金属间化合物的高温腐蚀与防护

综述了有序金属间化合物，主要是Ｎｉ－Ａｌ，Ｔｉ－Ａｌ和Ｆｅ－Ａｌ系金属间化合物高温腐蚀与防护方面的研究结果，包括它们的氧化腐蚀机理、合金元素对其氧化腐蚀性能的影响以及它们所需的高温涂层等。     

颗粒增强Fe3Al基复合材料的制备和性能

用熔铸法制备了ＳｉＣ,Ａｌ２Ｏ３和ＴｉＢ２颗粒增强Ｆｅ－２８Ａｌ－５Ｃｒ基复合材料,研究了材料的微观组织和力学性能,结果表明,Ａａ２Ｏ３在Ｆｅ３Ａｌ中的化学稳定性很好,ＴｉＢ２与基体发生了部分反应,ＳｉＣ与基体的反应严重,复合材料在室温和高温下的力学性能的变化说明,上述颗粒的加入使材料的强度较大幅度的提高,塑性有所下降。     

多相NiAl-Cr合金的微观组织和韧脆转变行为的研究

研究了NiAl-25Cr合金微观组织和韧脆转变行为.NiAl-25Cr合金的铸态组织为β-Ni(Al,Cr),γ'-Ni3(Al,Cr)和α-Cr三相组成,挤压后沿着挤压方向共晶区被显著拉长、变直,共晶区之间并列平行排列.经挤压变形后材料为完全再结晶的细小等轴晶,晶粒大小约3～5μm.韧脆转变温度明显依赖于应变速率,应变速率提高2个数量级,韧脆转变温度(BDTT)相应提高80K.在BDTT以下,断口形貌以β/γ'解理为主,而在BDTT以上,断口形貌出现大量的裂纹,表明合金的韧脆转变后的塑性变形由相界强度所控制.     

MOF‐Confined Sub‐2 nm Atomically Ordered Intermetallic PdZn Nanoparticles as High‐Performance Catalysts for Selective Hydrogenation of Acetylene

Controllable synthesis of ultrasmall atomically ordered intermetallic nanoparticles is a challenging task, owing to the high temperature commonly required for the formation of intermetallic phases. Here, a metal–organic framework (MOF)‐confined co‐reduction strategy is developed for the preparation of sub‐2 nm intermetallic PdZn nanoparticles, by employing the well‐defined porous structures of calcinated ZIF‐8 (ZIF‐8C) and an in situ co‐reduction therein. HAADF‐STEM, HRTEM, and EDS characterizations reveal the homogeneous dispersion of these sub‐2 nm intermetallic PdZn nanoparticles within the ZIF‐8C frameworks. XRD, XPS, and EXAFS measurements further confirm the atomically ordered intermetallic phase nature of these sub‐2 nm PdZn nanoparticles. Selective hydrogenation of acetylene evaluation results show the excellent catalytic properties of the sub‐2 nm intermetallic PdZn, which result from the energetically more favorable path for acetylene hydrogenation and ethylene desorption over the ultrasmall particles than over larger‐sized intermetallic PdZn as revealed by density functional theory (DFT) calculations. Moreover, this protocol is also extendable for the preparation of sub‐2 nm intermetallic PtZn nanoparticles and is expected to provide a novel methodology in synthesizing ultrasmall atomically ordered intermetallic nanomaterials by rationally functionalizing MOFs.     

Crystal structure and magnetic behavior of novel R2PdIn8 (R = Pr, Nd, and Sm) compounds

A new series of R₂PdIn₈ intermetallics, where R = Pr, Nd, and Sm, was prepared by arc-melting the constituents under argon atmosphere and studied by means of X-ray diffraction and magnetic measurements. The compounds crystallize with a tetragonal structure of the Ho₂CoGa₈ type (space group P4/mmm). At very low temperatures, they order antiferromagnetically, and the Nd-based indide presumably exhibits an additional magnetic phase transition in the ordered region.     

