TBa2Cu3O7能隙及低温物性的第一原理计算

采用密度泛函理论(DFT)中的BLYP和ROBLYP交换.相关泛函,基于YBa2Cu3O7单晶胞即39个原子组成的团簇模型,计算了其能隙、磁化系数、电子比热及比热系数随温度的变化关系,并分析了在不同温度下其最高占据态的分子轨道图.结果表明,YBa2Cu3O7存在3个特征温度Tc、T*和T0,在正常态存在赝能隙,并且其超导能隙和赝能隙均具有d波对称性.     

Effect of Cu~(2+)ions on bioleaching of marmatite

The effect of Cu~(2+)ions on bioleaching of marmatite was investigated through shake leaching experiments.The bacteria inoculated are a mixed culture ofAcidithiobacillus ferrooxidans,Acidithiobacillus thiooxidans and Lepthospirillum ferrooxidans.The results show that zinc is selectively leached,and the addition of appropriate content of Cu~(2+)ions has positive effect on the bioleaching of marmatite.SEM and EDX analyses of the leaching residue reveal that a product layer composed of iron sulfide, element...     

Microstructural characteristics and paint-bake response of Al-Mg-Si-Cu alloy

The microstructural characteristics and paint-bake response of 6022 alloy with 0.3% Cu （mass fraction） were studied using optical microscope, scanning electron microscope（SEM）, transmission electron microscope（TEM） and tensile tester. The results indicate that the phase constituents in the as-cast microstructure are Mg2Si, Si, Al5Cu2Mg8Si6, Al5FeSi, α-Al（MnCrFe）Si and CuAl2. During the following homogenization, CuAl2, Al5Cu2Mg8Si6 and Mg2Si phases are almost completely dissolved, and Al5FeSi transforms to α-Al（MnCrFe）Si particles. After rolling, the phase constituents in the alloy change less except the precipitation of Mg2Si particles, and the precipitation behavior of Mg2Si strongly depends on the thermomechanical conditions. Cu addition significantly increases the paint-bake response of 6022 alloy by facilitating the formation of β＂ phase. Therefore, the tensile strength of 6022 alloy with 0.3% Cu is higher than that of 6022 alloy without Cu after paint-bake cycle.     

Effect of BaO addition on electric conductivity of xCu/10NiO-NiFe2O4 cermets

The effects of BaO addition on the phase composition, relative density and electric conductivity of xCu/10NiO-NiFe2O4 （x=5, 10） eermets were studied, which were prepared with cold isostatic pressing-sintering process. The results show that the relative densities of 5Cu/10NiO-NiFe2O4 cermet doped with 1% BaO （mass fraction） and 10Cu/10NiO-NiFe2O4 cermet doped with 1% BaO sintered at 1 473 K in nitrogen atmosphere, are increased by about 9.86% and 9.75% compared with the undoped BaO cermets, respectively. And the electric conductivities 22.79 S/cm of 5Cu/10NiO-NiFe2O4 cermets adding 1% BaO and 23.10 S/cm of 10Cu/10NiO-NiFe2O4 cermets adding 1% BaO are obtained, which are 2.21 times and 1.47 times of those of undoped samples, respectively. Moreover, the 10Cu/10NiO-NiFe2O4 cermets doped with 1% BaO have a maximum σ0 of 58.91 S/cm and electric conductivity of 23.10 S/cm at 1 233 K. Maybe low melting-point phases of BaFe2O4 and Ba2Fe2O5 have an excellent electric conductivity in xCu/10NiO-NiFe2O4 （x=5, 10） cermets at 1 233 K.     

某些因素对Cu-Ag合金原位复合材料的结构和性能的影响

制备了具有不同Ag含量的Cu-Ag合金及其原位纤维复合材料,增加Ag含量可以细化铸态组织和Ag纤维尺寸,增大合金的极限拉伸强度和电阻率.但当Ag含量＞20%,这种对组织细化和性能影响的趋势减小.研究了凝固条件、微量稀土添加和中间热处理等冶金学因素对低Ag含量的Cu-Ag合金及其原位纤维复合材料的结构和性能的影响,获得了具有拉伸强度σb＞1.5GPa和导电率γ＞60%IACS的Cu-Ag合金原位纤维复合材料.讨论了大变形Cu-Ag合金原位纳米纤维复合材料所显示的两阶段应变强化效应及其机制.     

FeNbBCu快淬薄带中的巨磁阻抗效应

将制备的Fe83Nb7B9Cu1快淬薄带在520～820℃的温度范围内分别退火20mins,析出晶粒粒径约为8.1～16nm的α-Fe.通过测量退火薄带的巨磁阻抗效应,找到了最佳退火温度,为650℃,测出此时的GMI(Z)的峰值为-54.8%,表明Fe83Nb7B9Cu1退火薄带是性能良好的软磁材料.     

Nd7．5Fe85．9Nb0.25Dy0．75B5．5Cu0．1非晶合金中Nd2Fe14B相的晶化动力学

利用差示扫描热分析法（DSC）研究了非晶Nd7．5Fe85．9Nb0.25Dy0．75B5．5Cu0．1合金中Nd2Fe14B相的晶化动力学。结果表明：当非晶合金以10℃／min升温时,Nd2Fe14B的晶化峰值温度为697.93℃,晶化初期Nd2Fe14B相的晶化激活能为372．17kJ／mol,随其晶化体积分数的增加,晶化激活能逐渐减小。     

稀土Ce对Al4.5Cu合金性能的影响

研究了稀土Ce对Al4.5Cu合金微观组织、凝固区间和凝固过程体积变化的影响.结果表明,稀土Ce对合金微观组织、凝固区间和凝固体积收缩有明显的影响.稀土Ce加入量为4%时,Al4.5Cu合金同液两相区间温度为640～600℃,合金晶粒组织细化,圆整;体积收缩率仅为未加Ce时的68.6%.     

Ti_3AlC_2与Cu合金的电弧焊接

采用无焊料电弧焊方法对Ti_3AlC_2陶瓷与Cu(Mg)合金进行焊接.观察分析了接头组织结构和物相组成,测试了焊接试样的弯曲强度.结果表明,Ti_3AlC_2陶瓷和Cu(Mg)合金之间具有良好的可焊接性.在适当的焊接工艺下,接头具有典型显微结构:在靠近Cu(Mg)合金的区域,自生成的细小TiCx颗粒均匀弥散在Cu(Ti, Al, Mg)合金网络内;在靠近Ti_3AlC_2陶瓷的区域,形成TiC_x相与Cu(Ti, Al, Mg)合金相交替层叠的特殊结构.焊接试样的断裂发生在Ti_3AlC_2陶瓷部分,表明接头的抗弯强度高于被焊接的Ti_3AlC_2陶瓷材料.     

Cu对Mg-Zn-Ca合金非晶形成能力与力学性能的影响

采用铜模造制备直径为3 mm的Mg70-xZn25Ca5Cux(x=1,2,3.5,5)系列合金.分别采用扫描电镜(SEM)、X射线衍射仪(XRO)、力学性能试验装置研究合金的显微组织、相组成和铸态样品的压缩性能,并对断日形貌进行分析.结果表明:Mg69Zn25Ca5Cu1可以形成直径为3 mm的非晶合金,其强度和塑性应变分别为690 MPa和1.7%.与Mg-Zn-Ca合金相比,其非晶形成能力和塑性应变均有提高.同时这也是目前在直径大于2 mm的Mg基非晶合金中所发现的最大塑性应变量.