超高导热金刚石铜复合材料在GaN器件中的应用

金刚石铜具有高导热率和低膨胀系数,可用于大功率芯片的散热热沉.未做处理的金刚石表面非常光滑,不易附着其他金属,由于金刚石性质非常稳定,不容易被强酸和强碱进行表面处理.采用JG-01金刚石铜粗化处理液对金刚石进行粗化处理,而对铜无损伤,提升了金刚石表面结合力.金刚石铜镀层对金锡(AuSn)和锡铅(PbSn)焊料的润湿性满足GJB548B-2005要求.GaN功率放大器芯片采用金刚石铜热沉比铜钼铜热沉结温可以降低12℃.金刚石铜载板镀层润湿性良好,焊接后芯片底部的空洞率不大于3％,热沉焊接后空洞率不大于5％,满足高功率芯片散热要求.按照产品环境适应要求,对GaN功率放大器做了高低温冲击和机械振动两种环境筛选实验,最终满足可靠性考核要求.     

梯度掺杂GaN光电阴极的光谱响应测试与分析

用光谱响应测试仪得到了反射式梯度掺杂GaN光电阴极在激活和衰减过程中的光谱响应曲线,发现此曲线不断发生变化。在激活过程中光谱响应不断提高,且长波响应提高较快;衰减过程中光谱响应不断下降,长波响应下降得更快。结果表明：光谱响应曲线的变化与光电阴极高能光电子的逸出有关。GaN光电阴极发射的电子能量分布随入射光子能量升高而向高能端偏移,阴极表面势垒形状的变化对低能光激发电子的影响更大,导致光谱响应曲线随入射光波长改变而产生了不同的变化。     

Local electronic properties of AlGaN/GaN heterostructures probed by scanning capacitance microscopy

Local electronic properties in Al_xGa_1−xN/GaN heterostructure field-effect transistor epitaxial layer structures are probed using scanning capacitance microscopy. Acquisition of scanning capacitance images over a wide range of bias voltages combined with theoretical analysis and numerical simulation allows the presence, detailed nature, and possible structural origins of nanometer- to micronscale inhomogeneities in electronic structure to be elucidated. Substantial lateral variations in local threshold voltages for transistor channel formation are observed, at length scales ranging from submicron to >2 μm, and found to arise primarily from local variations in Al_xGa_1−xN layer thickness. Features in electronic structure are also observed that are consistent with the existence of networks of negatively charged threading edge dislocations, as might be formed at island coalescence boundaries during epitaxial growth. The negative charge associated with these structures appears to lead to local depletion of carriers from the channel in the Al_xGa_1−xN/GaN transistor epitaxial layer structure.     

GaN薄膜制备及脉冲激光沉积法的研究进展

介绍了国内外制备GaN材料的历史和现状。分析了GaN材料及其薄膜的各种制备工艺的特点,并详细介绍了采用激光沉积工艺制备GaN薄膜的研究进展。     

GaN HEMT器件封装技术研究进展

GaN高电子迁移率晶体管(HEMT)器件由于其宽禁带材料的独特性能,相比硅功率器件具有击穿场强高、导通电阻低、转换速度快等优势,在智能家电、交直流转换器、光伏逆变器以及电动汽车等领域有着广泛的应用前景.但GaN HEMT器件的高功率密度和高频工作特性,给器件封装带来了极大挑战,要使其出色性能得以充分发挥,其封装结构、材...     

用MOCVD法在LiGaO2(001)上生长GaN的研究

LiGaO₂单晶是目前所知的GaN最为理想的衬底材料,本研究用金属有机物气相沉积法(MOCVD)在LiGaO₂(001)衬底上进行了外延生长GaN膜的试验,生长出了表面较为平整的GaN外延膜.应用原子力显微镜(AFM)、X射线粉末衍射(XRD)和高分辨X射线双晶衍射分别对衬底对外延膜和衬底材料进行了分析测试.结果表明,用MOCVD法可以在LiGaO₂(001)衬底上生长出较高质量的无掺杂GaN(0001)外延膜.但由于MOCVD法是在高温还原气氛中生长GaN外延膜的,LiGaO₂在这种气氛中不够稳定,实验发现衬底材料在生长过程中部分样品发生开裂,但没有发生相变.     

