Effects of Bi and rare earth metal on the microstructure and properties of Zn-based high-temperature solder

A novel Zn-based high-temperature solder was developed to join copper/steel at moderate temperature. The effects of Bi and rare earth metal on the microstructures, wettability of solders as well as the mechanical properties of solder joints were investigated. The results indicated that with the addition of Bi into Zn-Cu-Sn (ZCS) alloy, significant improvement in wettability is realized. When the content of Bi element is 1.5 wt. % in the solder, the spreading area researched over 200 mm². Further more, with the addition of RE, refined primary ε-CuZn₅ phases were formed and the shear strength of the solder joint was largely improved.     

国产镍基合金电渣堆焊在反应器制造中的应用

为满足对苯二甲酸加氢精制反应器抗腐蚀要求,在壳体内壁堆焊镍基合金,确定了内壁堆焊时采用国产镍基合金EQNiCrMo-3焊带进行过渡,采用EQNi CrMo-4焊带进行表层电渣堆焊的工艺方案,进行了焊接工艺评定,得到最佳的焊接工艺参数。试验结果表明,国产镍基合金焊带堆焊工艺性良好,各项性能指标满足产品制造技术要求,并完成产品制造。