Interfaces in ordered intermetallics

In this paper, we have examined different types of interfaces that occur between orientational/translational variants generated during the ordering process. This has been illustrated citing examples of ordering of the FCC structure into DO₂₂, Dl_a and Pt₂Mo type structures in some nickel base alloys. Microstructures consisting of more than one ordered structure have also been investigated. Superlattice domains of DO₂₂ and Pt₂Mo type structures have also been found to coexist in a microscopic scale of mixing in Ni-V alloys while mixed domains of Dl_a and Pt₂Mo type structures on a much finer scale have been observed in Ni-Mo alloys. The formation of different variants (rotational and translational) of ordered structure(s) from the disordered lattice has been explained on the basis of group theoretical and symmetry considerations.     

Fe_3Al金属间化合物强韧化研究进展

Ｆｅ３Ａｌ基合金作为一种金属间化合物新型结构材料越来越引起人们的重视，极有可能在许多场合得到应用。但是Ｆｅ３Ａｌ合金室温时的低塑性和低的断裂抗力以及高于６００℃时强度的急剧下降妨碍了它的工程应用，本文主要综述近几年来Ｆｅ３Ａｌ金属间化合物机械性能方面的研究情况。     

Formation of quasicrystals in Zr–Pd–(Cu) melt spun ribbons and mechanically milled powders

Amorphous Zr₇₀Pd₃₀ and Zr₇₀Pd₂₀Cu₁₀ alloys were prepared by mechanical milling and melt spinnng to compare their devitrification behaviors. The devitrification of mechanically milled Zr₇₀Pd₃₀ and Zr₇₀Pd₂₀Cu₁₀ powders occurs via a single-step, first-order transformation to a stable Zr₂Pd tetragonal structure. This is in sharp contrast to the devitrification of the same amorphous alloys prepared by melt spinning, in which a primary meta-stable quasicrystalline phase forms. Since the mechanical milling process does not involve direct liquid phase formation of an amorphous structure, it is inferred that the short-range order in the solid state derived amorphous powder is different from that in the melt spun ribbon. During mechanical milling of an amorphous melt spun ribbon, crystallization of the quasicrystalline phase appears to precede disordering into an amorphous structure having an different short range order. Deformation of an amorphous melt spun ribbon by repetitive rolling at ambient temperature crystallizes the meta-stable quasicrystalline phase.     

Residual Thermal Stresses of Laser Cladding of Intermetallic-Ceramic Composite Coatings

The stresses in laser cladding of Ni3Al-WC composite coating co and in heat affect zone (HAZ) σh have been induced based on considering the influences of laser processing parameters power P and beam traverse speed v.According to the calculated results, certain limits of P and v are necessary in order to obtain crack free coatings. It agrees well with the experimental results.     

Contact angle measurements of Sn-Ag and Sn-Cu lead-free solders on copper substrates

In this study, the contact angles of four lead-free solders, namely, Sn-3.5Ag, Sn-3.5Ag-4.8Bi, Sn-3.8Ag-0.7Cu, and Sn-0.7Cu (wt.%), were measured on copper substrates at different temperatures. Measurements were performed using the sessile-drop method. Contact angles ranging from 30° to 40° after wetting under vacuum with no fluxes and between 10° and 30° with rosin mildly activated (RMA) and rosin activated (RA) fluxes were obtained. The Sn-3.5Ag-4.8Bi exhibited the lowest contact angles, indicating improved wettability with the addition of bismuth. For all soldering alloys, lower contact angles were observed using RMA flux. Intermetallics formed at the solder/Cu interface were identified as Cu₆Sn₅ adjacent to the solder and Cu₃Sn adjacent to the copper substrate. The Cu₃Sn intermetallic phase was generally not observed when RMA flux was used. The effect of temperature on contact angle was dependent on the type of flux used.