Fabrication and Thermal Dissipation Properties of Carbon Nanofibers Derived from Electrospun Poly(Amic Acid) Carboxylate Salt Nanofibers

Polyimides (PIs) possess excellent mechanical properties, thermal stability, and chemical resistance and can be converted to carbon materials by thermal carbonization. The preparation of carbon nanomaterials by carbonizing PI‐based nanomaterials, however, has been less studied. In this work, the fabrication of PI nanofibers is investigated using electrospinning and their transformation to carbon nanofibers. Poly(amic acid) carboxylate salts (PAASs) solutions are first electrospun to form PAAS nanofibers. After the imidization and carbonization processes, PI and carbon nanofibers can then be obtained, respectively. The Raman spectra reveal that the carbon nanofibers are partially graphitized by the carbonization process. The diameters of the PI nanofibers are observed to be smaller than those of the PAAS nanofibers because of the formation of the more densely packed structures after the imidization processes; the diameters of the carbon nanofibers remain similar to those of the PI nanofibers after the carbonization process. The thermal dissipation behaviors of the PI and carbon nanofibers are also examined. The infrared images indicate that the transfer rates of thermal energy for the carbon nanofibers are higher than those for the PI nanofibers, due to the better thermal conductivity of carbon caused by the covalent sp² bonding between carbon atoms.     

Making reusable reaction-bonded silicon nitride crucibles for silicon casting from kerf-loss silicon waste

Silicon kerf loss during wafer slicing and the broken quartz crucibles after silicon casting are two major solid wastes from photovoltaic (PV) industry. Especially, the recycle of kerf-loss silicon has become an urgent issue because near 100 000 t of solid wastes are generated every year. One of the most meaningful recycle routes of the kerf-loss silicon is to make silicon nitride crucibles to replace the quartz crucibles. In this study, we demonstrated how this is feasible through acid leaching refining, slip casting, and nitridation. The reaction-bonded silicon nitride (RBSN) crucibles after oxidation were found pure enough for silicon ingot growth. More importantly, they could be reused after ingot growth. With the present examples, the potential of using the kerf-loss silicon for fine ceramics is prominent.     

Emergence of Ag particles and their effects on the mechanical properties of TaN-Ag nanocomposite thin films

TaN-Ag nanocomposite films were deposited by reactive co-sputtering on tool steel substrates. The films were then annealed using RTA (Rapid Thermal Annealing) at 350 °C for 2, 4, 8 min respectively to induce the nucleation and growth of Ag particles in TaN matrix and on film surface. C-AFM (Conductive Atomic force Microscopy) and FESEM (Field-Emission Scanning Electron Microscopy) were applied to examine the Ag nano-particles emerged on the surface of these thin films. A nano-indenter and a pin-on-disk tribometer were used to study the effect of annealing on the films' mechanical properties. The results reveal that annealing by RTA can cause Ag nano-particles to emerge on the TaN surface. Consequently, the mechanical properties of the films will vary depending on annealing conditions, Ag content, and Ag particle emergence.     

Influence of A-site Ba substitution on microwave dielectric properties of (BaxMg1−x)(A0.05Ti0.95)O3 (A=Zr,Sn) ceramics

The microwave dielectric properties of (Ba_xMg_1−x)(A_0.05Ti_0.95)TiO₃ (A=Zr, Sn) ceramics were investigated with regard to substitution of Ba for Mg of A-site. The microwave dielectric properties were correlated with the Ba content. With an increase in Ba content from 0.01 to 0.1, the dielectric constant and the τ_f value increased, but the Q×f value decreased. The sintered (Ba_xMg_1−x)(Zr_0.05Ti_0.95)TiO₃ (called B_xMZT) ceramics had a permittivity in the range of 19.1−20.6, quality factor from 180,000 to 25,000 GHz, and variation in temperature coefficient of resonant frequency from −35 to −39 ppm/°C with increasing composition x. For sintered (Ba_xMg_1−x)(Sn_0.05Ti_0.95)TiO₃ (called B_xMST) ceramics, the dielectric constant increased from 19 to 20.5, Q×f value increased from 120,000 to 37,000 (GHz), and the τ_f value increased from −50 to −3.3 ppm/°C as the x increased from 0.01 to 0.1. When A=Sn and x=0.1, (Ba_0.1Mg_0.9)(Sn_0.05Ti_0.95)TiO₃ ceramics exhibited dielectric constant of 20.5, Q×f value of 37,000 (GHz), and a near-zero τ_f value of −3.3 ppm/°C sintered at 1210 °C for 4 h.     

Modelling complex manufacturing systems using discrete event simulation

This paper presents an approach in simulating complex manufacturing systems. The approach is founded on developing several general purpose simulation generators for an assembly station, a manufacturing cell, and an inventory transfer function. These simulation generators can then be linked together to create a model of a complex manufacturing system. A typical manufacturing system is modelled using these simulation generators and the results summarized.     

Integrated assembly and disassembly sequence planning using a GA approach

In a product life cycle, an assembly sequence is required to produce a new product at the start, whereas a disassembly sequence is needed at the end. In typical assembly and disassembly sequence planning approaches, the two are performed as two independent tasks. In this way, a good assembly sequence may contradict the cost considerations in the disassembly sequence, and vice versa. In this research, an integrated assembly and disassembly sequence planning model is presented. First, an assembly precedence graph (APG) and a disassembly precedence graph (DPG) are modelled. The two graphs are transformed into an assembly precedence matrix (APM) and a disassembly precedence matrix (DPM). Second, a two-loop genetic algorithm (GA) method is applied to generate and evaluate the solutions. The outer loop of the GA method performs assembly sequence planning. In the inner loop, the reverse order of the assembly sequence solution is used as the initial solution for disassembly sequence planning. A cost objective by integrating the assembly costs and disassembly costs is formulated as the fitness function. The test results show that the developed method using the GA approach is suitable and efficient for the integrated assembly and disassembly sequence planning. Example products are demonstrated and discussed.     

