A copper/polyimide Metal-base packaging technology

A unique substrate MCPM (Mitsubishi Copper Polyimide Metal-base) technology has been developed by applying our basic copper/polyimide technology.¹ This new substrate technology MCPM is suited for a high-density, multi-layer, multi-chip, high-power module/package, such as used for a computer. The new MCPM was processed using a copper metal base (110 × 110 mm), full copper system (all layers) with 50-μm fine lines. As for pad metallizations for the IC assembly, we evaluated both Ni/Au for chip and wire ICs and solder for TAB ICs. The total number of assembled ICs is 25. To improve the thermal dispersion, copper thermal vias are simultaneously formed by electro-plating. This thermal via is located between the IC chip and copper metal base, and promotes heat dispersion. We employed one large thermal via (4.5 mm^?) and four small vias (1.0 mm^?) for each IC pad. The effect of thermal vias and/or base metal is simulated by a computer analysis and compared with an alumina base substrate. The results show that the thermal vias are effective at lowering the temperature difference between the IC and base substrate, and also lowering the temperature rise of the IC chip. We also evaluated the substrate’s reliability by adhesion test, pressure cooker test, etc.     

Effect of pulse parameters on microstructure of joint in laser beam welding for SiC_p/6063 composite

1　INTRODUCTIONSiC particlesreinforcedcomposites ,thankstotheirlowcostsandhighlevelofstructuralproperties ,areshowingtheirpotentialincivilandmilitaryappli cation .SiC particlesreinforcedaluminummatrixcomposites wideapplicationinaerospaceandautomo tiveareattributedtotheirperformanceofhighspecif icstrength ,highspecificstiffness ,highelasticmodu lusandexcellentwearresistance .Thecoefficientofthermalexpansionandthermalconductivitycanberegulatedbychangingthecontentandsizeofrein forcingparticl…     

Zirconium-Embedded Polyhedral Oligomeric Silsesquioxane Containing Phosphaphenanthrene-Substituent Group Used as Flame Retardants for Epoxy Resin Composites

A zirconium hybrid polyhedral oligomeric silsesquioxane derivative (Zr–POSS–bisDOPO) is synthesized by the corner-capping and Kabachnik–Fields reactions. It is characterized by Fourier transform infrared spectroscopy (FTIR) and nuclear magnetic resonance spectroscopy (NMR), and then used as a flame retardant in diglycidyl ether of bisphenol A (DGEBA) to endow epoxy resin (EP) with flame retardancy. The flame retardancy, thermal stability, and mechanical properties of the cured EP/Zr–POSS–bisDOPO composites are investigated. The results show that when Zr–POSS–bisDOPO is added by 5–7 wt%, the EP/Zr–POSS–bisDOPO composites pass the UL-94 V-0 rating test. In addition, they have a better flame-retardant effect than pure EP. The combination of Zr atom embedded in the Si O cubic cage and the two phosphaphenanthrene substituent groups in one corner of cubic cage is expected to realize the Zr/Si/P ternary intramolecular hybrid synergistic effect and achieve the possibility of dispersing metal–POSS cages at a sub-micrometer-scale level into polymer matrix. It also proves that Zr–POSS–bisDOPO produces phosphorus-containing free radicals and terminates the chain reactions in gas phase. Meanwhile the Si O Si and Zr O units are retained in the solid phase, which promote the char formation and enhance the flame retardancy. This kind of Zr-doped POSS will be helpful for developing the new metal–POSS hybrid flame-retardant and polymer composites.     

Preparation of Iron Filler-Based Photocomposites and Application in 3D Printing

The introduction of metallic fillers to polymers via the photopolymerization approach can endow the composite materials with some unique properties, but the relevant research is still scarce due to the issue of light penetration and inner filter effect. Herein, for the first time the fabrication of photocomposites based on fine iron powder (i.e., a typical kind of metallic filler) is reported in this work. The free radical polymerization of two different acrylate monomers, poly(ethylene glycol) diacrylate and trimethylolpropane triacrylate, is performed in the presence of iron filler under mild conditions (i.e., light emitting diode (LED)@405 nm irradiation at room temperature under air). And the real-time Fourier transform infrared spectroscopy reveals remarkable photopolymerization kinetics of acrylates with high final conversions and fast polymerization rates despite the increasing contents of iron filler in the composites. Interestingly, the 3D printing technique is applied to the iron filler-based composites to produce tridimensional patterns with excellent spatial resolution. This work not only paves the way for the investigation of photocomposites based on metallic fillers through photochemical methods, but also broadens the potential application prospects.     

