Nanoscratch Characterization of GaN Epilayers on c- and a-Axis Sapphire Substrates

In this study, we used metal organic chemical vapor deposition to form gallium nitride (GaN) epilayers on c- and a-axis sapphire substrates and then used the nanoscratch technique and atomic force microscopy (AFM) to determine the nanotribological behavior and deformation characteristics of the GaN epilayers, respectively. The AFM morphological studies revealed that pile-up phenomena occurred on both sides of the scratches formed on the GaN epilayers. It is suggested that cracking dominates in the case of GaN epilayers while ploughing during the process of scratching; the appearances of the scratched surfaces were significantly different for the GaN epilayers on the c- and a-axis sapphire substrates. In addition, compared to the c-axis substrate, we obtained higher values of the coefficient of friction (μ) and deeper penetration of the scratches on the GaN a-axis sapphire sample when we set the ramped force at 4,000 μN. This discrepancy suggests that GaN epilayers grown on c-axis sapphire have higher shear resistances than those formed on a-axis sapphire. The occurrence of pile-up events indicates that the generation and motion of individual dislocation, which we measured under the sites of critical brittle transitions of the scratch track, resulted in ductile and/or brittle properties as a result of the deformed and strain-hardened lattice structure.     

Guest-host ferroelectric side-chain liquid crystalline polymeric materials with improved electro-optical properties

A ferroelectric side-chain liquid crystalline polysiloxane (FLCP) containing azobenzene dyes as guest molecules for electro-optics has been investigated. The intensity and frequency of the Goldstone mode for the FLCP were increased remarkably after doping with azobenzene dyes. Larger fluctuation of the spontaneous polarization vector in each smectic layer under an applied electric field can be brought about with the addition of a strong dipole-moment guest molecule. This leads to a larger spontaneous polarization and shorter response time. It was found that the doping of a suitable amount of a strong dipole-moment azobenzene dye in the LC phase of the FLCP is helpful for the improvement of the electro-optical properties.     

2,2,6,6‐Tetramethylpiperidine‐1‐oxyl‐mediated living mini‐emulsion polymerization of styrene under ambient pressure in a semi‐batch process: effect of ascorbic acid

2,2,6,6‐Tetramethylpiperidine‐1‐oxyl (TEMPO)‐mediated living mini‐emulsion polymerization of styrene with feeding of an ascorbic acid aqueous solution throughout the polymerization was performed at 90 °C under ambient pressure. The concentrations of sodium dodecylbenzenesulfonate (SDBS) and ascorbic acid were varied to study the shell polymerization mechanism of latex particles and evolution of growing chains. Interactions between SDBS and ascorbic acid and incompatibility between ascorbic acid and styrene were evident from UV‐visible analyses. High hydrophilicity of ascorbic acid in the aqueous phase was proved using a gravimetric method. Accordingly, the formation of a surface barrier on particles was proposed because of the interactions between SDBS and ascorbic acid. For higher SDBS concentration, the surface barrier on the particles was denser. Therefore, the polymerization rate decreased with increasing SDBS concentration. However, the polymerization rate increased with increasing ascorbic acid concentration. This was due to a higher consumption rate of TEMPO by ascorbic acid. Free TEMPO tended to reside in surface zones of the particles because of the surface activity between the aqueous and oil phases. The surface zones were thus the main loci where TEMPO was consumed by ascorbic acid. The estimated number‐average molecular weight (M_n) of growing chains increased in a linear fashion with conversion. This indicated that the growing chains were produced via living mini‐emulsion polymerization. For these growing chains, the estimated M_n and final polydispersity increased with increasing SDBS concentration. This was caused by a decrease in TEMPO concentration in the surface zones of particles with increasing SDBS concentration. The ‘livingness’ of polystyrene was identified by conducting bulk polymerization of chain extension. Based on the results obtained, a shell polymerization mechanism of latex particles was proposed, and living mini‐emulsion polymerization was limited to the surface zones of particles. Copyright © 2010 Society of Chemical Industry     

MODIFIED MULTIPLE ONE-DIMENSIONAL ADAPTIVE GRID METHOD

Shyy's multiple one-dimensional adaptive grid method is modified to improve the grid skewness. A test problem of steady isotropic heat conduction illustrates that both the grid distortion and the accuracy of temperature distribution are improved significantly.     

