A prototype 3D optically interconnected neural network

We report the implementation of a prototype three-dimensional (3D) optoelectronic neural network that combines free-space optical interconnects with silicon-VLSI-based optoelectronic circuits. The prototype system consists of a 16-node input, 4-neuron hidden, and a single-neuron output layer, where the denser input-to-hidden-layer connections are optical. The input layer uses PLZT light modulators to generate optical outputs which are distributed over an optoelectronic neural network chip through space-invariant holographic optical interconnects. Optical interconnections provide negligible fan-out delay and allow compact, purely on-chip electronic H-tree type fan-in structure. The small prototype system achieves a measured 8-bit electronic fan-in precision and a calculated maximum speed of 640 million interconnections per second. The system was tested using synaptic weights learned off system and was shown to distinguish any vertical line from any horizontal one in an image of 4×4 pixels. New, more efficient light detector and small-area analog synapse circuits and denser optoelectronic neuron layouts are proposed to scale up the system. A high-speed, feed-forward optoelectronic synapse implementation density of up to 10⁴/cm² seems feasible using new synapse design. A scaling analysis of the system shows that the optically interconnected neural network implementation can provide higher fan-in speed and lower power consumption characteristics than a purely electronic, crossbar-based neural network implementation     

Long-wavelength 640×486 GaAs-AlGaAs quantum well infraredphotodetector snap-shot camera

A 9-μm cutoff 640×486 snap-shot quantum well infrared photodetector (QWIP) camera has been demonstrated. The performance of this QWIP camera is reported including indoor and outdoor imaging. The noise equivalent differential temperature (NEΔT) of 36 mK has been achieved at 300 K background with f/2 optics. This is in good agreement with expected focal plane array sensitivity due to the practical limitations on charge handling capacity of the multiplexer, read noise, bias voltage, and operating temperature     

Silicon bipolar chipset for SONET/SDH 10 Gb/s fiber-opticcommunication links

High-speed multiplexers, demultiplexers, frequency dividers, mixers, and amplifiers are key electronic components in high-speed fiber-optic communications systems such as SONET/SDH. In this paper, we present several important digital and analog integrated circuits (IC) which have been developed for use in SONET/SDH 10 Gb/s optical communication links. The circuits have been fabricated in MOSAIC 5E, an advanced silicon bipolar technology (f_T=26 GHz). The resulting chipset which amounts to a total of 10 IC's consists of multiplexers, demultiplexers, a regenerative frequency divider (2:1), a dual output limiting amplifier, and two different types of mixers for clock extraction. Specifically, the design and performance of these IC's and a hybrid clock recovery module are discussed. The high performance and potential low cost of this research chipset show that advanced silicon bipolar circuit technology can play an important role in future multigigabit fiber-optic communication systems     

Scale periodicity and its sampling theorem

The scalar transform is a new representation for signals, offering a perspective that is different from the Fourier transform. We introduce the notion of a scalar periodic function. These functions are then represented through the discrete scale series. We also define the notion of a strictly scale-limited signal. Analogous to the Shannon interpolation formula, we show that such signals can be exactly reconstructed from exponentially spaced samples of the signal in the time domain. As an interesting, practical application, we show how properties unique to the scale transform make it very useful in computing depth maps of a scene     

Inelastic post-buckling analysis of truss structures by dynamic relaxation method

The paper presents the inelastic post-buckling analysis of truss structures by the Dynamic Relaxation (DR) method. A simplified inelastic finite element formulation for truss element and new algorithms are proposed for Elastic Post-Buckling (EPB) analysis and Inelastic Post-Buckling (IEPB) analysis using the DR method. The post-buckling paths for elastic, EPB and IEPB analyses are completely traced using the variable-arc-length method. Four numerical examples are presented to illustrate the application of the proposed algorithms.     

Microstructural developments in Mg-Ti-PSZ systems

The microstructure of titania-added Mg-partially-stabilized zirconia (PSZ) is dramatically influenced by thermal treatments. Effects of various sintering, heat-treatment and thermal shock cycling parameters on the microstructure of the Mg-Ti-PSZ system are described. Conditions favourable for the growth of needle-like Ti-rich reinforcements in highly thermalshock-resistant Mg-Ti-PSZ ceramics are identified. TiO₂ seems to play a catalytic role in the formation of Zr-rich networks during high-temperature (1700°C) sintering of the Mg-Ti-PSZ system, quite similar to those found in Mg-PSZ, heat-treated above 1300 °C.