Optical properties of undoped n-AlGaN/GaN superlattices as affected by built-in and external-electric field and by ar-implantation-induced partial disordering

High-resolution x-ray diffraction patterns and 90 K microcathodoluminescence (MCL) spectra were taken for undoped, symmetric AlGaN/GaN superlattices (SLs) with GaN quantum-well (QW) widths of 35 Å and 80 Å. The short-period SL spectra were blue shifted by about 60 meV compared to the GaN substrate, and the magnitude of the blue shift was increased by about 20 meV by application of a reverse bias of ?3 V (electric field of about 4 · 10⁵ V/cm) to a Schottky diode prepared on this SL. A small red shift of about 40 meV compared to GaN was observed for the long-period SL. The two latter observations were interpreted as manifestations of the presence of a strong built-in piezoelectric field, giving rise to the quantum-confined Stark effect (QCSE). Partial disordering of the short-period SL was observed after Ar ion implantation (energy 150 keV, dose 8·10¹³ cm^?2 and 80 keV, 2·10¹³ cm^?2) and subsequent annealing at 1000°C for 3 h under the protective layer of Si₃N₄. However, it was observed that this partial disordering was accompanied by strain relaxation via formation of misfit dislocations or cracks.     

Magnetic effects of direct ion implantation of Mn and Fe into p-GaN

In p-GaN implanted with Mn (3×10¹⁶ cm⁻² at 250 keV), the material after annealing shows ferromagnetic properties below 250 K. Cross-sectional transmission electron microscopy (TEM) revealed the presence of platelet structures with hexagonal symmetry. These regions are most likely Ga_xMn_1−xN, which produce the ferromagnetic contribution to the magnetization. In p-GaN implanted with Fe, the material after annealing showed ferromagnetic properties at temperatures that were dependent on the Fe dose, but were below 200 K in all cases. In these samples, TEM and diffraction analysis did not reveal any secondary phase formation. The results for the Fe implantation are similar to those reported for Fe doping during epitaxial growth of GaN.     

应用于大功率MMIC开关的AlGaN背势垒GaN HEMT

报道了应用于大功率开关的AlGaN背势垒0.25μm GaN HEMT。通过引入AlGaN背势垒,MOCVD淀积在3英寸SiC衬底上的AlGaN/GaN异质结材料缓冲层的击穿电压获得了大幅度的提升,相比于普通GaN缓冲层和掺Fe GaN缓冲层击穿电压提升幅度分别为4倍和2倍。采用具有AlGaN背势垒AlGaN/GaN 外延材料研制的GaN HEMT开关管在源漏间距为2μm、2.5μm、3μm、3.5μm和4μm时,估算得到的关态功率承受能力分别为25.0W、46.2W、64.0W、79.2W和88.4W。基于源漏间距为2.5μm的GaN HEMT开关管设计了DC-12GHz的单刀双掷MMIC开关。该开关采用了反射式串-并-并结构,整个带内插入损耗最大1.0dB、隔离度最小30dB,10GHz下连续波测试得到其功率承受能力达44.1dBm。     

X波段四路合成氮化镓功率放大器

本文利用自主研制的SiC 衬底的,栅宽为2.5mm的AlGaN/GaN HEMT器件,设计完成了X波段氮化镓合成固态放大器模块。模块由AlGaN/GaN HEMT器件,Wilkinson功率合成/分配器,偏置电路和微带匹配电路构成。为了使放大器稳定,在每一路放大器的输入端和输出端加入了RC 稳定网络,在栅极和直流输入之间加上稳定电阻,并且利用3/4 λ 枝接的威尔金森功率合成/分配器,从而有效消除其自激和低频串扰问题。在连续波条件下(直流偏置电压为Vds=27V,Vgs=-4.0V),放大器在8GHz频率下线性增益为5dB,最大效率为17.9%,输出功率最大可为42.93dBm,此时放大器增益压缩为3dB。四路合成放大器的合成效率是67.5%。通过分析,发现了放大器合成效率的下降是由每路放大器特性的不一致、功率合成网络的损耗以及电路制造误差所造成。