Preparation and mechanical characteristics of fine-woven cloth and punctured felt preform Cf/C-SiC-ZrC composite

A 3D architecture carbon fiber preform, specifically fine-woven cloth and punctured felt preform, is used to manufacture a novel advanced C_f/C-SiC-ZrC composite. The composite matrix is produced by chemical vapor infiltration (CVI) plus precursor infiltration and pyrolysis (PIP) process and finalized by using a chemical vapor deposition (CVD) of SiC coating to make the final density of the material reach 1.95 g/cm³. The organic precursors of SiC and ZrC have a weight ratio of 4:1 in a xylene solute. The composite mechanical properties, such as tensile, compression, bending, shear, and Z-direction load bearing, are introduced under analysis to find possible applications for the composite. What is more, scanning electron microscope (SEM) images are employed to illustrate the failure behavior of the ceramic composite. The results showed that the punctured filament tows will be beneficial, not only for the composite to withstand compression force up to 308.6 MPa and shear strength to 18.14 MPa but also for the alternatively stacked weave piles and short fiber layers to support the punctured bundles, as well as to hold the composite structure under mechanical forces from different orientations, which is believed to reinforce the ceramic matrix for some high pressure and severe ablation applications.     

日本超高温结构用金属材料的研究现状

简要介绍了日本围绕燃气轮机用关键超高温金属结构材料所展开的研究开发工作,包括Ni基超合金、耐热金属间化合物、Nb基超合金及其复合材料。Ni基超合金仍是当前燃气轮机用超高温结构的主要材料,但其使用温度的上升潜力已经不多,用新的超高温材料替代Ni基超合金是燃气轮机用材的发展趋势,金属材料中耐热金属间化合物和Nb基复合材料是今后关注的焦点。     

Synthesis and characterization of poly acrylic acid/graphite oxide nanocomposite

1　INTRODUCTIONOrganic intercalatedlayeredsolidshavebeenstudiedbyscientistsindifferentfieldsformanyyearsbecauseoftheirnew physicalandchemicalpropertiessuchaselectricalproperties[1] ,mechanicalproper ties ,thermalbehavior[2 ] ,surfaceandinterfacialproperties[3] .Graphiteoxide (GO)hasbeenstudiedformany years ,itsstructuralmodel[4 6 ] ,formationprocessandkinetics[7,8] havebeenstudiedindetail.IthasbeenreportedthatGOpossessesC OHande poxidefunctionalgroups[9] whichmakegraphiteox ideeasilyabs…     

原位反应自发渗透法TiC／AZ91D镁基复合材料及AZ91D镁合金的拉伸变形与断裂行为

利用原位反应自发渗透技术合成了47．5％碳化钛TiC（体积分数，下同）增强AZ91D镁基复合材料，对比研究了该复合材料与铸态镁合金AZ91D基体的室温与高温拉伸变形行为，观察了拉伸断口微观组织形貌，并分析了这两种材料的断裂特征。结果表明，TiC／Mg复合材料具有良好的高温力学性能，在拉伸变形速率为0．001s^-1以及温度为723K，时其拉伸强度可达91．1MPa，而此时相同变形条件下的铸态AZ91D镁合金拉伸断裂强度只有41．1MPa，增幅达120％。而在室温下，镁基复合材料的拉伸断裂强度仅高出基体铸态镁合金23．4％。镁基复合材料的断裂应变较低，高低温时均表现为脆性断裂；而镁合金则由室温下的脆性断裂向高温下的韧性断裂过渡。     

SiCp／Al复合材料高应变率压缩变形及损伤机理

采用真空热压工艺制备了含SiC颗粒体积分数分别为5%,15%和25%的SiC颗粒增强铝基复合材料,利用Hopkinson高速压杆冲击实验系统对其从静态到动态(应变率为3.3×10-3s-1～5.2×103s-1)的压缩破坏响应进行了研究,结合其光学显微镜分析变形组织,分析了不同体积分数SiCp/Al复合材料高应变率压缩载荷下,材料的变形和微观损伤机理.结果表明,复合材料存在应变率敏感性,SiC含量的增加导致复合材料应变率敏感性的增加,以垂直于载荷方向的增强相颗粒的剪切开裂为主要破坏模式.     

高强度高导电的形变Cu-Fe原位复合材料

通过合金成分和变形工艺研究, 制备了一种高强度高导电性的形变Cu-Fe原位复合材料.实验结果表明, 铁含量越高, 强度越高, 导电性越低; 加入少量镁或锆, 可提高强度, 但同时损失导电性.在变形过程中, 加入适当的中间热处理, 在改变强度不太大的前提下, 能大大提高导电性.通过合理选择合金成分和变形工艺流程, 可制备不同强度和导电性等级要求的Cu-Fe原位复合材料.