Detection and classification of road signs in natural environments

An automatic road sign recognition system first locates road signs within images captured by an imaging sensor on-board of a vehicle, and then identifies the detected road signs. This paper presents an automatic neural-network-based road sign recognition system. First, a study of the existing road sign recognition research is presented. In this study, the issues associated with automatic road sign recognition are described, the existing methods developed to tackle the road sign recognition problem are reviewed, and a comparison of the features of these methods is given. Second, the developed road sign recognition system is described. The system is capable of analysing live colour road scene images, detecting multiple road signs within each image, and classifying the type of road signs detected. The system consists of two modules: detection and classification. The detection module segments the input image in the hue-saturation-intensity colour space, and then detects road signs using a Multi-layer Perceptron neural-network. The classification module determines the type of detected road signs using a series of one to one architectural Multi-layer Perceptron neural networks. Two sets of classifiers are trained using the Resillient-Backpropagation and Scaled-Conjugate-Gradient algorithms. The two modules of the system are evaluated individually first. Then the system is tested as a whole. The experimental results demonstrate that the system is capable of achieving an average recognition hit-rate of 95.96% using the scaled-conjugate-gradient trained classifiers.     

RBF neural networks for solving the inverse problem of backscattering spectra

This paper investigates a new method to solve the inverse problem of Rutherford backscattering (RBS) data. The inverse problem is to determine the sample structure information from measured spectra, which can be defined as a function approximation problem. We propose using radial basis function (RBF) neural networks to approximate an inverse function. Each RBS spectrum, which may contain up to 128 data points, is compressed by the principal component analysis, so that the dimensionality of input data and complexity of the network are reduced significantly. Our theoretical consideration is tested by numerical experiments with the example of the SiGe thin film sample and corresponding backscattering spectra. A comparison of the RBF method with multilayer perceptrons reveals that the former has better performance in extracting structural information from spectra. Furthermore, the proposed method can handle redundancies properly, which are caused by the constraint of output variables. This study is the first method based on RBF to deal with the inverse RBS data analysis problem.     

Specification of communicating processes: temporal logic versus refusals-based refinement

In this paper we consider the relationship between refinement-oriented specification and specifications using a temporal logic. We investigate the extent to which one can check whether a program in a process algebra, such as Communicating Sequential Processes (CSP), satisfies a temporal logic specification using a refinement-based model checker, such as FDR. We consider what atomic formulae are appropriate in a temporal logic for specifying communicating processes, in particular where one wants to talk about the availability of events. We then show that, perhaps surprisingly, the standard stable failures model is not adequate for capturing specifications in such a logic: instead the refusal traces model must be used. We formalise the logic by giving it a semantics in this model. We show that the temporal operators eventually and until, and negation, cannot, in general, be tested for via simple refinement checks. For the remaining fragment of the logic, we present a translation into simple refinement checks. Finally, we show that refusal traces equivalence is characterised by a slightly augmented version of that fragment. M. J. Butler     

Peristaltic micropump system with piezoelectric actuators

This work presents a driving system for a peristaltic micropump that is based on piezoelectric actuation. The effects of the actuation sequence on pump performance are also considered. A valveless peristaltic micropump based on piezoelectric actuation is designed and fabricated using microelectromechanical system technology. The pump has three parts––silicon, Pyrex glass and commercially available bulk PZT (lead zirconate titanate) chips. The peristaltic micropump actuated by PZT chips comprises three chambers that are in series. The driving system consists of an ATmega 8535 microprocessor, a high voltage power supply, three differential amplifiers, a phase controller, an A/D converter, a 555 oscillator and an LCD module. It is supplied via a 110 Vrms 60-Hz AC line and is programmable. The system can produce step-function signals with voltages of up to 100 V_pp and frequencies ranging from 10 Hz to 1 kHz, as the inputs for the pump. Fluid pumping with air is successfully demonstrated. Additionally, 3-, 4- and 6-phase actuation sequences for the pump are designed and used to study the effects on pump performance, as revealed by the flow rate and the displacement of a pump diaphragm. The experimental results show that the flow rate and the displacement of the diaphragm actuated by the 4-phase sequence exceed those actuated by the 3- and 6-phase sequences. A flow rate of 17.6 μl min⁻¹ and a displacement of 2.91 μm (peak-to-peak) in 4-phase peristaltic motion are achieved at 100 Hz and 100 V_pp. The results demonstrate that the pump actuated in the 4-phase sequence is the most efficient. Consequently, the actuation sequences can affect the pump performance.     

Direct microscale imprinting of Al at room temperature with Si inserts

For direct imprinting of metals, hard materials such as diamond and SiC have been used to construct mold inserts in preference to Si, despite the ease in fabricating Si-based micro-/nano- scale structures. In this communication, we demonstrate that micron scale Al structures can be replicated with good fidelity at room temperature by compression molding with Si inserts without incurring insert damage. We further report on results of a finite element analysis of the mechanics of the molding process. The finite element results provide some understanding of the observed lack of damage to the Si inserts.     

