微合金元素Cu及等温温度对低碳硅锰钢氢扩散行为的影响

目的探究微合金及热处理工艺对氢扩散的影响。方法设计含0.4%Cu及未含Cu的两种低合金钢,采用两相区保温-淬火-配分(IQP)热处理工艺获得280、400℃等温温度的试验钢,通过SEM、EBSD、电化学氢渗透等方法分析其氢扩散行为。结果对于无Cu钢,当等温温度为280℃时,大角度晶界占比55%,残余奥氏体(RA)体积分数约为0.02%,氢扩散系数约为1.82×10-7cm2/s;当等温温度为400℃时,大角度晶界占比51%,RA体积分数约为0.35%,氢扩散系数约为1.30×10-7 cm2/s。对于含0.4%Cu的低合金钢,等温温度为280℃时,大角度晶界占比46%,RA体积分数约为0.15%,氢扩散系数约为2.70×10-7 cm2/s;贝氏体区等温温度为400℃时,大角度晶界占比33%,RA体积分数约为3.00%,氢扩散系数约为0.40×10-7 cm2/s。结论微合金元素Cu的添加,导致晶粒度的细化,大角度晶界占比更低,RA含量更高,从而其氢扩散系数更低,不利于氢扩散行为的发生。当等温温度由280℃升到400℃时,虽然会导致晶粒粗化,但大角度晶界占比更低,且RA含量更高,同样会降低其氢扩散系数,不利于氢扩散行为的发生。由此可知,含0.4%Cu、等温温度为400℃时,IQP钢的氢扩散能力最差。     

接触反应钎焊中间层材料的选择原则--接触反应共晶液相产生的方向性

以Al/Cu ,Al/Si接触反应偶为例 ,研究了不同基体与反应材料组合下 ,共晶液相的产生及其铺展行为。结果表明 :Al/Cu ,Al/Si接触反应偶中共晶液相的产生具有明显的方向性—优先在Al侧产生 ,这是扩散偶之间的互扩散系数不等所造成的必然结果。而在接触反应钎焊的中间层材料选择过程中 ,考虑接触反应液相产生的方向性是发挥接触反应钎焊优越性的保障     

水热碱性条件下(糖)醇对Cu2+的还原

研究了不同水热(180℃)碱性条件下(糖)醇对Cu2 的还原,通过控制不同水热条件及添加不同种类和质量的(糖)醇,借助XRD和SEM分析,得到了不同的产物及产物形貌.当不加任何(糖)醇时,产物为CuO,其形貌随c(OH-)/c(Cu2 )增大而由薄带和球形颗粒向薄片转变;当在不同c(OH-)/c(Cu2 )中添加同量的D-Sorbitol,c(OH-)/c(Cu2 )=2时产物主要为Cu2O,具有多种形貌,c(OH-)/c(Cu2 )=4和6时产物都为金属Cu,但c(OH)/c(Cu2 )=4时产物形貌有线状、棒状及立方六角状,c(OH-)/c(Cu2 )=6时产物主要为颗粒状;当保持c(OH-)/c(Cu2 )=4而添加不同质量的D-Sorbitol时,产物也都为金属Cu,形貌上有较大差异;当保持c(OH-)/c(Cu2 )=4而添加等摩尔数的不同(糖)醇D-Sorbitol,Mannitol,Xylitol时,产物还都是金属Cu,形貌随(糖)醇不同而发生显著变化.研究结果表明,水热(180℃)条件下,c(OH-)/c(Cu2 )值可以决定产物形貌,(糖)醇的加入不仅可以与Cu2 或其配合物发生氧化还原反应,而且其加入的质量和种类可以决定产物的形貌.     

Cu双晶的循环形变行为与疲劳裂纹萌生：Ⅰ.循环形变行为和滑移形貌

在切应变幅γpl≈1066×10-4至9．1×10-3s范围内，研究了四种Cu双晶的循环形变行为,实验结果表明，对于含两单滑移取向组元晶体的三种子行晶界双晶，其循环形变行为表现出和单滑移取向Cu单晶类似的特征，循环应力一应变（CSS）曲线上存在一平台区，但平台应力都高于单滑移取向Cu单晶的典型值（28MPa），且各有所差别对于含一单滑移和一双滑移组元晶体的垂直晶界双晶，CSS曲线上没有明显的平台，并且发现曲线与Cu多晶的CSS曲线非常类似表面形貌观察表明，上述循环形变行为与由于晶界约束而导致的双滑移或多沿移现象以及开动沿移系的位错反应强度密切相关     

