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81.
Min-Seok Park Vladislav P. Vislovskiy Jong-San Chang Yong-Gun Shul Jin S. Yoo Sang-Eon Park 《Catalysis Today》2003,87(1-4):205-212
Alumina-supported vanadium oxide, VOx/Al2O3, and binary vanadium–antimony oxides, VSbOx/Al2O3, have been tested in the ethylbenzene dehydrogenation with carbon dioxide and characterized by SBET, X-ray diffraction, X-ray photoelectron spectroscopy, hydrogen temperature-programmed reduction and CO2 pulse methods. VSbOx/Al2O3 exhibited enhanced catalytic activity and especially on-stream stability compared to VOx/Al2O3 catalyst. Incorporation of antimony into VOx/Al2O3 increased dispersion of active VOx species, enhanced redox properties of the systems and formed a new mixed vanadium–antimony oxide phase in the most catalytically efficient V0.43Sb0.57Ox/Al2O3 system. 相似文献
82.
Thirty-two consecutive patients with haematological disorders, in need of a permanent central venous catheter (CVC) were randomly allocated to have their CVC bandages (Tegaderm) changed once (OAW, n = 20) or twice (TAW, n = 19) a week. The two randomization arms were balanced in respect of age, sex, and underlying disease. The exit site of the CVC was inspected daily through the transparent bandage and erythema was noted. If severe erythema occurred, daily wet gauze dressings were applied. Samples for bacterial cultures were taken from the exit site of the CVC at every change of bandages. There was no difference in complications leading to removal of the CVC between the two groups (7/20 OAW vs. 7/19 TAW) or in CVC survival-time (P = 0.4). However, the OAW group had more positive CVC tip cultures (OAW 11/14 vs. TAW 2/9; P < 0.05) and a tendency to: (i) more extra dressings (P = 0.08); (ii) more cultures from the exit skin site showing high numbers of colony forming units (P = 0.07); (iii) shorter time to first exit site infection (P = 0.09); and (iv) more Gram-positive septicaemias (P = 0.08). Both clinical and bacteriological data in this study indicate that changing transparent polyurethane CVC bandages twice a week is superior to once a week. 相似文献
83.
A highly linear electrooptic modulator has been designed, fabricated, and evaluated. The design of this modulator consists of only a simple modification to the directional coupler. Two-tone testing has demonstrated that, for an optical modulation depth of 30% per channel, the third-order intermodulation distortion is more than 30 dB lower than that of the conventional directional coupler or Mach-Zehnder modulators. This improvement was not observed to be accompanied by any increase in second harmonic distortion. Also included are results of two-tone computer simulations which predict the improvement in linearity of this device for a range of modulation depths.<> 相似文献
84.
A design-for-testability scheme for detecting CMOS analog faults was reported by Favalli et al. (see ibid., vol.25, no.5, p.1239-46, 1990). The authors propose two alternative designs, one for small circuits and another for large circuits, which require significantly less area overhead (about 1/4 to 1/3) than that of Favalli's design. With the proposed modification in the first design, the untestable problem, which occurred in Favalli's design, can be alleviated. Furthermore, the proposed schemes are also fit to be implemented in VLSI circuits 相似文献
85.
86.
The authors derive and verify the concept of antenna focusing by a planar 'microstrip reflectarray' antenna. Experimental results from schematically distributed patch radiators with microstrip delay lines are consistent with the simulation results. The advantages and disadvantages of such an antenna are described. The measured overall antenna efficiency is approximately 48% at scan angles up to 30 degrees . These results demonstrate the feasibility of such an antenna.<> 相似文献
87.
Chang E.Y. Dean R. Proctor J. Elmer R. Pande K. 《Semiconductor Manufacturing, IEEE Transactions on》1991,4(1):66-68
A dicing process for GaAs MMIC (monolithic microwave integrated circuit) wafers using spin-on wax for wafer mounting and a hybrid process of wet chemical etching/mechanical sawing for chip dicing is described. This process minimizes ragged chip edges and reduces generation of microcracks in addition to the elimination of the plated gold burrs on the backside of the diced MMIC chips. This process gives a uniformity of -3 μm across a 2-in wafer following the completion of the whole backside process. This GaAs chip dicing technique is amenable to production because it exhibits both a very high chip yield (>90%) and nearly flawless edges 相似文献
88.
89.
Occlusion of large atrial septal defects with a centering buttoned device: early clinical experience
EB Sideris M Leung JH Yoon CR Chen R Lochan AM Worms C Rey B Meier 《Canadian Metallurgical Quarterly》1996,131(2):356-359
A feasibility clinical study was conducted for the transcatheter occlusion of large ostium secundum atrial septal defects with the centering buttoned device. The centering buttoned device is a modification of the regular buttoned device in which a centering counter-occluder is sutured at the central 40% portion of the occluder. During centering it is stretched, forming a parachute-shaped structure and pulling the occluder over the center of the defect. During buttoning, the counter-occluder forms a double figure eight, opposing the right atrial side of the atrial septum. Occlusion was performed in 12 patients aged 6 to 56 years. All had been rejected for transcatheter occlusion by the regular buttoned device, because of either their defect size or the lack of adequate septal rim. The defect size varied between 23 and 31 mm, and the device size varied between 45 and 60 mm. Nine had immediate effective occlusions of their defects and three residual shunts. One patient with unbuttoning had hemolysis at 2 weeks and underwent surgery. Early results of the transcatheter occlusion of large atrial septal defects are promising, and larger clinical trials are justified. 相似文献
90.