Design and dynamics of an innovative micro gyroscope against coupling effects

This paper presents an innovative micro gyroscope design. The proposed tri-axis gyroscope possesses the capability of detecting three-dimensional angular motions. The motion of each sensing element is, by elaborate mechanical design, restricted to move in orthogonal direction to each other such that the measurements by high-resolution capacitors with signal processing circuits are decoupled and precisely represent, to some extent, angular velocity components in three axes. The drive electrode comb is used to constantly vibrate the proof mass in tangential direction by sinusoidal voltage. The signal bandwidth is increased by distributed translational proof masses, placed ninety degree apart from each other. Each individual proof mass is designed to move solely in radial direction so that superior mode matching can be achieved. In order to ensure better repeatability and more reliability, the suspension flexures and damping effects are studied such that stress of the proposed micro gyroscope is reduced but the span of angular displacements is increased. Owing to the complicated geometry of the suspension flexures, finite element method (FEM) is employed to obtain more exact stiffness values and compared with theoretical analysis. The dynamic model of the proposed gyroscope is established to include non-linear terms and embedded mechanical constraints. The entire micro device can be produced merely by surface fabrication such that the mass production cost can be considered at the design stage, while the resolution, bandwidth and decoupling capability of tri-axis detection are enhanced.     

Post-buckling dynamic behavior of self-assembled 3D microstructures

The paper presents the snap-through phenomenon in the case of micro fabricated clamped-clamped buckled beam. This dynamic post-buckling behavior is likely to occur in 3D microstructures when they are subjected to large vibration amplitudes. The main difference between this work and previous studies is the MEMS specific beam dimension, especially the large initial deflection of the buckled beam that involves the inversion of the two first resonance frequencies. The mathematical development allows showing how the vibration amplitude of the supporting base affects the post-buckling dynamic behavior of the beam. For each frequency, the limit between the stable behavior and the snap-through behavior is evaluated. Moreover, the effect of environment is taken into account from the damping point of view. Samples are fabricated and the experiment is described. Measurements are compared to the theoretical approach and the results are in good agreement with the proposed model.     

Replication of nanostructures on microstructures by intermediate film mold inserted hot embossing process

The present study proposes a simple method to replicate nano/micro combined multiscale structures using an intermediate film mold and anodic aluminum oxide (AAO) nanomold in hot embossing process. The proposed method is simply to add an intermediate film mold with microscale thru-hole patterns to the ordinary mold system, on which nanostructures are patterned, in the hot embossing process. The intermediate film mold is inserted between polymer substrate and AAO nanomold. During the hot embossing process, the polymer first fills microscale thru-hole patterns in the intermediate film mold and subsequently fills nanopores in AAO nanomold, resulting in the nano/micro combined structures. The intermediate film molds, which have microscale thru-hole patterns were fabricated by micro-milling, laser ablation, etching methods and/or LIGA process. The nano/micro combined structures were successfully replicated by the proposed method.     

Continuous query processing over music streams based on approximate matching mechanisms

It is foreseen that more and more music objects in symbolic format and multimedia objects, such as audio, video, or lyrics, integrated with symbolic music representation (SMR) will be published and broadcasted via the Internet. The SMRs of the flowing songs or multimedia objects will form a music stream. Many interesting applications based on music streams, such as interactive music tutorials, distance music education, and similar theme searching, make the research of content-based retrieval over music streams much important. We consider multiple queries with error tolerances over music streams and address the issue of approximate matching in this environment. We propose a novel approach to continuously process multiple queries over the music streams for finding all the music segments that are similar to the queries. Our approach is based on the concept of n-grams, and two mechanisms are designed to reduce the heavy computation of approximate matching. One mechanism uses the clustering of query n-grams to prune the query n-grams that are irrelevant to the incoming data n-gram. The other mechanism records the data n-gram that matches a query n-gram as a partial answer and incrementally merges the partial answers of the same query. We implement a prototype system for experiments in which songs in the MIDI format are continuously broadcasted, and the user can specify musical segments as queries to monitor the music streams. Experiment results show the effectiveness and efficiency of the proposed approach.     

Collapse-free thermal bonding technique for large area microchambers in plastic lab-on-a-chip applications

Bonding is an essential step to form microchannels or microchambers in lab-on-a-chip applications. In this paper, we present a novel plastic thermal bonding technique to seal and form large area microchambers (planar characteristic width and length on the order of 1 mm and characteristic thickness on the order of 10–100 μm) without collapse by introducing a holed pressure equalizing plate (HPEP) that includes holes of the same size and shape as the microchambers. To demonstrate the proposed technique, two types of large area microchambers [(1) 20 × 10 mm and 40 μm thick and (2) 12 × 2.5 mm and 120 μm thick] with microchannels were designed and replicated on plastic substrates by means of hot embossing and injection molding processes with prepared two nickel mold inserts. The replicated large area microchambers as well as the microchannels in the plastic lab-on-a-chip were successfully sealed (i.e., no leakage) and formed without any collapse by the proposed thermal bonding technique with the help of the HPEP.