On the synergy between electrical and photonic switching

This article focuses on the values of electrical switching vs. photonic switching in the context of telecom transport networks. In particular, we show that the requirement of providing agility at the optical layer in the face of traffic forecast uncertainties is served better through photonic switching. On the other hand, some of the network-level functions, such as fast protection, subwavelength aggregation, and flexible client connectivity, require electrical switching. We further argue that additional values are achieved with hybrid photonic and electrical switching, which do not exist when either of these options is used in isolation.     

Bandpass filters with reconfigurable transmission zeros using varactor-tuned tapped stubs

In this letter, bandpass filters with one or two tunable transmission zeros are proposed. The reconfigurable transmission zeros are implemented through varactors in combination with tapped quarter-wavelength stubs. Based on mixed mode simulations including EM simulation and circuit simulation, the proposed filters were designed and fabricated on low-cost FR4 board. The measurement results verified the design concepts.     

Towards intelligent dressing

The aim of this article is to state the principles of an intelligent monitoring and control system for the grinding machine, comprising the dressing process as well as grinding stability.     

Self-oscillating dimmable electronic ballast

This paper presents a simple alternative for an electronic ballast operating in self-sustained oscillating mode with dimming capability for fluorescent lamps. A simple modification in one of the gate drivers side circuit allows the lamp to dim without compromising the simplicity, reliability, and low cost which characterize the self-oscillating electronic ballast (SOEB). A qualitative analysis is presented to explain the behavior of the proposed self-oscillating electronic ballast with dimming feature. In addition, the stability and the key equations for the design are derived using the extended Nyquist criterion and describing function method. Experimental results from two 40-W electronic ballasts are presented to demonstrate the performance and to validate the analysis carried out.     

Microchemical Engineering: Components,Plant Concepts User Acceptance – Part I

Over the last five years, many activities have focused on the unexploited field of carrying out reactions on small scales. Due to the rapid development of new components, this paper deals with recent developments only in a compressed form. An important point is the analysis of possible plant concepts for microreactors and whether these are a sensible option. Due to the enormous difference in size between the microchannels and the fluid periphera of possible components this is not just a technical question. It touches on the microtechnology concept as a whole. The direction in which the field should be developed and which measures can be taken to influence its development are questions that are addressed here with respect to the big industrial interest in microreactors.     

Changes in the gaseous H2S barrier properties of damaged silicate coated nylon 6 films

The damage imposed on SiO _x deposited nylon 6 films as a result of abrasion with a cotton cloth and Gelboflex testing was examined by evaluating the rate at which copper plates, which were enveloped by the damaged films, were corroded by H₂S. Abrasion with a cotton cloth caused some micro-cracking of the SiO _x layer and the permeation rate of H₂S approached that of the uncoated nylon 6 film. Damage to the SiO _x layer by twisting and crushing progressed gradually with the number of Gelboflex test cycles and correspondingly the corrosion rate of the copper plates increased. Comparison of the corrosion rates of the copper plates kept in the pouches made of various commercial films with those obtained for the damaged SiO _x deposited nylon 6 films showed a clear relationship between the H₂ permeation rate of the films and the corrosion rate of the copper plates by H₂S.