Induced effects of Cu underlayer on（111） orientation of Fe50 Mn50 thin films

Effects of Cu underlayer on the structure of Fe50 Mn50 films were studied. Samples with a structure of Fe50 Mn50 (200 nm)/Cu(tcu) were prepared by rnagnetron sputtering on thermally oxidized silicon substrates at room temperature. The thickness of Cu underlayer varied from 0 to 60 nm in the intervals of 10 nm. High-vacuum annealing treatments, at different temperatures of 200, 300 and 400℃ for 1 h, respectively, on the Fe50Mn50 (200 nm)/Cu(20 nm) thin films were performed. The surface morphologies and textures of the samples were measured by field emission scan electronic microscope (FE-SEM) and X-ray diffraction(XRD). Energy dispersive X-ray spectroscopy (EDX) and Auger electron spectroscopy(AES) were used to analyze the compositional distribution. It is found that Cu underlayer has an obvious induce effect on (111) orientation of Fe50 Mn50 thin films. The induce effects of Cu on (111) orientation of Fe50 Mn50 changed with the increase of Cu layer thickness and the best effect was obtained at the Cu layer thickness of 20 nm. High-vacuum annealing treatments cause the migration of Mn atoms towards surface of the film and interface between Cu layer and substrate. With the increasing annealing temperature, migration of Mn atoms is more obvious, which leads to a Fe-riched Fe-Mn alloy film.     

Behavior of residual carbon in Sm(Co, Fe, Cu, Zr)z permanent magnets

When sintered Sm(Co, Fe, Cu, Zr)_z permanent magnets are prepared by metal injection molding, some organic binders are added in alloy powder, which leads to much residual carbon in the magnets. The residual carbon decreases magnetic properties and destroys the microstructure of the magnets. In this paper, the behavior of carbon in Sm(Co, Fe, Cu, Zr)_z permanent magnets has been studied. The results indicate that Sm(Co, Fe, Cu, Zr)_z magnets can keep excellent magnetic properties when the carbon content is below 0.1 wt.%: Br ≥ 10 kGs, H_cj ≥ 22 kOe, BH_max ≥ 25 MGOe. When the carbon content is above 0.1 wt.%, Br, H_cj and BH_max decrease with increasing carbon content evidently. Carbon consumes Zr content and forms ZrC, which reduces the volume fraction of the lamella and Sm(Co, Cu)₅ phases. Thus, the cell size increases and the cellular microstructure deteriorates. When the carbon content reaches 0.43 wt.%, there is not enough Sm(Co, Cu)₅ phase to form a uniform cellular microstructure. Br, H_cj and BH_max are approximate to zero. Since carbon has little influence on the content of Sm₂(Co, Fe)₁₇ phase, Ms can keep a high value (≥100 emu/g). ZrC has high melting point (3420 °C) and acts as dispersion particle in the magnets, which prevents the grains of SEM structure growing and reduces the liquid content of green compacts during sintering. Therefore, the density of the magnets decreases.     

THERMODYNAMICS AND PHASE EQUILIBRIUM OF Cu－Y－O，Cu－Y－S，Cu－Y－O－S LIQUID SOLUTIONS

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Al-4%Cu合金定向凝固温度梯度变化及界面形态演化规律

摘　要：研究了Al-4%Cu合金定向凝固界面形态随抽拉速率的演化规律及其转变机制.通过测量自行研制的定向凝固设备的温度梯度,发现温度梯度随抽拉速率的增大而减小,并随炉体温度的升高而增大.研究了Al-4%Cu合金定向凝固的界面演化及生长形态,对比后发现,在胞状生长过程中,竞争淘汰是主要的生长方式;而在高速抽拉过程中,尖端开裂是枝晶的主要生长方式.     

Cu/MgO界面位错的高分辨电子显微镜研究

用高分辨透射电子显微镜对内氧化产生的Cu/MgO界面进行了研究，观察到了取向关系相同的两种不同界面。并运用近重位点阵模型对其界面结构进行了研究，求出了失配位错的3个Burgers矢量和次级位错的3个Burgers矢量，它们分别为：b1^→=1/4[011]MgO,b2^→=1/2[100]Cu,b3^→=1/4[01^-1]MgO;b1^→′=1/12[101]Cu(或1／99[755]MgO),b2^→′=1/12[101^-]Cu（或1/99[75^-5^-]MgO),b3^→′=1/6[010]Cu(或1／10[01^-1]MgO)失配位错之间的距离与实验测量结果符合得很好。     

Pre-annealing effect of electroless Ni−B deposit as a diffusion barrier for electroplated Cu electrodes

Ni−B film of 1 μm thickness was electrolessly deposited on an electroplated Cu bus electrode. The film, which encapsulates the Cu bus electrodes, prevents Cu oxidation and serves as a diffusion barrier against Cu contamination of the transparent dielectric layer in a plasma display during the firing process at 580 °C. The microstructure of theas-deposited barrier film was amorphous phase and crystallized to Ni and Ni₃B after annealing at 300 °C. The good barrier properties observed here can be explained by Ni₃B precipitates at the grain boundaries acting as a fast diffusion path via pre-annealing at 300 °C before the firing process at 580 °C.