at. pct Au in 0.6 M NaCl solution at potentials between 300 and 400 mV (sce), which precludes hydrogen embrittlement. This article is based on a presentation made in the symposium “Quasi-Brittle Fracture” presented during the TMS fall meeting, Cincinnati, OH, October 21–24, 1991, under the auspices of the TMS Mechanical Metallurgy Committee and the ASM/MSD Flow and Fracture Committee.     

电潜泵中压变频调速系统的改进

电潜泵中压变频器输出端产生高次谐波和脉冲电流 ,对电潜泵电动机的绝缘性能和轴承寿命造成不利影响。为此 ,提出 3项改进对策 :①采用谐振软性开关逆变电路 ,使功率开关器件在零电压条件下导通 ;②在变频器逆变输出端设置电抗滤波器抑制高次谐波电流 ;③改变电动机内部结构 ,如加大定子槽宽 ,增加转子导条尺寸 ,变星接法为星 角接法 ,采用绝缘轴承等。实践证明 ,采取改进对策后 ,不仅提高了电潜泵的产量 ,而且变频器滤波后电动机端的过电压明显减小 ,电潜泵和电缆的寿命延长