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1.
Thirunavukkarasu  K.  Kavimani  V.  Gopal  P. M.  Daniel Das  A. 《SILICON》2021,13(7):2337-2346
Silicon - This research aims at optimum utilization of waste recycled submerged arc welding slag along with virgin flux in place of pure virgin flux without compromising the quality of welding and...  相似文献   
2.
In this research, a copper based surface composite was fabricated through dispersing hybrid composite particles onto its surface through friction stir processing (FSP) technique. Optical micrographs and scanning electron microscopy images indicates finer refinement of grains and particles dispersion into matrix along with its bonding and particle separation. As per the outcomes of microhardness analysis, hardness of the developed surface composite shows increment with increase in dispersion of volume fraction of hybrid particles. Strength of the developed copper surface composite exhibited a positive trend with introduction of hybrid reinforcement particle onto the surface of the composite but yet again ductility reduced. Wear resistance of the composite increased with reinforcement addition and the same was supported through worn out surface morphology. Fluctuations in friction coefficient value reduced with increase in particles, as for the presence in BN particles while the average frictional coefficient value was observed increasing. A reduction in corrosion rate was observed with increase in reinforcement particle dispersion onto copper matrix through FSP.  相似文献   
3.
Kavimani  V.  Gopal  P. M.  Sumesh  K. R.  Kumar  N. Vimal 《SILICON》2022,14(1):65-73
Silicon - Recycling and reutilization of industrial waste is one way to minimize land pollution to attain green environment. In this research waste SiC grinding wheel was ball milled to powder form...  相似文献   
4.
The main aim of this investigation focuses on fabrication of copper surface composites through friction stir processing (FSP) reinforced with boron nitride (BN) particles of varying volume fractions (5%, 10%, and 15%). Surface composites developed through single pass FSP were characterized for its microstructural, mechanical and tribological properties. Microstructural characterization indicated that developed surface composites were of good quality with reduced grain size and the SEM characterization confirmed good bonding between copper matrix and BN with uniform dispersion. Micro hardness survey of the developed surface composites showcased minimal deviation in the stir zone with increased trend in respect to the volume fraction of BN. The ultimate tensile strength, yield strength and percent elongation of FSPed composites was found to have reduced when compared with that of pure copper. BN dispersion in surface composite was effective in reducing the ductility and so maximum volume percent (15%) of BN dispersed composite prompt to have higher strength. The wear rate and friction coefficient of the developed surface composite was found decreasing with respect to increase in the dispersion of BN. Amongst the FSPed copper surface composite, specimen with 15?vol% of BN has shown the least wear rate with low coefficient of friction.  相似文献   
5.
Kavimani  V.  Prakash  K. Soorya 《SILICON》2018,10(6):2829-2843
Silicon - In this research, solvent based powder metallurgy is used to develop Silicon Carbide (SiC) doped reduced Graphene Oxide(r-GO) reinforced magnesium composite. SiC was doped with r-GO with...  相似文献   
6.
An overall aspect of electroless Ni-P depositions—A review article   总被引:2,自引:0,他引:2  
Literature on electroless Ni-P deposition, in recent decades, has dwelled primarily on surface engineering and corrosion-resistant applications. By contrast, we have many research articles devoted to the engineering aspects of the electroless Ni-P depositions and their technology. The present article deals with the development of electroless Ni-P bath, advantages and mechanisms of deposition, and applications of the Ni-P deposits. We also present a comparison of the properties of electroless Ni-P and Ni-B as well as the recent developments in nickel-phosphorous research. We attempt to review these in a detailed manner. We also briefly discuss the future developments of electroless Ni-P.  相似文献   
7.
Kavimani  V.  Prakash  K. Soorya  Thankachan  Titus  Nagaraja  S.  Jeevanantham  A. K.  Jhon  Jithin P. 《SILICON》2020,12(5):1161-1175
Silicon - A combination of Taguchi methodology and Grey Relational Analysis (GRA) inturn coupled with principal component analysis (PCA) has been proposed through this paper. This methodology is...  相似文献   
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