Fischer–Tropsch synthesis. Compositional changes in an iron catalyst during activation and use

The equilibrium phase compositions of iron have been calculated for gas compositions that could be encountered during the Fischer–Tropsch synthesis. The gas compositions measured experimentally for CO conversion levels in the 30–90% range show that iron should be present as the carbide phase. However, experimental characterization of iron catalysts show that a significant fraction of the iron is present as Fe₃O₄ following synthesis for several days. A model that can account for the experimental catalyst phase composition and the gases present in the reactor would have a core of Fe₃O₄ and an outer layer of iron carbides.     

Wafer defect inspection by neural analysis of region features

Wafer defect inspection is an important process that is performed before die packaging. Conventional wafer inspections are usually performed using human visual judgment. A large number of people visually inspect wafers and hand-mark the defective regions. This requires considerable personnel resources and misjudgment may be introduced due to human fatigue. In order to overcome these shortcomings, this study develops an automatic inspection system that can recognize defective LED dies. An artificial neural network is adopted in the inspection. Actual data obtained from a semiconductor manufacturing company in Taiwan were used in the experiments. The results show that the proposed approach successfully identified the defective dies on LED wafers. Personnel costs and misjudgment due to human fatigue can be reduced using the proposed approach.     

Easy preparation of crosslinked polymer films from polyoxyalkylene diamine and poly(styrene–maleic anhydride) for electrostatic dissipation

The curing reaction of polyoxyalkylene diamine and poly(styrene–maleic anhydride) was able to produce polymer films that were hygroscopic in nature. The process involved the formation of an imine intermediate by dissolving the diamine monomers in a ketone solvent, followed by instant casting into films before the solution self‐cured into a gel product. Hydrophilic films were formed by the fast reaction of amine with anhydride while evaporating the solvent under vacuum. The resulting films exhibited dissipation of electrostatic charges over a wide range, from 10^9.4 to 10^4.1 Ω/sq surface resistivity. The low resistivity was attributed to the functionality of hydrophilic polyoxyethylene (POE), which was able to adsorb moisture and optionally to the added metal ion salts. Furthermore, the slightly crosslinked network prevented POE from having crystallinity and rendered the films solvent resistant, thermally stable, and suitable for applications as antistatic and polymeric electrolytes. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 716–723, 2007     

Application of Al/PI composite bumps to COG bonding process

This work demonstrates the probing, testability and applicability of Al/PI (aluminum/polyimide) composite bumps to the chip on-glass (COG) bonding process for liquid crystal display (LCD) driver chip packaging. The experimental results showed that the thickness of Al overlayer on PI core of the bump, the location of pin contact, and the bump configuration affect bump probing testability. The bump with type IV configuration prepared in this work exhibited excellent probing testability when its Al overlayer thickness exceeded 0.8 μm. We further employed Taguchi method to identify the optimum COG bonding parameters for the Al/PI composite bump. The four bonding parameters, bonding temperature, bonding time, bonding pressure and thickness of Al overlayer are identified as 180° C, 10 s, 800 kgf/cm² and 1.4 μm, respectively. The optimum bonding condition was applied to subsequent COG bonding experiments on glass substrates containing Al pads or indium tin oxide (ITO) pads. From the results of resistance measurement along with a series of reliability tests, Al pad is found to be a good substrate bonding pad for Al/PI bump to COG process. Excellent contact quality was observed when the bumps had Al overlayer thickness over 1.1 μm. As to the COG specimens with substrate containing ITO pads, high joint resistance suggested that further contact quality refinement is necessary to realize their application to COG process     

Optimization of turning operations with multiple performance characteristics using the Taguchi method and Grey relational analysis

This study investigated the optimization of CNC turning operation parameters for SKD11 (JIS) using the Grey relational analysis method. Nine experimental runs based on an orthogonal array of Taguchi method were performed. The surface properties of roughness average and roughness maximum as well as the roundness were selected as the quality targets. An optimal parameter combination of the turning operation was obtained via Grey relational analysis. By analyzing the Grey relational grade matrix, the degree of influence for each controllable process factor onto individual quality targets can be found. The depth of cut was identified to be the most influence on the roughness average and the cutting speed is the most influential factor to the roughness maximum and the roundness. Additionally, the analysis of variance (ANOVA) is also applied to identify the most significant factor; the depth of cut is the most significant controlled factors for the turning operations according to the weighted sum grade of the roughness average, roughness maximum and roundness.