阴离子导向组装：两个具有不同阳离子的多维Ag(I)配合物的晶体结构

Assembly of [Ag（CN）2]^- units with M（Ⅱ）-diamine complex cations [Cu（LN-N）2]^2＋, where LN-N represents L2-diaminopropane （pn） and ethylenediamine （en）, afforded two complexes, [Cu（pn）2][Ag2（CN）4] （1） and [Cu（en）2][Ag3（CN）5] （2）, which were characterized by elemental analysis, IR, UV-Vis and ESR spectra. Single crystal X-ray analyses show that these complexes have 2D and 3D architectures through silver-silver interactions and other weak interactions. The luminescence behaviors of the two complexes were also studied by means of emission spectra.     

Synthesis of New Spiropyrans With a Polyaromatic or Heteroaromatic Pendant and Their Photochromic Bedhaviors

A series of spiropyrans with a polyaromatic or heteroaromatic pendant was synthesized conveniently.Their photochromic behaviors were investigated with the aid of absorption spectral measurements.The results indicated that the compounds with the same parent spiropyran but different aromatic pendant show significantly different photochromic properties.This may be due to the π-π orbital interaction between the polyaromatic pendant and the open photomerocyanine form of spiropyran.The results obtained are very useful in the molecule design area.     

结晶／结晶共混体系聚苯硫酸／聚醚醚酮中聚醚醚酮组分的结晶熔融行为──熔融温度的影响

结晶／结晶共混体系聚苯硫酸／聚醚醚酮中聚醚醚酮组分的结晶熔融行为──熔融温度的影响麦堪成，许家瑞，梅震，曾汉民（中山大学材料科学研究所，广州，５１０２７５）关键词聚醚醚酮，聚苯硫醚，结晶／结晶共混物，结晶熔融行为近年来，高性能聚合物共混物如聚砜（ＰＳ...     

嵌段共聚物/均聚物共混体系的结晶行为 I. 非球状共聚物胶束的作用

将Leibler, Whitmore和Mayes等近期关于非晶嵌段共聚物“稀固体溶液”的理论应用于嵌段聚共聚物结晶型“稀固体溶液”结晶行为的研究。发现球状共聚物胶束既可起成核剂作用, 也可起抑制成核作用。报导了当共聚物胶束由球形变为非球形时, 共聚物胶束的上述作用都会发生较大的变化, 并根据Leibler和Mayes分别提出的球形和非球形胶束理论解释了这一实验现象。     

考虑死区非线性的L滤波单相并网逆变器的精确离散迭代模型及其分岔行为

并网逆变器系统作为一个时变非线性系统,具有复杂的动力学行为,而死区非线性的引入使系统的非线性行为更为复杂和难以预测.本文以考虑死区非线性的L滤波单相并网逆变器为研究对象,首先观察不同死区时间下系统的输出电流波形,发现在控制器参数固定的情况下,随着死区时间的增加,系统会出现分岔现象;其次,根据死区非线性特性及其引起的电流过零钳位现象,分多种情况全面地建立了精确完整的离散迭代模型,并在此基础上对系统的分岔行为进行理论分析.此外,系统的稳定性判定具有重要的工程指导意义,由于死区非线性的引入,常规解析方法使用困难,而图解法的精度又难以令人满意,因此提出了一种基于等效占空比的稳定性判断方法,可以精确地判定系统的稳定边界,为控制器参数设计和死区时间设计提供了可靠依据.     

铪烯

正国际上首次报道了基于d电子过渡金属元素的二维蜂窝状晶体材料。这种由铪元素构成的二维蜂窝状结构比石墨烯具有更强的自旋轨道耦合,为研究二维体系中新的量子现象和电子行为提供了新的平台。铪也是当今半导体科学和技术中最重要的元素之一,制备出铪的类石墨烯结构对未来电子学也极其重要。该工作发表在Nano Letters 13,4671(2013),被Nature China和Nature Nanotechnology作为研究亮点进行报道。     

NONLINEAR DYNAMICS AND SYNCHRONIZATION OF TWO COUPLED PIPES CONVEYING PULSATING FLUID

In this paper, the nonlinear dynamical behavior of two coupled pipes conveying pulsating fluid is studied. The connection between the two pipes is considered as a distributed linear spring. Based on this consideration, the equations of motion of the coupled two-pipe system are obtained. The two coupled nonlinear partial differential equations, discretized using the fourth- order Galerkin method, are solved by a fourth-order Runge-Kutta integration algorithm. Results show that the connection stiffness has a significant effect on the dynamical behavior of the coupled system. It is found that for some parameter values the motion types of the two pipes might be synchronous.     

Fatigue damage behavior of a surface-mount electronic package under different cyclic applied loads

This paper studies and compares the effects of pull-pull and 3-point bending cyclic loadings on the mechanical fa- tigue damage behaviors of a solder joint in a surface-mount electronic package. The comparisons are based on experimental investigations using scanning electron microscopy （SEM） in-situ technology and nonlinear finite element modeling, respec- tively. The compared results indicate that there are different threshold levels of plastic strain for the initial damage of solder joints under two cyclic applied loads; meanwhile, fatigue crack initiation occurs at different locations, and the accumulation of equivalent plastic strain determines the trend and direction of fatigue crack propagation. In addition, simulation results of the fatigue damage process of solder joints considering a constitutive model of damage initiation criteria for ductile materials and damage evolution based on accumulating inelastic hysteresis energy are identical to the experimental results. The actual fatigue life of the solder joint is almost the same and demonstrates that the FE modeling used in this study can provide an accurate prediction of solder joint fatigue failure.