VLSI Architecture for Lifting-Based Shape-Adaptive Discrete Wavelet Transform with Odd-Symmetric Filters

In this paper, a VLSI architecture for lifting-based shape-adaptive discrete wavelet transform (SA-DWT) with odd-symmetric filters is proposed. The proposed architecture is comprised of a stage-based boundary extension strategy and the shape-adaptive boundary handling units. The former could reduce the complexity of multiplexers that are introduced to solve the shape-adaptive boundary extension. The latter consists of two multiplexers and can solve the shape-adaptive boundary extension locally without any additional register. Two case studies are presented, including the JPEG 2000 default (9, 7) filter and MPEG-4 default (9, 3) filter. According to comparison results with previous architectures, the efficiency of the proposed architectures is proven.Chao-Tsung Huang was born in Kaohsiung, Taiwan in 1979. He received the B.S. degree from the Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan in 2001. He is currently working toward the Ph.D. degree at the Graduate Institute of Electronics Engineering, National Taiwan University. His major research interests include VLSI design and implementation for 1-D, 2-D, and 3-D Discrete Wavelet Transform. cthuang@video.ee.ntu.edu.twPo-Chih Tseng was born in Tao-Yuan, Taiwan in 1977. He received the B.S. degree in Electrical and Control Engineering from National Chiao Tung University in 1999 and the M.S. degree in Electrical Engineering from National Taiwan University in 2001. He currently is pursuing the Ph.D. degree at the Graduate Institute of Electronics Engineering, Department of Electrical Engineering, National Taiwan University. His research interests include VLSI design and implementation for signal processing systems, energy-efficient reconfigurable computing for multimedia systems, and power-aware image and video coding systems. pctseng@video.ee.ntu.edu.twLiang-Gee Chen (S84–M86–SM94–F01) received the B.S., M.S., and Ph.D. degrees in electrical engineering from National Cheng Kung University, Tainan, Taiwan, R.O.C., in 1979, 1981, and 1986, respectively.In 1988, he joined the Department of Electrical Engineering, National Taiwan University, Taipei, Taiwan, R.O.C. During 1993–1994, he was a Visiting Consultant in the DSP Research Department, AT&T Bell Labs, Murray Hill, NJ. In 1997, he was a Visiting Scholar of the Department of Electrical Engineering, University of Washington, Seattle. Currently, he is Professor at National Taiwan University, Taipei, Taiwan, R.O.C. His current research interests are DSP architecture design, video processor design, and video coding systems.Dr. Chen has served as an Associate Editor of IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS FOR VIDEO TECHNOLOGY since 1996, as Associate Editor of the IEEE TRANSACTIONS ON VLSI SYSTEMS since 1999, and as Associate Editor of IEEE TRANSACTIONS CIRCUITS AND SYSTEMS II since 2000. He has been the Associate Editor of the Journal of Circuits, Systems, and Signal Processing since 1999, and a Guest Editor for the Journal of Video Signal Processing Systems. He is also the Associate Editor of the PROCEEDINGS OF THE IEEE. He was the General Chairman of the 7th VLSI Design/CAD Symposium in 1995 and of the 1999 IEEE Workshop on Signal Processing Systems: Design and Implementation. He is the Past-Chair of Taipei Chapter of IEEE Circuits and Systems (CAS) Society, and is a member of the IEEE CAS Technical Committee of VLSI Systems and Applications, the Technical Committee of Visual Signal Processing and Communications, and the IEEE Signal Processing Technical Committee of Design and Implementation of SP Systems. He is the Chair-Elect of the IEEE CAS Technical Committee on Multimedia Systems and Applications. During 2001–2002, he served as a Distinguished Lecturer of the IEEE CAS Society. He received the Best Paper Award from the R.O.C. Computer Society in 1990 and 1994. Annually from 1991 to 1999, he received Long-Term (Acer) Paper Awards. In 1992, he received the Best Paper Award of the 1992 Asia-Pacific Conference on circuits and systems in the VLSI design track. In 1993, he received the Annual Paper Award of the Chinese Engineer Society. In 1996 and 2000, he received the Outstanding Research Award from the National Science Council, and in 2000, the Dragon Excellence Award from Acer. He is a member of Phi Tan Phi. lgchen@video.ee.ntu.edu.tw     

Co‐tier downlink interference management in dense femtocell networks

With the adoption of long‐term evolution standard for 4G mobile communications, the deployment of femtocell base stations (FBSs) to cope with the surging traffic in mobile wireless communication is becoming increasingly popular. However, with the random installation of FBSs, the problem of interference among FBSs is still a challenge. In this paper, assuming the presence of a femtocell management system that can control and coordinate the densely deployed FBSs, a novel power backoff scheme is proposed that determines the appropriate transmit power of each FBS so that the interference is reduced. Simulation results for randomly deployed FBSs in an environment with shadowing using MATLAB are provided, showing that our proposed methods can effectively mitigate the co‐tier downlink interference while improving the system capacity in a densely deployed femtocell network with shared spectrum use. Quantitatively, the average interference is reduced by roughly 90% to 100% of dBm, and the average capacity is increased by more than 80%. These results attest to the effectiveness of the proposed scheme.